Platinum Temperature Sensor in Thin Film Technology
SMD 0805-FC
The main application emphasis of the SMD 805-FC is hybrid circuits. Mass production, precision, long-term stability and
low costs are also key themes of the design. The contact surfaces are on the side with the active measuring layer – no
edge metallising, i. e. the sensor is designed for face-down mounting, to take into account current trends in the ‘adhesion
instead of soldering’ electronics sector. Using conductive adhesives provides reliable and cost-effective connection
technology, an alternative to the conventional application opportunities, such as reflow or wave soldering. An important
advantage for users: the substrate material of the sensor (ceramic) shows a similar thermal expansion to that of the hybrid
circuit.
Nominal Resistance R
0
Tolerance
Order No.
100 Ohm at 0°
C
500 Ohm at 0°
C
1000 Ohm at 0°
C
Specification
Tolerance
Temperature range
Temperature coefficient
Contact
Long-term stability
Ambient conditions
Insulation resistance
Measuring current
DIN EN 60751, class B
DIN EN 60751, class 2B
DIN EN 60751, class B
DIN EN 60751, class 2B
DIN EN 60751, class B
DIN EN 60751, class 2B
DIN EN 60751
32 208 594
32 208 595
32 208 598
32 208 599
32 208 569
32 208 570
Class B (R
0
: ± 0.12 %), Class 2B (R
0
: ± 0.24 %)
-50 ° to 170 °C
C
TCR = 3850 ppm/K
AgPd metallising in thick-film technology
C
R
0
drift
≤
0.06 % after 1000 h at 170°
Use unprotected only in dry environments
> 100 MΩ at 20° > 2 MΩ at 170° (glass cover)
C;
C
100
Ω:
0.3 to 1.0 mA
500
Ω:
0.1 to 0.7 mA
1000
Ω:
0.1 to 0.3 mA
(self heating has to be considered)
0.8 K/mW at 0°
C
Flowing water (v = 0.4 m/s): t
0.5
= 0.10 s, t
0.9
= 0.25 s
Air flow (v = 2 m/s): t
0.5
= 2.5 s, t
0.9
= 8.0 s
- Reflow soldering or wave soldering, e.g. double wave soldering < 8 s / 235°
- Also can be mounted using SMD insertion machines with Ag conductive adhesive.
- When mounting PCB circuits, the expansion relationship of the sensor and the
substrate material must be taken into account.
Stored in a nitrogen atmosphere, min. 9 months
„Face-down“ in blister reel, 4000 pcs / reel
Other tolerances and values of resistance are available on request.
Self heating
Reaction time
Processing information
Storage life
Packaging
Note
We reserve the right to make alterations and technical data printed. All technical data serves as a guideline and does not guarantee particular
properties to any products.
Heraeus Sensor Technology USA
770 Township Line Road, Suite 300
Yardley, PA 19067 USA
Phone 1-215-944-9010 Fax 1-215-944-9392
Email info.hst-us@heraeus.com
www.hst-us.com
Status: HST
USA
10/09
06/2016
PCB Design
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