MB05F-MB10F
PASSIVATED BRIDGE RECTIFIER
Features
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Glass Passivated Die Construction
Low Forward Voltage Drop
High Surge Current Capability
Designed for Surface Mount Application
Plastic Material – UL Flammability 94V-O
B
-
~
+
~
G
H
D
C
E
A
L
MB-F
Dim
Min
Max
4.50
4.95
A
3.60
4.10
B
0.15
0.35
C
—
0.20
D
6.40
7.00
E
0.50
1.10
G
1.30
1.70
H
1.20
1.60
J
2.30
2.70
K
—
1.80
L
All Dimensions in mm
Mechanical Data
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Case: MB-F, Molded Plastic
Terminals: Plated Leads Solderable per
MIL-STD-202, Method 208
Polarity: As Marked on Case
Weight: 0.134 grams (approx.)
Mounting Position: Any
Marking: Type Number
Lead Free: For RoHS / Lead Free Version,
J
K
Maximum Ratings and Electrical Characteristics
Single Phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
@T
A
=25°C unless otherwise specified
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current (Note 1) @T
A
= 40°C
Average Rectified Output Current (Note 2) @T
A
= 40°C
Non-Repetitive Peak Forward Surge Current 8.3ms
Single half sine-wave superimposed on rated load
(JEDEC Method)
I
2
t Rating for Fusing (t < 8.3ms)
Forward Voltage per element
Peak Reverse Current
At Rated DC Blocking Voltage
@I
F
= 0.5A
@T
A
= 25°C
@T
A
= 125°C
Symbo
V
RRM
V
RWM
V
R
V
R(RMS)
I
O
MB05F
MB1F
MB2F
MB4F
MB6F
MB8F
MB10F
Unit
50
35
100
70
200
140
400
280
0.5
0.8
30
5.0
1.0
5.0
500
13
60
16
600
420
800
560
1000
700
V
V
A
I
FSM
I
2
t
V
FM
I
RM
C
j
R
JA
R
JL
T
j
, T
STG
A
A
2
s
V
µA
pF
°C/W
°C
Typical Junction Capacitance per leg (Note 3)
Typical Thermal Resistance per leg (Note 1)
Operating and Storage Temperature Range
-55 to +150
Note: 1. Mounted on glass epoxy PC board with 1.3mm
2
solder pad.
2. Mounted on aluminum substrate PC board with 1.3mm
2
solder pad.
3. Measured at 1.0 MHz and applied reverse voltage of 4.0V D.C.
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MB05F-MB10F
I
(AV)
, AVERAGE FORWARD RECTIFIED CURRENT (A)
0.6
Al. Substrate
PC Board
I
F
, INSTANTANEOUS FORWARD CURRENT (A)
0.8
10
1.0
0.4
Glass Epoxy
PC Board
0.1
0.2
0
Resistive or Inductive Load
0.01
0.2
0.4
0.6
0.8
1.0
T
j
= 25
°
C
Pulse Width = 300
µ
s
0
40
80
120
160
1.2
1.4
1.6
T
A
, AMBIENT TEMPERATURE (
°
C)
Fig. 1 Output Current Derating Curve
V
F
, INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 2 Typical Forward Characteristics (per leg)
I
FSM
, PEAK FORWARD SURGE CURRENT (A)
35
30
C
j
, JUNCTION CAPACITANCE (pF)
100
T
j
= 25
°
C
f = 1.0MHz
20
10
10
T
A
= 25
°
C
Single Half Sine-Wave
Pulse Width = 5.3ms
(JEDEC Method)
0
1
1.0
10
1
10
V
R
, REVERSE VOLTAGE (V)
Fig. 4 Typical Junction Capacitance
100
NUMBER OF CYCLES AT 60 Hz
Fig. 3 Maximum Peak Forward Surge Current (per leg)
I
R
, INSTANTANEOUS REVERSE CURRENT (
µ
A)
100
10
T
j
= 125
°
C
1.0
0.1
T
j
= 25
°
C
0.01
0
20
40
60
80
100
120
140
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
Fig. 5 Typical Reverse Characteristics (per element)
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Embedded System
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