Revision of March 2018
TF-FUSE
®
Thin Film Surface Mount Fuses
FF Series (Very Fast Acting), 0603 Size
Features:
•
•
•
•
•
•
Applications:
•
Notebook computers and tablets
•
Digital cameras
•
Memory cards
•
Toys
•
Bluetooth earphones
•
Portable electronic devices
Clearing Time Characteristics:
% of Current Rating
100%
200%
300%
Opening Time at 25
o
C
4 hours min.
5 seconds max.
0.2 second max.
Very fast acting at 200% overload current levels
Low DCR
High inrush current withstanding capability
Fiberglass enforced epoxy fuse body
Copper termination with nickel and tin plating
Halogen free, RoHS compliance and lead-free
Shape and Dimensions:
Unit
Length (L)
Width (W)
Thickness (T)
Termination bandwidth (b)
Inch
0.063 ± 0.004
0.032 ± 0.004
0.012 ± 0.004
0.014 ± 0.004
mm
1.60 ± 0.10
0.81 ± 0.10
0.30 ± 0.10
0.36 ± 0.10
Agency Approval:
Recognized Under the Components Program of UL.
File Number: E232989.
Typical Ratings and Characteristics:
Operating temperature:
-55
to +90°C
Part Number
T0603FF0150TM
T0603FF0200TM
T0603FF0250TM
T0603FF0375TM
T0603FF0500TM
T0603FF0750TM
T0603FF1000TM
T0603FF1250TM
T0603FF1500TM
T0603FF1750TM
T0603FF2000TM
T0603FF2500TM
T0603FF3000TM
T0603FF3500TM
T0603FF4000TM
T0603FF5000TM
1
Current
Rating (A)
0.15
0.2
0.25
0.375
0.5
0.75
1
1.25
1.5
1.75
2
2.5
3
3.5
4
5
Voltage
Rating (VDC)
65
65
65
65
65
65
65
65
65
35
35
35
35
35
35
35
2
Interrupting Rating
50A@35V DC/AC
13A@65V DC
35A@35V DC/AC
13A@65V DC
35A@35V DC/AC
50A@24V DC/AC
Nominal
Cold DCR (Ω)1
2.2
1.3
1.1
0.48
0.185
0.112
0.069
0.048
0.037
0.031
0.026
0.021
0.0176
0.0148
0.0125
0.0095
Nominal I
2
t
(A2s)2
0.0006
0.0014
0.0016
0.004
0.012
0.021
0.042
0.052
0.071
0.1
0.14
0.24
0.33
0.49
0.63
1.1
Marking
Measured at
≤
10% of rated current and 25˚C ambient .
Melting I
2
t at 0.001 sec.
Website:
www.aemchina.com & www.aemcomponents.com
Revision of March 2018
TF-FUSE
®
Thin Film Surface Mount Fuses
FF Series (Very Fast Acting), 0603 Size
Average Pre-arcing Time Curves:
0.200 A
0.150 A
0.250 A
0.375 A
1.50 A
0.50 A
0.75 A
1.00 A
1.25 A
1.75 A
2.00 A
2.50 A
3.00 A
3.50 A
4.00 A
Website:
www.aemchina.com & www.aemcomponents.com
5.00 A
Revision of March 2018
TF-FUSE
®
Thin Film Surface Mount Fuses
FF Series (Very Fast Acting), 0603 Size
Average I
2
t vs. t Curves:
5.00 A
4.00 A
3.50 A
3.00 A
2.50 A
2.00 A
1.75 A
1.50 A
1.25 A
1.00 A
0.75 A
0.50 A
0.375 A
0.250 A
0.200 A
0.150 A
Website:
www.aemchina.com & www.aemcomponents.com
Revision of March 2018
TF-FUSE
®
Thin Film Surface Mount Fuses
Product Identification:
T 0603 FF 1000 T M
(1) (2)
(3)
(4) (5) (6)
(1) Product Code:
T-Thin Film
(2) Size Code:
Standard EIA chip sizes
(3) Series Code:
FF—Very Fast Acting, HI—High Inrush
(4) Current Rating Code:
0500—0.5A, 1000—1.0A
(5) Package Code:
T—Tape & Reel; B—Bulk
Environmental Tests:
No.
1
Test item
Bending
Requirement
≤1A:
10% DCR change max.
>1A: 20% DCR change max.
95% coverage min.
DCR change within ±10%
No mechanical damage
DCR change within ±10%
No excessive corrosion
DCR change within
≤
±10%
No excessive corrosion
DCR change within
≤
±10%
No mechanical damage
DCR change within
≤
±10%
No mechanical damage
Change of voltage drop
within ±10%, no open circuit
2mm
Test condition
Reference
Refer to AEM QIQ034
MIL-STD-202
Method 208
MIL-STD-202
Method 107
MIL-STD-202
Method 106
MIL-STD-202
Method 101
MIL-STD-202
Method 204
MIL-STD-202
Method 213
Refer to AEM QIQ106
2
3
4
5
6
7
Solderability
Thermal shock
Moisture
resistance
Salt spray
Mechanical
vibration
Mechanical shock
One dip at 255℃ for 5 seconds
100 cycles between
-55°C
and +125°C
10 cycles
5% salt solution, 48 hour exposure
0.4” D.A. or 30G between 5 and 3000 Hz
1500G, 0.5 ms, half sine shocks
75% rated current, 2000 hours, ambient
temperature +20°C to 30°C
8
Life
Packaging:
Chip Size
0603(1608)
0402(1005)
Parts on 7 inch (178mm) Reel
8,000
20,000
Website:
www.aemchina.com & www.aemcomponents.com
Revision of March 2018
TF-FUSE
®
Thin Film Surface Mount Fuses
Temperature Effect on Current Rating:
Recommended Reflow Soldering Profile:
Profile Feature
Preheat/Soak
Temperature Min (T
smin
)
Temperature Max(T
smax
)
Time(t
s
) from (T
smin
to T
smax
)
Ramp-uprate (T
L
to T
p
)
Liquidous temperature(T
L
)
Time(t
L
) maintained above T
L
Peak package body temperature (T
p
)
Time (t
p
)*within 5°C of the specified
classification temperature (T
c
)
Ramp-down rate (T
p
to T
L
)
Time 25°C to peak temperature
Pb-Free
Assembly
150°C
200°C
60~120 seconds
3°C/second
max.
217°C
60~150 seconds
260°C
30 seconds *
6°C/second
max.
8 minutes max.
* Tolerance for peak profile temperature (T
p
) is defined as
a supplier minimum and a user maximum
Thermal Shock When Making Correction with a Soldering Iron:
The temperature of solder iron tip should be controlled under 350°C and soldering time should be less than 3 sec.
The soldering iron tip should not directly touch the top side termination of the component.
Fig 3 Correct handling method of soldering iron
Website:
www.aemchina.com & www.aemcomponents.com
京公网安备 11010802033920号
EEWORLD
