IrDA
®
Data 1.2 Compliant
115.2 Kb/s Infrared Transceiver
Technical Data
HSDL-3200
Features
• Fully Compliant to IrDA
Data 1.2 Low Power
Specifications
• Ultra Small Package
• Minimal Height: 2.5 mm
• 2.7 to 3.6 V
CC
• Low Shutdown Current
– 10 nA Typical
• Complete Shutdown
– TXD, RXD, PIN Diode
• Three External Components
• Temperature Performance
Guaranteed, –25˚C to +85˚C
• 25 mA LED Drive Current
• Integrated EMI Shield
• IEC825-1 Class 1 Eye Safe
• Edge Detection Input
– Prevents the LED from
Long Turn-On Time
Description
The HSDL-3200 is a new
generation of low-cost Infrared
(IR) transceiver module from
Agilent Technologies. It features
the smallest footprint in the
industry at 2.5 H x 8.0 W x 3.0 D
mm. The supply voltage can
range from 2.7 V to 3.6 V. The
LED drive current of 25 mA
assures that link distances meet
the IrDA Data 1.2 (low power)
physical layer specification.
The HSDL-3200 meets the link
distance of 20 cm to other low
power devices, and 30 cm to
standard 1 meter IrDA devices.
V
CC
R1
47
Ω
8 LEDA
LED
DRIVER
Applications
• Mobile Telecom
– Cellular Phones
– Pagers
– Smart Phones
• Data Communication
– PDAs
– Portable Printers
• Digital Imaging
– Digital Cameras
– Photo-Imaging Printers
• Electronic Wallet
TXD
7 TXD
RXD
SHUT DOWN
6 RXD
5 SD
SHIELD
4 AGND
V
CC
C1
6.8 µF
3
2
C2
100 nF
V
CC
CX
RIX PULSE
SHAPER
1 GND
2
I/O Pins Configuration Table
Pin
1
2
3
4
5
6
7
8
Description
Ground
Pin Bypass Capacitor
Supply Voltage
Analog Ground
Shut Down
Receiver Data Output
Transmitter Data Input
LED Anode
Symbol
GND
CX
V
CC
AGND
SD
RXD
TXD
LEDA
High
Low
High
1
Active
Note
Note:
1. The shutdown pin (SD) must be driven either high or low. Do NOT float the pin.
Transceiver I/O Truth Table
Inputs
TXD
High
Low
Low
Don’t Care
Light Input to Receiver
Don’t Care
High
Low
Don’t Care
SD
Low
Low
Low
High
LED
On
Off
Off
Off
Outputs
RXD
Not Valid
Low
High
High
2, 3
Notes
Notes:
2. In-Band IrDA signals and data rates
≤
115.2 Kb/s.
3. RXD Logic Low is a pulsed response. The condition is maintained for a duration dependent on pattern and strength of the incident
intensity.
Recommended Application Circuit Components
Component
R1
C1
C2
Recommended Value
47
Ω, ±
1%, 0.125 Watt
6.8
µF, ±
20%, Tantalum
100 nF,
±
20%, X7R Ceramic
4
Note
Note:
4. C1 must be placed within 0.7 cm of the HSDL-3200 to obtain optimum noise
immunity.
Caution: The BiCMOS inherent to this design of this component increases the component’s
susceptibility to damage from electrostatic discharge (ESD). It is advised that normal static
precautions be taken in handling and assembly of this component to prevent damage and/or
degradation which may be induced by ESD.
3
Absolute Maximum Ratings
Parameter
Storage Temperature
Operating Temperature
DC LED Current
Peak LED Current
LED Anode Voltage
Supply Voltage
Input Voltage TXD, SD
Output Voltage RXD
For implementations where case to ambient thermal resistance
≤
50˚C/W.
Symbol
T
S
T
A
I
LED
(DC)
I
LED
(PK)
V
LEDA
V
CC
V
I
V
O
Min.
–40
–25
Max.
100
85
20
80
Units
˚C
˚C
mA
mA
V
V
V
V
Conditions
≤
90
µs
Pulse Width,
≤
25% Duty Cycle
–0.5
0
0
–0.5
7
7
V
CC
+0.5
V
CC
+0.5
Recommended Operating Conditions
Parameter
Operating Temperature
Supply Voltage
Logic High Voltage
TXD, SD
Logic Low Voltage
TXD, SD
Logic High Receiver
Input Irradiance
Logic Low Receiver
Input Irradiance
LED Current Pulse
Amplitude
Receiver Signal Rate
Ambient Light
Symbol
T
A
V
CC
V
IH
V
IL
EI
H
EI
L
I
LEDA
25
2.4
Min.
–25
2.7
2/3 V
CC
0
0.0081
Max.
85
3.6
V
CC
1/3 V
CC
500
0.3
80
115.2
Units
˚C
V
V
V
mW/cm
2
µW/cm
2
mA
Kb/s
See “Test Methods”
on page 12 for
details
For in-band signals.
For in-band signals.
Guaranteed at 25˚C
5
5
Conditions
Notes
Note:
5. An in-band optical signal is a pulse/sequence where the peak wavelength,
λp,
is defined as 850 nm
≤ λp ≤
900 nm, and the pulse
characteristics are compliant with the IrDA Serial Infrared Physical Layer Link Specification.
4
Electrical and Optical Specifications
Specifications hold over the recommended operating conditions unless otherwise noted. Unspecified test
conditions can be anywhere in their operating range. All typical values are at 25˚C and 3.0 V unless
otherwise noted.
Parameter
Receiver
RXD
Output Voltage
Logic Low
Logic High
Viewing Angle
Peak Sensitivity Wavelength
RXD Pulse Width
RXD Rise and Fall Times
Receiver Latency Time
Receiver Wake Up Time
Transmitter
Radiant Intensity
Peak Wavelength
Spectral Line Half Width
Viewing Angle
Optical Pulse Width
Optical Rise and Fall Times
Maximum Optical
Pulse Width
LED Anode On State
Voltage
LED Anode Off State
Leakage
Transceiver
TXD and
SD Input
Current
Supply Current
Logic Low
Logic High
Shutdown
Idle
Active
Receiver
I
L
I
H
I
CC1
I
CC2
I
CC3
–1
–0.01
0.01
10
2.5
2.6
1
1
200
4
5
µA
µA
nA
mA
mA
0
≤
V
I
≤
1/3 V
CC
V
I
≥
2/3 V
CC
V
CC
= 3.6 V, V
SD
≥
V
CC
–0.5
V
CC
= 3.6 V,
V
I
(TXD)
≤
1/3 V
CC
, EI = 0
V
CC
= 3.6 V,
V
I
(TXD)
≤
1/3 V
CC
8, 9
EI
H
λp
∆λ
1/2
2θ
1/2
tpw
tr (EI)
tf (EI)
tpw
(max)
V
ON
(LEDA)
I
LK
(LEDA)
0.01
20
30
1.5
1.6
4
8
875
35
60
2
600
50
1.6
1.0
28.8 mW/Sr I
LEDA
= 25 mA, T
A
= 25˚C,
θ
1/2
≤
15˚
nm
nm
˚
µs
ns
µs
V
µA
tpw (TXD) = 1.6
µs
tpw (TXD) = 1.6
µs
TXD pin stuck high
I
LEDA
= 25 mA,
V
IH
(TXD) = 2.7 V
V
LEDA
= V
CC
= 3.6 V,
V
I
(TXD)
≤
1/3 V
CC
V
OL
V
OH
2φ
1/2
λp
tpw
tr, tf
t
L
t
W
1.5
0
V
CC
–0.2
30
880
2.5
25
25
50
4.0
100
50
100
0.4
V
CC
V
V
˚
nm
µs
ns
µs
µs
tpw (EI) = 1.6
µs,
C
L
= 10 pF
6
7
6
I
OL
= 200
µA,
For in-band EI
I
OH
= –200
µA,
For in-band
EI
≤
0.3
µW/cm
2
6
Symbol
Min.
Typ.
Max. Units
Conditions
Note
Notes:
6. For in-band signals
≤
115.2 Kb/s where 8.1
µW/cm
2
≤
EI
≤
500 mW/cm
2
.
7. Wake up time is measured from SD pin high to low transition or V
CC
power on to valid RXD output.
8. Typical value is at EI = 10 mW/cm
2
.
9. Maximum value is at EI = 500 mW/cm
2
.
5
Package Outline with Dimensions for Recommended PC Board Pad Layout
1.35
EXTERNAL GROUND
MOUNTING
CENTER
SOLDERING PATTERN
C
L
MOUNTING
EXTERNAL
1.35
CENTER
GROUND
C
L
1.25
MOUNTING
CENTER
4
1.025
2.05
1.425
0.775
0.775
1.25
1.75
1.75
0.6
0.60
RECEIVER
2.05
C
L
EMITTER
0.475
0.475
1.425
1.425
2.375
UNIT: mm
2.375
3.325
TOLERANCE ± 0.2 mm
3.325
2.2
1.175
2.85
1.05
1.25
2.55
4
8
2.5
0.35
0.65
0.80
C
L
8
7
6
5
4
3
2
1
0.6
3
1.85
2.9
3.325
P0.95X7 = 6.65
1
GND
2
CX
3
V
CC
4
AGND
5
SD
6
RXD
7
TXD
8
LEDA
UNIT: mm
TOLERANCE: ± 0.2mm
Tape and Reel Dimensions
TAPE DIMENSIONS
UNIT: mm
4 ± 0.1
+ 0.1
∅1.5
0
POLARITY
PIN 8: LEDA
8.4 ± 0.1
2.0 ± 0.5
∅13.0
± 0.5
R1.0
A
21 ± 0.8
B
0.4 ± 0.05
2.8 ± 0.1
8 ± 0.1
PROGRESSIVE DIRECTION
PIN 1: GND
3.4 ± 0.1
1.75 ± 0.1
1.5 ± 0.1
7.5 ± 0.1
16.0 ± 0.2
EMPTY
LABEL
(40 mm MIN.)
PARTS MOUNTED
LEADER
(400 mm MIN.)
EMPTY
(40 mm MIN.)
2
16.4 + 0
2 ± 0.5
OPTION #
0S1
0L1
DIMENSION A
(± 1 mm)
178
330
DIMENSION B
(± 2 mm)
60
80
QUANTITY
(POS/REEL)
500
2500
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