IGLOOe Handbook
Table of Contents
Low-Power Flash Device Handbooks Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . i
Section I – IGLOOe Datasheet
IGLOOe Low-Power Flash FPGAs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
IGLOOe Device Family Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-1
IGLOOe DC and Switching Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2-1
Package Pin Assignments. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-1
Section II – User’s Guide
Low-Power Flash Technology and Flash*Freeze Mode
FPGA Array Architecture in Low-Power Flash Devices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-1
Actel’s Flash*Freeze Technology and Low-Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2-1
Global Resources and Clock Conditioning
Global Resources in Actel Low-Power Flash Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-1
Clock Conditioning Circuits in Low-Power Flash Devices and Mixed-Signal FPGAs . . . . . . . . . . . . . . .4-1
Embedded Memories
FlashROM in Actel’s Low-Power Flash Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-1
SRAM and FIFO Memories in Actel's Low-Power Flash Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-1
I/O Descriptions and Usage
I/O Structures in IGLOOe and ProASIC3E Devices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7-1
I/O Software Control in Low-Power Flash Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8-1
DDR for Actel’s Low-Power Flash Devices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9-1
Packaging and Pin Descriptions
Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-1
Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11-1
Programming and Security
Programming Flash Devices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12-1
Security in Low-Power Flash Devices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13-1
In-System Programming (ISP) of Actel’s Low-Power Flash Devices Using FlashPro3 . . . . . . . . . . . . .14-1
Core Voltage Switching Circuit for IGLOO and ProASIC3L In-System Programming . . . . . . . . . . . . .15-1
Microprocessor Programming of Actel’s Low-Power Flash Devices . . . . . . . . . . . . . . . . . . . . . . . . . .16-1
Low-Power Flash Device Handbooks Introduction
Device Handbooks contain all the information available to help designers understand and use
Actel's devices. Handbook chapters are grouped into sections on the website to simplify
navigation. Each chapter of the handbook can be viewed as an individual PDF file.
At the top of the handbook web page, you will see a PDF file for each product family. This file
contains the complete device handbook. Please register for product updates to be notified when a
section of the handbook changes.
Table 1 •
Differences between Former Datasheets and Device Handbooks
Description of Change
Comparison between Handbook and Datasheet
The silicon datasheet in the handbook The former version of the silicon datasheet contained the following:
does not contain the same chapters as • General Description
the previous versions of the datasheets.
• Device Architecture
•
•
•
•
•
DC and Switching Characteristics
Packaging
Product Brief (same information as the General Description)
DC and Switching Characteristics
Packaging
The current datasheet now contains:
The information previously contained in the Device Architecture
chapter has been separated into individual chapters and merged
with relevant application note content to provide one location for
information on each architectural feature.
The Device Architecture section still exists in the Fusion Handbook
only
.
The General Description section no The Product Brief and the General Description consisted of basically
longer exists in datasheets.
the same information but with different titles. To eliminate the
duplicated information, we changed the document name to Product
Brief.
Change tables were carried forward
through this process; they contain
information from the old datasheets
and the new datasheets.
Version numbers were restarted.
It is important that all earlier technical changes from the datasheets
are listed so customers can determine if any of the changes affect
their designs. Changes are listed chronologically, with the most
current at the top and the earlier changes listed below them.
The version numbers were restarted when the handbooks were
created. For example, a datasheet may have been v2.1 and is now
v1.0. The category (i.e., advance or production) of the datasheet did
not change. The only change occurred to the actual numbering of
the datasheet. All version numbers are located in the footer of the
page.
The publication date indicates when the document was published
and posted to the Actel website.
Publication date
The former datasheets were two We changed the datasheet format to accommodate the large
columns and the current datasheets and graphics and to improve readability.
handbooks are formatted with one
column.
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