54LS114AM/B2CJC datasheet, PDF

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54LS114AM/B2CJC: DescriptionIC,FLIP-FLOP,DUAL,J/K TYPE,LS-TTL,LLCC,20PIN,CERAMIC; Categorylogic; File Size241KB，5 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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54LS114AM/B2CJC Overview

IC,FLIP-FLOP,DUAL,J/K TYPE,LS-TTL,LLCC,20PIN,CERAMIC

54LS114AM/B2CJC Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	NXP
package instruction	QCCN, LCC20,.35SQ
Reach Compliance Code	unknown
Is Samacsys	N
JESD-30 code	S-XQCC-N20
JESD-609 code	e0
Logic integrated circuit type	J-K FLIP-FLOP
Number of functions	2
Number of terminals	20
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	QCCN
Encapsulate equivalent code	LCC20,.35SQ
Package shape	SQUARE
Package form	CHIP CARRIER
power supply	5 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	TTL
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
Trigger type	NEGATIVE EDGE
Base Number Matches	1

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54LS114AM/B2CJC Related Products

	54LS114AM/B2CJC	54LS114AM/B2AJC	54LS114A/B2AJC	54LS114A/BDBJC
Description	IC,FLIP-FLOP,DUAL,J/K TYPE,LS-TTL,LLCC,20PIN,CERAMIC	IC,FLIP-FLOP,DUAL,J/K TYPE,LS-TTL,LLCC,20PIN,CERAMIC	IC,FLIP-FLOP,DUAL,J/K TYPE,LS-TTL,LLCC,20PIN,CERAMIC	IC,FLIP-FLOP,DUAL,J/K TYPE,LS-TTL,FP,14PIN,CERAMIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Maker	NXP	NXP	NXP	NXP
package instruction	QCCN, LCC20,.35SQ	QCCN, LCC20,.35SQ	QCCN, LCC20,.35SQ	DFP, FL14,.3
Reach Compliance Code	unknown	unknown	unknown	unknown
JESD-30 code	S-XQCC-N20	S-XQCC-N20	S-XQCC-N20	R-XDFP-F14
JESD-609 code	e0	e0	e0	e0
Logic integrated circuit type	J-K FLIP-FLOP	J-K FLIP-FLOP	J-K FLIP-FLOP	J-K FLIP-FLOP
Number of functions	2	2	2	2
Number of terminals	20	20	20	14
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	QCCN	QCCN	QCCN	DFP
Encapsulate equivalent code	LCC20,.35SQ	LCC20,.35SQ	LCC20,.35SQ	FL14,.3
Package shape	SQUARE	SQUARE	SQUARE	RECTANGULAR
Package form	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	FLATPACK
power supply	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Filter level	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES
technology	TTL	TTL	TTL	TTL
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD	NO LEAD	NO LEAD	FLAT
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	QUAD	QUAD	QUAD	DUAL
Trigger type	NEGATIVE EDGE	NEGATIVE EDGE	NEGATIVE EDGE	NEGATIVE EDGE
Base Number Matches	1	1	1	1

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