|
5962-9324803MXA |
5962-9324802MXA |
5962-9324802MYA |
5962-9324803MYA |
| Description |
UV PLD, 40ns, CMOS, CQCC68, WINDOWED, CERAMIC, JLCC-68 |
UV PLD, 40ns, CMOS, CQCC68, WINDOWED, CERAMIC, JLCC-68 |
UV PLD, 40ns, CMOS, CPGA68, WINDOWED, CERAMIC, PGA-68 |
UV PLD, 40ns, CMOS, CPGA68, WINDOWED, CERAMIC, PGA-68 |
| Parts packaging code |
LCC |
LCC |
PGA |
PGA |
| package instruction |
WQCCJ, |
WQCCJ, |
WPGA, |
WPGA, |
| Contacts |
68 |
68 |
68 |
68 |
| Reach Compliance Code |
unknown |
unknow |
unknown |
unknown |
| ECCN code |
3A001.A.2.C |
3A001.A.2.C |
3A001.A.2.C |
3A001.A.2.C |
| Other features |
52 MACROCELLS; BURIED MACROCELLS |
52 MACROCELLS; BURIED MACROCELLS |
52 MACROCELLS; BURIED MACROCELLS |
52 MACROCELLS; BURIED MACROCELLS |
| maximum clock frequency |
25 MHz |
25 MHz |
25 MHz |
25 MHz |
| JESD-30 code |
S-CQCC-J68 |
S-CQCC-J68 |
S-CPGA-P68 |
S-CPGA-P68 |
| JESD-609 code |
e0 |
e0 |
e0 |
e0 |
| length |
24.15 mm |
24.15 mm |
29.464 mm |
29.464 mm |
| Dedicated input times |
8 |
8 |
8 |
8 |
| Number of I/O lines |
52 |
52 |
52 |
52 |
| Number of terminals |
68 |
68 |
68 |
68 |
| Maximum operating temperature |
125 °C |
125 °C |
125 °C |
125 °C |
| Minimum operating temperature |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
| organize |
8 DEDICATED INPUTS, 52 I/O |
8 DEDICATED INPUTS, 52 I/O |
8 DEDICATED INPUTS, 52 I/O |
8 DEDICATED INPUTS, 52 I/O |
| Output function |
MACROCELL |
MACROCELL |
MACROCELL |
MACROCELL |
| Package body material |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
| encapsulated code |
WQCCJ |
WQCCJ |
WPGA |
WPGA |
| Package shape |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
| Package form |
CHIP CARRIER, WINDOW |
CHIP CARRIER, WINDOW |
GRID ARRAY, WINDOW |
GRID ARRAY, WINDOW |
| Programmable logic type |
UV PLD |
UV PLD |
UV PLD |
UV PLD |
| propagation delay |
40 ns |
40 ns |
40 ns |
40 ns |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Filter level |
MIL-STD-883 |
MIL-STD-883 |
MIL-STD-883 |
MIL-STD-883 |
| Maximum seat height |
5.08 mm |
5.08 mm |
5.08 mm |
5.08 mm |
| Maximum supply voltage |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
| Minimum supply voltage |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
| Nominal supply voltage |
5 V |
5 V |
5 V |
5 V |
| surface mount |
YES |
YES |
NO |
NO |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
| Terminal surface |
TIN LEAD |
TIN LEAD |
TIN LEAD |
TIN LEAD |
| Terminal form |
J BEND |
J BEND |
PIN/PEG |
PIN/PEG |
| Terminal pitch |
1.27 mm |
1.27 mm |
2.54 mm |
2.54 mm |
| Terminal location |
QUAD |
QUAD |
PERPENDICULAR |
PERPENDICULAR |
| width |
24.15 mm |
24.15 mm |
29.464 mm |
29.464 mm |
| Maker |
Atmel (Microchip) |
- |
Atmel (Microchip) |
Atmel (Microchip) |
| Base Number Matches |
1 |
1 |
1 |
- |