4Gb: x8, x16 Automotive DDR4 SDRAM
Features
Automotive DDR4 SDRAM
MT40A512M8
MT40A256M16
Features
•
•
•
•
•
V
DD
= V
DDQ
= 1.2V ±60mV
V
PP
= 2.5V –125mV/+250mV
On-die, internal, adjustable V
REFDQ
generation
1.2V pseudo open-drain I/O
Refresh maximum interval time at T
C
temperature
range:
– 64ms at –40°C to 85°C
– 32ms at 85°C to 95°C
– 16ms at 96°C to 105°C
– 8ms at 106°C to 125°C
16 internal banks ( x8): 4 groups of 4 banks each
8 internal banks (x16): 2 groups of 4 banks each
8n-bit prefetch architecture
Programmable data strobe preambles
Data strobe preamble training
Command/Address latency (CAL)
Multipurpose register read and write capability
Write leveling
Self refresh mode
Low-power auto self refresh (LPASR)
Temperature controlled refresh (TCR)
Fine granularity refresh
Self refresh abort
Maximum power saving
Output driver calibration
Nominal, park, and dynamic on-die termination
(ODT)
Data bus inversion (DBI) for data bus
Command/Address (CA) parity
Databus write cyclic redundancy check (CRC)
Per-DRAM addressability
Connectivity test
Hard post package repair (hPPR) and soft post
package repair (sPPR) modes
JEDEC JESD-79-4 compliant
AEC-Q100
• PPAP submission
Options
1
• Configuration
– 512 Meg x 8
– 256 Meg x 16
• BGA package (Pb-free) – x8
– 78-ball (9mm x 10.5mm) – Rev. B
– 78-ball (7.5mm x 11mm) – Rev. F
• FBGA package (Pb-free) – x16
– 96-ball (9mm x 14mm) – Rev. B
– 96-ball (7.5mm x 13.5mm) – Rev. F
• Timing – cycle time
– 0.625ns @ CL = 22 (DDR4-3200)
– 0.750ns @ CL = 18 (DDR4-2666)
– 0.833ns @ CL = 16 (DDR4-2400)
• Product certification
– Automotive
• Operating temperature
– Industrial (–40°C T
C
+95°C)
– Automotive (–40°C T
C
+105°C)
– Ultra-high (–40°C T
C
+125°C)
3
– Revision
Notes:
Marking
512M8
256M16
RH
SA
GE
LY
-062E
-075E
-083E
A
IT
AT
UT
:B :F
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
1. Not all options listed can be combined to
define an offered product. Use the part cat-
alog search on
http://www.micron.com
for
available offerings.
2. The ×4 device is not offered and the mode
is not supported by the x8 or x16 device
even though some ×4 mode descriptions ex-
ist in the datasheet.
3. The UT option use based on automotive us-
age model. Please contact Micron sales rep-
resentative if you have questions.
4. -062E is only available for die Rev. F.
5. The datasheet is preliminary revision for die
Rev. F.
CCMTD-1725822587-10418
4gb_auto_ddr4_sdram_z90b_z10B.pdf - Rev. H 01/19 EN
1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2016 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
4Gb: x8, x16 Automotive DDR4 SDRAM
Features
Table 1: Key Timing Parameters
Speed Grade
-062E
1
-075E
1
-083E
Note:
Data Rate (MT/s)
3200
2666
2400
Target CL-nRCD-nRP
22-22-22
18-18-18
16-16-16
t
AA
(ns)
t
RCD
(ns)
t
RP
(ns)
13.75
13.5
13.32
13.75
13.5
13.32
13.75
13.5
13.32
1. Refer to the Speed Bin Tables for backward compatibility
Table 2: Addressing
Parameter
Number of bank groups
Bank group address
Bank count per group
Bank address in bank group
Row addressing
Column addressing
Page size
1
Note:
512 Meg x 8
4
BG[1:0]
4
BA[1:0]
32K (A[14:0])
1K (A[9:0])
1KB
256 Meg x 16
2
BG0
4
BA[1:0]
32K (A[14:0])
1K (A[9:0])
2KB
1. Page size is per bank, calculated as follows:
Page size = 2
COLBITS
× ORG/8, where COLBIT = the number of column address bits and ORG = the number of
DQ bits.
CCMTD-1725822587-10418
4gb_auto_ddr4_sdram_z90b_z10B.pdf - Rev. H 01/19 EN
2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2016 Micron Technology, Inc. All rights reserved.
4Gb: x8, x16 Automotive DDR4 SDRAM
Features
Figure 1: Order Part Number Example
CCMTD-1725822587-10418
4gb_auto_ddr4_sdram_z90b_z10B.pdf - Rev. H 01/19 EN
3
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2016 Micron Technology, Inc. All rights reserved.
4Gb: x8, x16 Automotive DDR4 SDRAM
Features
Contents
Important Notes and Warnings .......................................................................................................................
General Notes and Description .......................................................................................................................
Description ................................................................................................................................................
Industrial Temperature ...............................................................................................................................
Automotive Temperature ............................................................................................................................
Ultra-high Temperature ..............................................................................................................................
General Notes ............................................................................................................................................
Definitions of the Device-Pin Signal Level ...................................................................................................
Definitions of the Bus Signal Level ...............................................................................................................
Functional Block Diagrams .............................................................................................................................
Ball Assignments ............................................................................................................................................
Ball Descriptions ............................................................................................................................................
Package Dimensions .......................................................................................................................................
State Diagram ................................................................................................................................................
Functional Description ...................................................................................................................................
RESET and Initialization Procedure .................................................................................................................
Power-Up and Initialization Sequence .........................................................................................................
RESET Initialization with Stable Power Sequence .........................................................................................
Uncontrolled Power-Down Sequence ..........................................................................................................
Programming Mode Registers .........................................................................................................................
Mode Register 0 ..............................................................................................................................................
Burst Length, Type, and Order .....................................................................................................................
CAS Latency ...............................................................................................................................................
Test Mode ..................................................................................................................................................
Write Recovery (WR)/READ-to-PRECHARGE ...............................................................................................
DLL RESET .................................................................................................................................................
Mode Register 1 ..............................................................................................................................................
DLL Enable/DLL Disable ............................................................................................................................
Output Driver Impedance Control ...............................................................................................................
ODT R
TT(NOM)
Values ..................................................................................................................................
Additive Latency .........................................................................................................................................
Rx CTLE Control .........................................................................................................................................
Write Leveling ............................................................................................................................................
Output Disable ...........................................................................................................................................
Termination Data Strobe .............................................................................................................................
Mode Register 2 ..............................................................................................................................................
CAS WRITE Latency ....................................................................................................................................
Low-Power Auto Self Refresh .......................................................................................................................
Dynamic ODT ............................................................................................................................................
Write Cyclic Redundancy Check Data Bus ....................................................................................................
Mode Register 3 ..............................................................................................................................................
Multipurpose Register ................................................................................................................................
WRITE Command Latency When CRC/DM is Enabled .................................................................................
Fine Granularity Refresh Mode ....................................................................................................................
Temperature Sensor Status .........................................................................................................................
Per-DRAM Addressability ...........................................................................................................................
Gear-Down Mode .......................................................................................................................................
Mode Register 4 ..............................................................................................................................................
Hard Post Package Repair Mode ..................................................................................................................
Soft Post Package Repair Mode ....................................................................................................................
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CCMTD-1725822587-10418
4gb_auto_ddr4_sdram_z90b_z10B.pdf - Rev. H 01/19 EN
4
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2016 Micron Technology, Inc. All rights reserved.
4Gb: x8, x16 Automotive DDR4 SDRAM
Features
WRITE Preamble ........................................................................................................................................ 59
READ Preamble .......................................................................................................................................... 59
READ Preamble Training ............................................................................................................................ 59
Temperature-Controlled Refresh ................................................................................................................. 59
Command Address Latency ........................................................................................................................ 59
Internal V
REF
Monitor ................................................................................................................................. 59
Maximum Power Savings Mode ................................................................................................................... 60
Mode Register 5 .............................................................................................................................................. 61
Data Bus Inversion ..................................................................................................................................... 62
Data Mask .................................................................................................................................................. 63
CA Parity Persistent Error Mode .................................................................................................................. 63
ODT Input Buffer for Power-Down .............................................................................................................. 63
CA Parity Error Status ................................................................................................................................. 63
CRC Error Status ......................................................................................................................................... 63
CA Parity Latency Mode .............................................................................................................................. 63
Mode Register 6 .............................................................................................................................................. 64
t
CCD_L Programming ................................................................................................................................. 65
V
REFDQ
Calibration Enable .......................................................................................................................... 65
V
REFDQ
Calibration Range ........................................................................................................................... 65
V
REFDQ
Calibration Value ............................................................................................................................ 66
Truth Tables ................................................................................................................................................... 67
NOP Command .............................................................................................................................................. 70
DESELECT Command .................................................................................................................................... 70
DLL-Off Mode ................................................................................................................................................ 70
DLL-On/Off Switching Procedures .................................................................................................................. 72
DLL Switch Sequence from DLL-On to DLL-Off ........................................................................................... 72
DLL-Off to DLL-On Procedure .................................................................................................................... 74
Input Clock Frequency Change ....................................................................................................................... 75
Write Leveling ................................................................................................................................................ 76
DRAM Setting for Write Leveling and DRAM TERMINATION Function in that Mode ..................................... 77
Procedure Description ................................................................................................................................ 78
Write Leveling Mode Exit ............................................................................................................................ 79
Command Address Latency ............................................................................................................................ 81
Low-Power Auto Self Refresh Mode ................................................................................................................. 86
Manual Self Refresh Mode .......................................................................................................................... 86
Multipurpose Register .................................................................................................................................... 88
MPR Reads ................................................................................................................................................. 89
MPR Readout Format ................................................................................................................................. 91
MPR Readout Serial Format ........................................................................................................................ 91
MPR Readout Parallel Format ..................................................................................................................... 92
MPR Readout Staggered Format .................................................................................................................. 93
MPR READ Waveforms ............................................................................................................................... 94
MPR Writes ................................................................................................................................................ 96
MPR WRITE Waveforms .............................................................................................................................. 97
MPR REFRESH Waveforms ......................................................................................................................... 98
Gear-Down Mode .......................................................................................................................................... 101
Maximum Power-Saving Mode ....................................................................................................................... 104
Maximum Power-Saving Mode Entry .......................................................................................................... 104
Maximum Power-Saving Mode Entry in PDA .............................................................................................. 105
CKE Transition During Maximum Power-Saving Mode ................................................................................ 105
Maximum Power-Saving Mode Exit ............................................................................................................ 105
Command/Address Parity .............................................................................................................................. 107
CCMTD-1725822587-10418
4gb_auto_ddr4_sdram_z90b_z10B.pdf - Rev. H 01/19 EN
5
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2016 Micron Technology, Inc. All rights reserved.
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