IC DUAL, PARALLEL, WORD INPUT LOADING, 0.45 us SETTLING TIME, 12-BIT DAC, CQCC24, CERAMIC, LCC-24, Digital to Analog Converter
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | ADI |
| Parts packaging code | LCC |
| package instruction | CERAMIC, LCC-24 |
| Contacts | 24 |
| Reach Compliance Code | not_compliant |
| ECCN code | 3A001.A.2.C |
| Is Samacsys | N |
| Converter type | D/A CONVERTER |
| Enter bit code | BINARY, OFFSET BINARY |
| Input format | PARALLEL, WORD |
| JESD-30 code | R-CQCC-N24 |
| JESD-609 code | e0 |
| Maximum linear error (EL) | 0.0244% |
| Number of digits | 12 |
| Number of functions | 2 |
| Number of terminals | 24 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | QCCN |
| Encapsulate equivalent code | LCC28,.45SQ |
| Package shape | RECTANGULAR |
| Package form | CHIP CARRIER |
| Peak Reflow Temperature (Celsius) | 220 |
| power supply | 5/15 V |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 |
| Maximum stabilization time | 1 µs |
| Nominal settling time (tstl) | 0.45 µs |
| Maximum slew rate | 2 mA |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | 30 |
| Base Number Matches | 1 |
| DAC8221BTC/883C | DAC8221AW/883B | DAC8221GBC | DAC8221BIEW | DAC8221BIFW | DAC8221BIHP | |
|---|---|---|---|---|---|---|
| Description | IC DUAL, PARALLEL, WORD INPUT LOADING, 0.45 us SETTLING TIME, 12-BIT DAC, CQCC24, CERAMIC, LCC-24, Digital to Analog Converter | IC DUAL, PARALLEL, WORD INPUT LOADING, 0.45 us SETTLING TIME, 12-BIT DAC, CDIP24, 0.300 INCH, CERDIP-24, Digital to Analog Converter | IC PARALLEL, WORD INPUT LOADING, 0.45 us SETTLING TIME, 12-BIT DAC, UUC24, 0.124 X 0.132 INCH, DIE-24, Digital to Analog Converter | IC PARALLEL, WORD INPUT LOADING, 0.45 us SETTLING TIME, 12-BIT DAC, CDIP24, 0.300 INCH, CERDIP-24, Digital to Analog Converter | IC PARALLEL, WORD INPUT LOADING, 0.45 us SETTLING TIME, 12-BIT DAC, CDIP24, 0.300 INCH, CERDIP-24, Digital to Analog Converter | IC PARALLEL, WORD INPUT LOADING, 0.45 us SETTLING TIME, 12-BIT DAC, PDIP24, PLASTIC, DIP-24, Digital to Analog Converter |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Parts packaging code | LCC | DIP | DIE | DIP | DIP | DIP |
| package instruction | CERAMIC, LCC-24 | 0.300 INCH, CERDIP-24 | 0.124 X 0.132 INCH, DIE-24 | 0.300 INCH, CERDIP-24 | 0.300 INCH, CERDIP-24 | PLASTIC, DIP-24 |
| Contacts | 24 | 24 | 24 | 24 | 24 | 24 |
| Reach Compliance Code | not_compliant | compliant | unknown | compliant | compliant | compliant |
| Converter type | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
| Enter bit code | BINARY, OFFSET BINARY | BINARY | OFFSET BINARY | OFFSET BINARY | OFFSET BINARY | OFFSET BINARY |
| Input format | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
| JESD-30 code | R-CQCC-N24 | R-GDIP-T24 | R-XUUC-N24 | R-GDIP-T24 | R-GDIP-T24 | R-PDIP-T24 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| Maximum linear error (EL) | 0.0244% | 0.0122% | 0.0244% | 0.0122% | 0.0244% | 0.0244% |
| Number of digits | 12 | 12 | 12 | 12 | 12 | 12 |
| Number of functions | 2 | 2 | 1 | 1 | 1 | 1 |
| Number of terminals | 24 | 24 | 24 | 24 | 24 | 24 |
| Maximum operating temperature | 125 °C | 125 °C | 85 °C | 85 °C | 85 °C | 70 °C |
| Minimum operating temperature | -55 °C | -55 °C | -40 °C | -40 °C | -40 °C | - |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | UNSPECIFIED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| encapsulated code | QCCN | DIP | DIE | DIP | DIP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | CHIP CARRIER | IN-LINE | UNCASED CHIP | IN-LINE | IN-LINE | IN-LINE |
| Peak Reflow Temperature (Celsius) | 220 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal settling time (tstl) | 0.45 µs | 0.45 µs | 0.45 µs | 0.45 µs | 0.45 µs | 0.45 µs |
| surface mount | YES | NO | YES | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| Terminal form | NO LEAD | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal location | QUAD | DUAL | UPPER | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | 30 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Maker | ADI | ADI | ADI | - | ADI | ADI |
| Nominal supply voltage | 5 V | - | 5 V | 5 V | 5 V | 5 V |
| Terminal pitch | 1.27 mm | 2.54 mm | - | 2.54 mm | 2.54 mm | 2.54 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | - | - |
| Maximum seat height | - | 5.08 mm | - | 5.715 mm | 5.715 mm | 5.33 mm |
| width | - | 7.62 mm | - | 7.62 mm | 7.62 mm | 7.62 mm |