Data sheet
BMG250
Low noise, low power triaxial gyroscope
Bosch Sensortec
BMG250 – Data sheet
Document revision
Document release date
Document number
Technical reference code(s)
Notes
1.2
July 2016
BST-BMG250-DS000-02
0 273 142 064
Data and descriptions in this document are subject to change without notice.
Product photos and pictures are for illustration purposes only and may differ
from the real product appearance.
BMG250
Data sheet
Page 2
BMG250
Low noise, low power triaxial gyroscope
The BMG250 is a low noise, low power three axial gyroscope that provides a precise angular rate
(gyroscopic) measurement at market leading low power consumption.
The BMG250 is a 16 bit digital, triaxial gyroscope sensor.
Key features
High performance low noise and low offset gyroscope
Very low power consumption: typ. 850 µA (gyroscope in full operation)
Very small 2.5 x 3.0 mm
2
footprint, height 0.83 mm
Secondary high speed interface for OIS application
o
Optimized for low latency and high Output Data Rate
Parallel use for OIS and standard UI applications
o
UI
Primary Interface (I²C)
o
OIS
Secondary Interface (SPI)
Built-in power management unit (PMU) for advanced power management
Power saving with fast start-up mode of gyroscope
Wide power supply range: 1.71V … 3.6V
Allocatable FIFO buffer of 1024 bytes
Hardware sensor time-stamps for accurate sensor data fusion
Flexible digital interface to connect to host over I
2
C or SPI
Extended I
2
C mode with clock frequencies up to 1 MHz
Typical applications
Optical Image Stabilization
Electronic Image Stabilization
Optical/Electronic Video Stabilization
Augmented Reality
Indoor navigation
3D scanning / indoor mapping
Advanced gesture recognition
Immersive gaming
3-axis motion detection, e.g. Air mouse applications and pointers
Advanced system power management for mobile applications
warranty logging
Target Devices
Smart phones, tablet and transformer PCs
Camera modules for Smartphones
Digital Still Cameras / Digital Video Cameras
Game controllers, remote controls and pointing devices
Head tracking devices
Wearable devices, e.g. smart watches or augmented reality glasses
Sport and fitness devices
Toys, e.g. toy helicopters
BST-BMG250-DS000-02 | Revision 1.2 | July 2016
Bosch Sensortec
© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are preliminary and subject to change without notice.
BMG250
Data sheet
General Description
Page 3
The BMG250 is a three axial gyroscope consisting of a state-of-the-art low power 3-axis
gyroscope. It has been designed for low power, high precision multi-axis applications in mobile
phones, tablets, wearable devices, remote controls, game controllers, head-mounted devices and
toys. The BMG250 is available in a compact 2.5 × 3.0 × 0.83 mm
3
LGA package. When the
gyroscope is in full operation mode, power consumption is typically 850 µA, enabling always-on
applications in battery driven devices. The BMG250 offers a wide V
DD
voltage range from 1.71V
to 3.6V and a V
DDIO
range from 1.2V to 3.6V, allowing the BMG250 to be powered at 1.8V for both
V
DD
and V
DDIO
.
The BMG250 provides high precision sensor data together with the accurate timing of the
corresponding data. The timestamps have a resolution of up to 39 µs.
The integrated 1024 byte FIFO buffer supports low power applications and prevents data loss in
non-real-time systems. The intelligent FIFO architecture allows dynamic reallocation of FIFO
space. For typical applications, this is sufficient for approx. 1.4s of data capture at an output data
rate of 100Hz in FIFO mode with data header.
The smart built-in power management unit (PMU) can be configured, for example, to further lower
the power consumption by automatically sending the gyroscope temporarily into fast start-up
mode and waking it up again by externally triggering this function from the host device’s logical
unit.
Besides the flexible primary interface (I
2
C or SPI) that is used to connect to the host, BMG250
provides an additional secondary interface. This secondary interface can be used in SPI mode
for OIS (optical image stabilization) applications in conjunction with camera modules, or in
advanced gaming use cases.
BST-BMG250-DS000-02 | Revision 1.2 | July 2016
Bosch Sensortec
© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are preliminary and subject to change without notice.
BMG250
Data sheet
Page 4
Index of Contents
1. Contents
2. SPECIFICATION.................................................................................................................... 7
2.1 E
LECTRICAL SPECIFICATION
................................................................................................ 7
2.2 E
LECTRICAL AND PHYSICAL CHARACTERISTICS
,
MEASUREMENT PERFORMANCE
...................... 8
2.3 A
BSOLUTE MAXIMUM RATINGS
........................................................................................... 10
3. FUNCTIONAL DESCRIPTION ............................................................................................. 11
3.1 B
LOCK DIAGRAM
............................................................................................................... 11
3.2 P
OWER MODES
................................................................................................................. 12
3.2.1 S
USPEND MODE
........................................................................................................................... 12
3.2.2 F
AST START
-
UP MODE
.................................................................................................................. 12
3.2.3 T
RANSITIONS BETWEEN POWER MODES
......................................................................................... 13
3.2.4 PMU (P
OWER
M
ANAGEMENT
U
NIT
) .............................................................................................. 13
3.3 S
ENSOR
T
IMING AND
D
ATA SYNCHRONIZATION
................................................................... 14
3.3.1 S
ENSOR
T
IME
.............................................................................................................................. 14
3.4 D
ATA
P
ROCESSING
........................................................................................................... 15
3.4.1 D
ATA
P
ROCESSING
...................................................................................................................... 15
3.5 FIFO................................................................................................................................ 16
3.5.1 FIFO F
RAMES
............................................................................................................................. 16
3.5.2 FIFO
CONDITIONS AND DETAILS
.................................................................................................... 19
3.6 I
NTERRUPT
C
ONTROLLER
.................................................................................................. 21
3.6.1 D
ATA
R
EADY
D
ETECTION
............................................................................................................. 21
3.6.2 PMU T
RIGGER
(G
YRO
) ................................................................................................................ 21
3.6.3 FIFO I
NTERRUPTS
....................................................................................................................... 21
3.7 D
EVICE SELF TEST
............................................................................................................ 22
3.8 O
FFSET
C
OMPENSATION
................................................................................................... 23
3.8.1 F
AST OFFSET COMPENSATION
....................................................................................................... 23
3.8.2 M
ANUAL OFFSET COMPENSATION
.................................................................................................. 23
3.8.3 I
NLINE CALIBRATION
..................................................................................................................... 23
3.9 N
ON
-V
OLATILE
M
EMORY
................................................................................................... 24
3.10 R
EGISTER
M
AP
............................................................................................................... 25
3.10.1 R
EGISTER
(0
X
00) CHIPID ......................................................................................................... 26
3.10.2 R
EGISTER
(0
X
02) ERR_REG .................................................................................................... 27
3.10.3 R
EGISTER
(0
X
03) PMU_STATUS ............................................................................................. 28
3.10.4 R
EGISTER
(0
X
12-0
X
17) DATA ................................................................................................... 29
3.10.5 R
EGISTER
(0
X
18-0
X
1A) SENSORTIME .................................................................................... 30
3.10.6 R
EGISTER
(0
X
1B) STATUS ....................................................................................................... 31
3.10.7 R
EGISTER
(0
X
1D) INT_STATUS_1 ........................................................................................... 31
BST-BMG250-DS000-02 | Revision 1.2 | July 2016
Bosch Sensortec
© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are preliminary and subject to change without notice.
BMG250
Data sheet
Page 5
3.10.8 R
EGISTER
(0
X
20-0
X
21) TEMPERATURE ................................................................................. 32
3.10.9 R
EGISTER
(0
X
22-0
X
23) FIFO_LENGTH ................................................................................... 33
3.10.10 R
EGISTER
(0
X
24) FIFO_DATA ................................................................................................ 34
3.10.11 R
EGISTER
(0
X
42) GYR_CONF................................................................................................ 35
3.10.12 R
EGISTER
(0
X
43) GYR_RANGE ............................................................................................. 36
3.10.13 R
EGISTER
(0
X
45) FIFO_DOWNS ........................................................................................... 37
3.10.14 R
EGISTER
(0
X
46-0
X
47) FIFO_CONFIG .................................................................................. 38
3.10.15 R
EGISTER
(0
X
51) INT_EN ....................................................................................................... 39
3.10.16 R
EGISTER
(0
X
53) INT_OUT_CTRL ......................................................................................... 40
3.10.17 R
EGISTER
(0
X
54) INT_IN_CTRL ............................................................................................. 41
3.10.18 R
EGISTER
(0
X
56) INT_MAP .................................................................................................... 41
3.10.19 R
EGISTER
(0
X
6A) CONF ......................................................................................................... 42
3.10.20 R
EGISTER
(0
X
6B) IF_CONF .................................................................................................... 42
3.10.21 R
EGISTER
(0
X
6C) PMU_TRIGGER ........................................................................................ 44
3.10.22 R
EGISTER
(0
X
6D) SELF_TEST ............................................................................................... 45
3.10.23 R
EGISTER
(0
X
70) NV_CONF .................................................................................................. 46
3.10.24 R
EGISTER
(0
X
74-0
X
77) OFFSET ............................................................................................ 47
3.10.25 R
EGISTER
(0
X
7E) CMD ........................................................................................................... 48
4. DIGITAL INTERFACES ....................................................................................................... 50
4.1 I
NTERFACE
....................................................................................................................... 50
4.1.1 I
NTERFACE
I²C/SPI P
ROTOCOL
S
ELECTION
................................................................................... 51
4.1.2 SPI I
NTERFACE
............................................................................................................................ 52
4.1.3 I²C I
NTERFACE
............................................................................................................................. 55
4.1.4 SPI
AND
I²C A
CCESS
R
ESTRICTIONS
............................................................................................ 59
5. PIN-OUT AND CONNECTION DIAGRAMS ......................................................................... 61
5.1 P
IN
-
OUT
BMG250 ............................................................................................................ 61
5.2 C
ONNECTION DIAGRAMS
................................................................................................... 62
5.2.1 I
2
C
INTERFACE
............................................................................................................................. 62
5.2.2 SPI 3-
WIRE INTERFACE
................................................................................................................ 62
5.2.3 SPI 4-
WIRE INTERFACE
................................................................................................................ 63
6. PACKAGE ........................................................................................................................... 65
6.1 O
UTLINE
D
IMENSIONS
....................................................................................................... 65
6.2 S
ENSING AXES ORIENTATION
............................................................................................. 66
6.3 L
ANDING PATTERN RECOMMENDATION
............................................................................... 67
6.4 M
ARKING
.......................................................................................................................... 68
6.4.1 M
ASS PRODUCTION MARKING
........................................................................................................ 68
6.4.2 E
NGINEERING SAMPLES
................................................................................................................ 68
6.5 S
OLDERING GUIDELINES
.................................................................................................... 69
6.6 H
ANDLING INSTRUCTIONS
.................................................................................................. 70
6.7 T
APE AND REEL SPECIFICATION
......................................................................................... 71
6.7.1 O
RIENTATION WITHIN THE REEL
..................................................................................................... 71
6.8 E
NVIRONMENTAL SAFETY
.................................................................................................. 72
6.8.1 H
ALOGEN CONTENT
..................................................................................................................... 72
BST-BMG250-DS000-02 | Revision 1.2 | July 2016
Bosch Sensortec
© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are preliminary and subject to change without notice.
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