Soft Termination Chip Multilayer Ceramic Capacitors for Automotive
GCJ188L81C333KA01_ (0603, X8L:EIA, 33000pF, DC16V)
_: packaging code
1.Scope
Reference Sheet
This product specification is applied to Soft Termination Chip Multilayer Ceramic Capacitors used for Automotive Electronic equipment.
2.MURATA Part NO. System
(Ex.)
GCJ
18
(1)L/W
Dimensions
8
(2)T
Dimensions
L8
(3)Temperature
Characteristics
1C
(4)Rated
Voltage
333
(5)Nominal
Capacitance
K
(6)Capacitance
Tolerance
A01
(7)Murata’s Control
Code
D
(8)Packaging Code
3. Type & Dimensions
(1)-1 L
1.6±0.2
(1)-2 W
0.8±0.1
(2) T
0.8±0.1
e
0.2 to 0.5
(Unit:mm)
g
0.5 min.
4.Rated value
(3) Temperature Characteristics
(Public STD Code):X8L(EIA)
Temp. coeff
Temp. Range
or Cap. Change
(Ref.Temp.)
(4)
Rated
Voltage
(6)
(5) Nominal
Capacitance
Capacitance
Tolerance
Specifications and Test
Methods
(Operating
Temp. Range)
-40 to 15 %
・Soldering
Method
Reflow
-55 to 150 °C
(25 °C)
DC 16 V
33000 pF
±10 %
-55 to 150 °C
5.Package
mark
D
J
(8) Packaging
f180mm
Reel
PAPER W8P4
f330mm
Reel
PAPER W8P4
Packaging Unit
4000 pcs./Reel
10000 pcs./Reel
Product specifications in this catalog are as of Dec.6,2017,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
GCJ188L81C333KA01-01
1
■AEC-Q200
Murata Standard Specification and Test Methods
AEC-Q200 Test Item
No
1 Pre-and Post-Stress
Electrical Test
2 High Temperature
Exposure (Storage)
Appearance
Capacitance
Change
D.F.
Insulation
Resistance
25℃
3 Temperature Cycling
Appearance
The measured and observed characteristics should satisfy the
specifications in the following table.
No marking defects
Solder the capacitor on the test substrate(glass epoxy board).
Perform the 1000 cycles test according to the four heat treatments
listed in the following table.
Set for 24+/-2h at room temperature, then measure.
Within the specified initial value.
Within the specified initial value.
The measured and observed characteristics should satisfy the
specifications in the following table.
No marking defects
Within +/-12.5%
・
Initial measurement for high dielectric constant type
Perform a heat treatment at 150+0/-10
℃for
1h and then sit
for 24+/-2h at room temperature.Perform the initial measurement.
Specification.
-
Solder the capacitor on the test substrate(glass epoxy board).
Set the capacitor for 1000+/-12h at 150+/-3℃.
Set for 24+/-2h at room temperature, then measure.
AEC-Q200 Test Method
Step
Capacitance
Change
D.F.
Within the specified initial value.
Within +/-7.5%
1
Min.Operating Temp.+0/-3
15+/-3
2
3
4
Temp.
(C)
Time
(min.)
Room
Room
Temp. Max.Operating Temp. +3/-0 Temp.
1
15+/-3
1
Insulation
Resistance
25℃
Within the specified initial value.
・Initial
measurement
Perform a heat treatment at 150+0/-10
℃for
1h and then sit
for 24+/-2h at room temperature.
Perform the initial measurement.
4 Destructive
Physical Analysis
5 Moisture Resistance
Appearance
No defects or abnormalities
The measured and observed characteristics should satisfy the
specifications in the following table.
No marking defects
Per EIA-469
Solder the capacitor on the test substrate(glass epoxy board).
Apply the 24h heat (25℃ to 65℃) and humidity (80%RH to 98%RH)
treatment shown below, 10 consecutive times.
Set for 24+/-2h at room temperature, then measure.
Capacitance
Change
D.F.
Within +/-10.0%
Temperature
(℃)
70
65
60
55
50
45
40
35
30
25
20
15
10
5
0
-5
-10
Humidity
90½98%
Humidity
80½98%
Humidity
90½98%
Humidity
80½98% Humidity
90½98%
Within the specified initial value.
Insulation
Resistance
25℃
Within the specified initial value.
+10
- 2
℃
Initial measuremt
One cycle 24hours
0
1 2
3
4 5
6
7
8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
Hours
・Initial
measurement
Perform a heat treatment at 150+0/-10
℃for
1h and then sit
for 24+/-2h at room temperature.
Perform the initial measurement.
6 Biased Humidity
Appearance
Capacitance
Change
・Initial
measurement
D.F.
Within the specified initial value.
Perform a heat treatment at 150+0/-10
℃for
1h and then sit
for 24+/-2h at room temperature.
Perform the initial measurement.
Insulation
Resistance
25℃
More than 1,000MΩ or 50Ω・F
(Whichever is smaller)
The measured and observed characteristics should satisfy the
specifications in the following table.
No marking defects
Within +/-12.5%
Solder the capacitor on the test substrate(glass epoxy board).
Apply the rated voltage and 1.3+0.2/-0Vdc (add 6.8kΩ resister)
at 85+/-3℃ and 80%RH to 85%RH humidity for 1000+/-12h.
The charge/discharge current is less than 50mA.
Remove and set for 24+/-2h at room temperature, then measure.
JEMCGS-02174C
2
■AEC-Q200
Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
Specification.
The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance
Capacitance
Change
D.F.
Within the specified initial value.
No marking defects
Within +/-10.0%
・Initial
measurement
Apply the test voltage at the max. operating temp. +/-3°C for 1h
and then let sit for 24+/-2h at room temperature,then measure.
AEC-Q200 Test Method
Solder the capacitor on the test substrate(glass epoxy board).
Apply 150% of the rated voltage for 1000+/-12h at 150+/-3℃.
Set for 24+/-2h at room temperature, then measure.
The charge/discharge current is less than 50mA.
7 Operational Life
Insulation
Resistance
25℃
8 External Visual
9 Physical Dimension
10 Resistance to Appearance
Solvents
Capacitance
D.F.
Insulation
Resistance
25℃
11 Mechanical
Shock
Capacitance
D.F.
Insulation
Resistance
25℃
12 Vibration
Appearance
Capacitance
D.F.
Insulation
Resistance
25℃
13 Resistance to
Soldering Heat
Appearance
Capacitance
D.F.
Insulation
Resistance
25℃
Appearance
More than 1,000MΩ or 50Ω・F
(Whichever is smaller)
No defects or abnormalities
Within the specified dimensions
No marking defects
Within the specified initial value.
Within the specified initial value.
Within the specified initial value.
Visual inspection
Using Measuring instrument of dimension.
Per MIL-STD-202 Method 215
Solvent 1 : 1 part (by volume) of isopropyl alcohol
3 parts (by volume) of mineral spirits
Solvent 2 : Terpene defluxer
Solvent 3 : 42 parts (by volume) of water
1 part (by volume) of propylene glycol monomethyl ether
1 part (by volume) of monoethanolamine
No marking defects
Within the specified initial value.
Within the specified initial value.
Within the specified initial value.
Solder the capacitor on the test substrate(glass epoxy board).
Three shocks in each direction should be applied along 3 mutually
perpendicular axes of the test specimen (18 shocks).
The specified test pulse should be Half-sine and should have a
duration :0.5ms, peak value:1500g and velocity change: 4.7m/s.
No marking defects
Within the specified initial value.
Within the specified initial value.
Within the specified initial value.
Solder the capacitor on the test substrate(glass epoxy board).
The capacitor should be subjected to a simple harmonic motion having
a total amplitude of 1.5mm, the frequency being varied uniformly
between the approximate limits of 10 and 2000Hz.
The frequency range, from 10 to 2000Hz and return to 10Hz,
should be traversed in approximately 20 minutes.
This motion should be applied for 12 items in each 3 mutually
perpendicular directions (total of 36 times).
The measured and observed characteristics should satisfy the
specifications in the following table.
No marking defects
Within the specified initial value.
Within the specified initial value.
Within the specified initial value.
Immerse the capacitor in Sn-3.0Ag-0.5Cu solder solution or an eutectic
solder solution at 260+/-5℃ for 10+/-1s.
Set at room temperature for 24+/-2h, then measure.
・Initial
measurement
Perform a heat treatment at 150+0/-10
℃for
1h and then sit
for 24+/-2h at room temperature.
Perform the initial measurement.
JEMCGS-02174C
3
■AEC-Q200
Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
Specification.
The measured and observed characteristics shall satisfy the
specifications in the following table.
Appearance
No marking defects
AEC-Q200 Test Method
Solder the capacitor on the test substrate(glass epoxy board).
Perform the 300 cycles according to the two heat treatments listed
in the following table(Maximum transfer time is 20s).
Set for 24+/-2h at room temperature, then measure.
Capacitance
Change
D.F.
Within the specified initial value.
Within +/-7.5%
Step
Temp.
(℃)
Time
(min)
1
Min.Operating Temp.
+0/-3
14 Thermal Shock
2
Max.Operating Temp.
+3/-0
15+/-3
15+/-3
・Initial
measurement
Insulation
Resistance
25℃
15 ESD
Appearance
Capacitance
D.F.
Insulation
Resistance
25℃
16 Solderability
95% of the terminations is to be soldered evenly and
continuously.
(a) Preheat at 155℃ for 4h. After preheating, immerse the capacitor
in a solution of rosin ethanol 25(mass)%.
Immerse in Sn-3.0Ag-0.5Cu solder solution at 245+/-5℃ or
an eutectic solder solution at 235+/-5℃ for 5+0/-0.5s.
(b) should be placed into steam aging for 8h+/-15min.
After preheating, immerse the capacitor in a solution of rosin
ethanol
25(mass)%.
Immerse
in Sn-3.0Ag-0.5Cu solder solution at 245+/-5℃
or
an eutectic solder solution at 235+/-5℃ for 5+0/-0.5s.
(c) should be placed into steam aging for 8h+/-15min.
After
preheating, immerse the capacitor in a solution of rosin
ethanol
25(mass)%.
Immerse
in Sn-3.0Ag-0.5Cu solder solution or
an eutectic solder solution for 120+/-5s at 260+/-5℃.
17 Electrical
Chatacteri-
zation
Capacitance
D.F.
Shown in Rated value.
0.05 max.
Char.
C
≦10㎌
Frequency
1.0+/-0.1kHz
Voltage
1.0+/-0.2Vrms
Within the specified initial value.
Perform a heat treatment at 150+0/-10
℃for
1h and then sit
for 24+/-2h at room temperature.
Perform the initial measurement.
No marking defects
Within the specified initial value.
Within the specified initial value.
Within the specified initial value.
Per AEC-Q200-002
Appearance
No defects or abnormalities
Visual inspection.
The capacitance/D.F. should be measured at 25℃ at the frequency
and voltage shown in the table.
Insulation
Resistance
25
℃
Insulation
Resistance
150℃
Dielectric
Strength
More than 10,000MΩ or 500Ω・F
(Whichever is smaller)
More than 1,000MΩ or 10Ω・F
(Whichever is smaller)
No failure
The insulation resistance should be measured with a DC voltage not
exceeding the rated voltage at 25℃ and 150℃ within 2 minutes of
charging.
No failure should be observed when 250% of the rated voltage is
applied between the terminations for 1 to 5s,
provided the charge/ discharge current is less than 50mA.
JEMCGS-02174C
4
■AEC-Q200
Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
Appearance
Capacitance
Change
D.F.
Within the specified initial value.
No marking defects
Within ±10.0%
Specification.
shown in Fig1.
Then apply a force in the direction shown in Fig 2 for 60s.
The soldering should be done by the reflow method and should be
conducted with care so that the soldering is uniform and free of defects
½ﾝﾃﾞﾝ½
such as heat shock.
Type
GCJ15
GCJ18
GCJ21
GCJ31
GCJ32
a
0.5
0.6
0.8
2.0
2.0
b
1.5
2.2
3.0
4.4
4.4
c
0.6
0.9
1.3
1.7
2.6
AEC-Q200 Test Method
Solder the capacitor on the test substrate(glass epoxy board)
18 Board Flex
Insulation
Resistance
25℃
Within the specified initial value.
45
45
支持台
(in mm)
50 min.
20
Land
b
f4.5
Pressurizing
speed:1.0mm/s
Pressurize
R4
a
100
40
c
c
Capacitance meter
45
45
Fig.2
Flexure：5
(High Dielectric Type)
Fig.
19 Terminal
Strength
Capacitance
D.F.
Within the specified initial value.
Within the specified initial value.
Appearance
No marking defects
t:1.6mm (GCJ15:0.8mm)
Solder the capacitor on the test substrate(glass epoxy board)
shown in Fig3.
Then apply 10N* force in parallel with the test jig for 60s.
The soldering should be done either with an iron or using the reflow
method and should be conducted with care so that the soldering is
uniform and free of defects such as heat shock
*GCJ15: 2N, GCJ18 : 5N
Insulation
Resistance
25℃
Within the specified initial value.
Type
GCJ15
GCJ18
GCJ21
GCJ31
GCJ32
a
0.4
1.0
1.2
2.2
2.2
b
1.5
3.0
4.0
5.0
5.0
c
0.5
1.2
1.65
2.0
2.9
(in mm)
c
b
a
ﾗﾝﾄﾞ
b
f4.5
Solder resist
Baked electrode or
Copper foil
c
a
20 Beam Load Test
Destruction value should be exceed following one.
< Chip L dimension : 2.5mm max. >
Chip thickness > 0.5mm rank : 20N
Chip thickness
≦0.5mm
rank : 8N
< Chip L dimension : 3.2mm max. >
Chip thickness < 1.25mm rank : 15N
Chip
thickness
≧1.25mm
rank : 54.5N
Fig.3
t:1.6mm (GCJ15:0.8mm)
Place the capacitor in the beam load fixture as Fig 4.
Apply a force.
< Chip Length : 2.5mm max. >
Iron Board
< Chip Length : 3.2mm min. >
L
0.6L
Fig.4
Speed supplied the Stress Load : 0.5mm/s
JEMCGS-02174C
5
京公网安备 11010802033920号
EEWORLD
