Gap Pad HC1000
®
July 2011
PRODUCT DESCRIPTION
“Gel-Like” Modulus Gap Filling Material
FEATURES AND BENEFITS
• Thermal conductivity: 1.0 W/m-K
• Highly conformable, low hardness
• “Gel-like” modulus
• Fiberglass reinforced for puncture,
shear and tear resistance
PROPERTY
Color
TYPICAL PROPERTIES OF GAP PAD HC1000
IMPERIAL VALUE
Gray
Fiberglass
0.010 to 0.020
2
1.6
1.0
25
40
-76 to 392
>5000
5.5
10
11
METRIC VALUE
Gray
Fiberglass
0.254 to 0.508
2
1.6
1.0
25
275
-60 to 200
>5000
5.5
10
11
TEST METHOD
Visual
—
ASTM D374
—
ASTM D792
ASTM E1269
ASTM D2240
ASTM D575
—
ASTM D149
ASTM D150
ASTM D257
U.L. 94
ASTM D5470
Reinforcement Carrier
Thickness (inch) / (mm)
Inherent Surface Tack (1 side)
Density (Bulk Rubber) (g/cc)
Heat Capacity (J/g-K)
Hardness (Bulk Rubber) (Shore 00) (1)
Young's Modulus (psi) / (kPa) (2)
Continuous Use Temp (°F) / (°C)
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
Dielectric Constant (1000 Hz)
Volume Resistivity (Ohm-meter)
Flame Rating
THERMAL
Thermal Conductivity (W/m-K)
THERMAL PERFORMANCE vs. STRAIN
V-O
1.0
V-O
1.0
10
1.30
Gap Pad
®
HC 1000 is an extremely
conformable, low-modulus polymer that
acts as a thermal interface and electrical
insulator between electronic components
and heat sinks.The “gel-like” modulus
allows this material to fill air gaps to
enhance the thermal performance of
electronic systems. Gap Pad
®
HC1000 is
offered with removable protective liners
on both sides of the material.
Note: To build a part number, visit our
website at www.bergquistcompany.com.
Thickness vs. Thermal Resistance
Gap Pad HC1000
Deflection (% strain)
Thermal Impedance (°C-in
2
/W) 0.020" (3)
20
1.00
30
0.96
1) Thir ty second delay value Shore 00 hardness scale. 2)Young’s Modulus, calculated using 0.01 in/min. step rate of strain
with a sample size of 0.79 inch
2
. 3) The ASTM D5470 test fixture was used. The recorded value includes interfacial ther-
mal resistance. These values are provided for reference only. Actual application performance is directly related to the
surface roughness, flatness and pressure applied.
TYPICAL APPLICATIONS INCLUDE
• Computer and peripherals
• Telecommunications
• Heat interfaces to frames, chassis or other heat spreading devices
• RDRAM™ memory modules/chip scale packages
• CDROM/DVD cooling
• Areas where irregular surfaces need to make a thermal interface to a heat sink
• DDR SDRAM memory modules
• FBDIMM modules
CONFIGURATIONS AVAILABLE
• Sheet form, die-cut parts, and roll form (converted or unconverted)
Resultant Thickness (mils)
20
18
16
14
12
10
0.25
0.30 0.35 0.40 0.45 0.50
Thermal Resistance (C-in
2
/W)
0.55
PDS_GP_HC1000_0711
TDS Gap Pad
®
HC1000, July 2011
Disclaimer
Note:
The information provided in this Technical Data Sheet (TDS) including the
recommendations for use and application of the product are based on our
knowledge and experience of the product as at the date of this TDS. The product
can have a variety of different applications as well as differing application and
working conditions in your environment that are beyond our control. Henkel is,
therefore, not liable for the suitability of our product for the production processes
and conditions in respect of which you use them, as well as the intended
applications and results. We strongly recommend that you carry out your own
prior trials to confirm such suitability of our product.
Any liability in respect of the information in the Technical Data Sheet or any other
written or oral recommendation(s) regarding the concerned product is excluded,
except if otherwise explicitly agreed and except in relation to death or personal
injury caused by our negligence and any liability under any applicable mandatory
product liability law.
In
case products are delivered by Henkel Belgium NV, Henkel Electronic
Materials NV, Henkel Nederland BV, Henkel Technologies France SAS and
Henkel France SA please additionally note the following:
In case Henkel would be nevertheless held liable, on whatever legal ground,
Henkel’s liability will in no event exceed the amount of the concerned delivery.
In case products are delivered by Henkel Colombiana, S.A.S. the following
disclaimer is applicable:
The information provided in this Technical Data Sheet (TDS) including the
recommendations for use and application of the product are based on our
knowledge and experience of the product as at the date of this TDS. Henkel is,
therefore, not liable for the suitability of our product for the production processes
and conditions in respect of which you use them, as well as the intended
applications and results. We strongly recommend that you carry out your own
prior trials to confirm such suitability of our product.
Any liability in respect of the information in the Technical Data Sheet or any other
written or oral recommendation(s) regarding the concerned product is excluded,
except if otherwise explicitly agreed and except in relation to death or personal
injury caused by our negligence and any liability under any applicable mandatory
product liability law.
In case products are delivered by Henkel Corporation, Resin Technology
Group, Inc., or Henkel Canada Corporation, the following disclaimer is
applicable:
The data contained herein are furnished for information only and are believed to
be reliable. We cannot assume responsibility for the results obtained by others
over whose methods we have no control. It is the user’s responsibility to
determine suitability for the user’s purpose of any production methods mentioned
herein and to adopt such precautions as may be advisable for the protection of
property and of persons against any hazards that may be involved in the handling
and use thereof. In light of the foregoing,
Henkel Corporation specifically
disclaims all warranties expressed or implied, including warranties of
merchantability or fitness for a particular purpose, arising from sale or use
of Henkel Corporation’s products. Henkel Corporation specifically
disclaims any liability for consequential or incidental damages of any kind,
including lost profits.
The discussion herein of various processes or
compositions is not to be interpreted as representation that they are free from
domination of patents owned by others or as a license under any Henkel
Corporation patents that may cover such processes or compositions. We
recommend that each prospective user test his proposed application before
repetitive use, using this data as a guide. This product may be covered by one or
more United States or foreign patents or patent applications.
Trademark usage
Except as otherwise noted, all trademarks in this document are trademarks of
Henkel Corporation in the U.S. and elsewhere. ® denotes a trademark
registered in the U.S. Patent and Trademark Office
Reference 0.1
Americas
+1.800.347.4572
Europe
+31.35.5380684
For the most direct access to local sales and technical support visit: www.bergquistcompany.com
Asia
+852.2690.9296
京公网安备 11010802033920号
EEWORLD
