Halogen and Antimony Free. “Green” Device (Note 3)
®
Applications
Offline LED Lamps
LED Power Supplies
White Goods
LED Signs
Instrumentation Illumination
Notes:
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine
(<1500ppm total Br + Cl) and <1000ppm antimony compounds.
POWERDI is a registered trademark of Diodes Incorporated.
Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only;
functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be
affected by exposure to absolute maximum rating conditions for extended periods of time.
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when
4. Test condition for PowerDI-123: Device mounted on 25.4mm x 25.4mm FR-4 PCB (10mm x 10mm 1oz copper, minimum recommended pad layout on
top layer and thermal vias to bottom layer ground plane). For better thermal performance, larger copper pad for heat-sink is needed.
5. When mounted on 50.8mm x 50.8mm GETEK PCB with 25.4mm x 25.4mm copper pads.
6. Test condition for SOD-123: Device mounted on FR-4 PCB with 50.8mm x 50.8mm 2oz copper, minimum recommended pad layout on top layer and
thermal vias to bottom layer with maximum area ground plane. For better thermal performance, larger copper pad for heat-sink is needed.
7. The LED operating current is determined by the AL5809 current option index XXX, AL5809-XXXS/P1-7.
8. The Maximum LED current is also limited by ambient temperature and power dissipation such that junction temperature should be kept less than or equal
to +125°C.
9. All voltages unless otherwise stated are measured with respect to OUT pin.
10. Measured by the percentage degree of LED current variation when V
InOut
varies from 2.5V to 60V each current option.
11. Apply the power linearly to the chip until the device starts to turn on.
12. t
ON_MIN
time includes the delay and the rise time needed for I
OUT
to reach 90% of its final value. t
OFF_MIN
time is the time needed for I
OUT
to drop below
10% of its final value.
13. This parameter only guaranteed by design, not tested in production.
14. Ambient temperature at which OTP is triggered may vary depending on application, PCB layout and material used.
[i=s]This post was last edited by a media student on 2020-7-5 01:33[/i]2020 ST MEMS Sensor Creative Design CompetitionDesign of robotic arm gesture tracking and voice control system
by Media Students
...
The STC12C5410 chip only has P1 and P3 ports. If I want to expand an 8K data memory, which port should I use? What are these two ports? 8051 uses P0 and P2 ports for expansion....
Chapter 5 Golden Dragon 107——DAC DAC 5.1 Introduction: Digital/Analog Conversion Module The DAC (DAC) is a 12-bit digital input, voltage output digital/analog converter. The DAC can be configured as 8...
***Strange phenomenon, no response when sending IP packets after IPCP negotiation. **** I use PC to connect to the mobile phone to dial up the GPRS of China Mobile and send PPP frames myself. However,...
FPGA/CPLD
京公网安备 11010802033920号
EEWORLD
