Serial I/O Controller, 1 Channel(s), 0.0762939453125MBps, CMOS, PDIP40, PLASTIC, DIP-40
| Parameter Name | Attribute value |
| Maker | SAMSUNG |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 40 |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| Address bus width | 3 |
| boundary scan | NO |
| letter of agreement | ASYNC, BIT |
| Data encoding/decoding methods | NRZ |
| Maximum data transfer rate | 0.0762939453125 MBps |
| External data bus width | 8 |
| JESD-30 code | R-PDIP-T40 |
| length | 52.07 mm |
| low power mode | YES |
| Number of DMA channels | |
| Number of I/O lines | |
| Number of serial I/Os | 1 |
| Number of terminals | 40 |
| On-chip data RAM width | |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| RAM (number of words) | 0 |
| Maximum slew rate | 6 mA |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 4.5 V |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 15.24 mm |
| uPs/uCs/peripheral integrated circuit type | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
| Base Number Matches | 1 |
| KS82C50A-8CP | KS82C50A-8CL | KS82C50A-8IP | KS82C50A-10IP | KS82C50A-8IL | KS82C50A-10IL | KS82C50A-10CL | KS82C50A-10CP | |
|---|---|---|---|---|---|---|---|---|
| Description | Serial I/O Controller, 1 Channel(s), 0.0762939453125MBps, CMOS, PDIP40, PLASTIC, DIP-40 | Serial I/O Controller, 1 Channel(s), 0.0762939453125MBps, CMOS, PQCC44, PLASTIC, LCC-44 | Serial I/O Controller, 1 Channel(s), 0.0762939453125MBps, CMOS, PDIP40, PLASTIC, DIP-40 | Serial I/O Controller, 1 Channel(s), 0.0762939453125MBps, CMOS, PDIP40, PLASTIC, DIP-40 | Serial I/O Controller, 1 Channel(s), 0.0762939453125MBps, CMOS, PQCC44, PLASTIC, LCC-44 | Serial I/O Controller, 1 Channel(s), 0.0762939453125MBps, CMOS, PQCC44, PLASTIC, LCC-44 | Serial I/O Controller, 1 Channel(s), 0.0762939453125MBps, CMOS, PQCC44, PLASTIC, LCC-44 | Serial I/O Controller, 1 Channel(s), 0.0762939453125MBps, CMOS, PDIP40, PLASTIC, DIP-40 |
| Maker | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG |
| Parts packaging code | DIP | LCC | DIP | DIP | LCC | LCC | LCC | DIP |
| package instruction | DIP, | QCCJ, | DIP, | DIP, DIP40,.6 | QCCJ, | QCCJ, LDCC44,.7SQ | QCCJ, LDCC44,.7SQ | DIP, DIP40,.6 |
| Contacts | 40 | 44 | 40 | 40 | 44 | 44 | 44 | 40 |
| Reach Compliance Code | unknown | unknown | unknown | compliant | unknown | compliant | compliant | compliant |
| Address bus width | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| boundary scan | NO | NO | NO | NO | NO | NO | NO | NO |
| letter of agreement | ASYNC, BIT | ASYNC, BIT | ASYNC, BIT | ASYNC, BIT | ASYNC, BIT | ASYNC, BIT | ASYNC, BIT | ASYNC, BIT |
| Data encoding/decoding methods | NRZ | NRZ | NRZ | NRZ | NRZ | NRZ | NRZ | NRZ |
| Maximum data transfer rate | 0.0762939453125 MBps | 0.0762939453125 MBps | 0.0762939453125 MBps | 0.0762939453125 MBps | 0.0762939453125 MBps | 0.0762939453125 MBps | 0.0762939453125 MBps | 0.0762939453125 MBps |
| External data bus width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| JESD-30 code | R-PDIP-T40 | S-PQCC-J44 | R-PDIP-T40 | R-PDIP-T40 | S-PQCC-J44 | S-PQCC-J44 | S-PQCC-J44 | R-PDIP-T40 |
| length | 52.07 mm | 16.5862 mm | 52.07 mm | 52.07 mm | 16.5862 mm | 16.5862 mm | 16.5862 mm | 52.07 mm |
| low power mode | YES | YES | YES | YES | YES | YES | YES | YES |
| Number of serial I/Os | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 40 | 44 | 40 | 40 | 44 | 44 | 44 | 40 |
| Maximum operating temperature | 70 °C | 70 °C | 85 °C | 85 °C | 85 °C | 85 °C | 70 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | QCCJ | DIP | DIP | QCCJ | QCCJ | QCCJ | DIP |
| Package shape | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE | RECTANGULAR |
| Package form | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | IN-LINE |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum slew rate | 6 mA | 6 mA | 6 mA | 6 mA | 6 mA | 6 mA | 6 mA | 6 mA |
| Maximum supply voltage | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | NO | NO | YES | YES | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND | J BEND | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | QUAD | DUAL | DUAL | QUAD | QUAD | QUAD | DUAL |
| width | 15.24 mm | 16.5862 mm | 15.24 mm | 15.24 mm | 16.5862 mm | 16.5862 mm | 16.5862 mm | 15.24 mm |
| uPs/uCs/peripheral integrated circuit type | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |