PL
IA
NT
SinglFuse
™
SF-1206F Series Features
■
Single blow fuse for overcurrent
■
■
■
■
■
■
Surface mount packaging for automated
CO
M
protection
3216 (EIA 1206) miniature footprint
Fast acting fuse
UL listed
RoHS compliant* and halogen free**
Thin film chip fuse
*R
oH
S
assembly
SF-1206F Series - Fast Acting Surface Mount Fuses
Electrical Characteristics
Model
SF-1206F050
SF-1206F080
SF-1206F100
SF-1206F125
SF-1206F150
SF-1206F200
SF-1206F250
SF-1206F300
SF-1206F400
SF-1206F500
SF-1206F700
Rated Current
(Amps)
0.50
0.80
1.00
1.25
1.50
2.00
2.50
3.00
4.00
5.00
7.00
Fusing Time
Resistance
(mΩ) Typ.***
590
225
130
88
65
38
32
23
15
11
7
DC 32 V
DC 32 V
50 A
DC 24 V
50 A
Rated Voltage
Breaking Capacity
Typical
I
2
t (A
2
s)
0.011
0.031
0.034
0.062
0.144
0.181
0.351
0.501
0.954
0.966
3.25
DC 63 V
DC 63 V
50 A
Open within 1 min.
at 200 % rated
current
DC 24 V
***Resistance value was measured with less than 10 % of rated current.
Reliability Testing
Parameter
Requirement
Test Method
Carrying Capacity ..................................... No fusing ....................................................Rated current, 4 hours
Fusing Time .............................................. Within 1 minute ..........................................200 % of its rated current
Interrupting Ability ..................................... No mechanical damages ...........................After the fuse is interrupted, rated voltage applied for
30 seconds again
Bending Test ............................................. No mechanical damages ...........................Distance between holding points: 90 mm,
Bending: 3 mm,1time, 30 seconds
Resistance to Solder Heat ........................ ±20 % .........................................................260 °C ±5 °C,10 seconds ±1 second
Solderability .............................................. 95 % coverage minimum ...........................235 °C ±5 °C, 2 ±0.5 second
245 °C ±5 °C, 2 ±0.5 second (lead free)
Temperature Rise ..................................... <75 ° ..........................................................100 % of its rated current, measure of surface
temperature
Resistance to Dry Heat............................. ±20 % .........................................................105 °C ±5 °C,1000 hours
Resistance to Solvent ............................... No evident damage on protective ..............23 °C ±5 °C of isopropyl alcohol, 90 seconds coating
and marking
Residual Resistance ................................. 10k W or more ...........................................Measure DC resistance after fusing
Thermal Shock ......................................... DR < 10 % .................................................-20 °C / +25 °C /+125 °C /+25 °C, 10 cycles
Typical Part Marking
Represents total content. Layout may
vary.
How to Order
SF - 1206 F 050 - 2
SinglFuse™
Product Designator
SMD Footprint
3216 (1206) size
RATING CURRENT (A)
F = 0.50
T = 2.50
K = 0.80
3 = 3.00
L = 1.00
W = 4.00
M = 1.25
Y = 5.00
P = 1.50
Z = 7.00
S = 2.00
Fuse Blow Type
F = Fast acting
S = Slow blow
Rated Current
050-700 (500 mA - 7.00 A)
Packaging Type
- 2 = Tape & Reel (5,000 pcs./reel)
Asia-Pacific:
Tel: +886-2 2562-4117
Fax: +886-2 2562-4116
Europe:
Tel: +41-41 768 5555
Fax: +41-41 768 5510
The Americas:
Tel: +1-951 781-5500
Fax: +1-951 781-5700
www.bourns.com
* RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
** Bourns is using the definition that appears to be the prevalent definition used as the industry standard at this time. The Bourns definition of “halogen-free” is:
Bromine (Br) content:
≤
900 ppm; Chlorine (Cl) content:
≤
900 ppm; Total Br + Cl content:
≤1500
ppm.
“SinglFuse” is a trademark of Bourns, Inc.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
SinglFuse
™
SF-1206F Series Applications
■
Portable memory
■
LCD monitors
■
Disk drives
■
PDAs
■
Digital cameras
■
DVDs
■
Cell phones
■
Rechargeable battery packs
■
Battery chargers
■
Set top boxes
■
Industrial controllers
SF-1206F Series - Fast Acting Surface Mount Fuses
Solder Reflow Recommendations
250
Peak: 250 +0/-5 °C
230 °C or higher
TEMPERATURE (°C)
200
180 °C
150
150 °C
PRE-HEATING ZONE
PEAK: 250 +0/-5 °C, 5 seconds
PRE-HEATING ZONE: 150 to 180 °C, 90 ± 30 seconds
SOLDERING ZONE: 230 °C or higher, 30 ± 10 seconds
90 ± 30 Seconds
100
30 ± 10 Seconds
SOLDERING ZONE
50
HEATING TIME
Product Dimensions
3.1 ± 0.1
(.122 ± .004)
0.6 ± 0.1
(.024 ± .004)
1.55 ± 0.1
(.061 ± .004)
0.5 ± 0.2
(.020 ± .008)
0.5 ± 0.3
(.020 ± .012)
0.5 ± 0.3
(.020 ± .012)
0.5 ± 0.2
(.020 ± .008)
Recommended Pad Layout
1.27
(.050)
2.03
(.080)
DIMENSIONS:
PACKAGING: 5,000 pcs./reel
MM
(INCHES)
3.81
(.150)
Thermal Derating Curve
120
Construction & Material Content
OVERCOAT
PERCENT OF RATING (%)
110
100
Sn PLATING
FUSE ELEMENT
Cu / Ni PLATING
90
CERAMIC SUBSTRATE
80
-20
0
20
40
60
80
100
120
AMBIENT TEMPERATURE (°C)
Operating Temperature..................................................................................-40 °C to +105 °C
Storage Conditions
Temperature ................................................................................................+5 °C to +35 °C
Humidity...........................................................................................................40 % to 75 %
Shelf Life........................................................................... 2 years from manufacturing date
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
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