Spec.No.JENF243A-0023L-01
Reference Only
P.1/9
GHz Noise Suppression Chip Ferrite Bead
BLM15E□□□□SN1□ Reference Specification
1.Scope
This reference specification applies to Chip Ferrite Bead BLM15E_SN series.
2.Part Numbering
(ex.)
BL
M
15
EG
121
S
N
1
D
(1)
(2)
(3)
(4)
(5)
(6) (7) (8)
(9)
(1)Product ID (2)Type (3)Dimension(L×Ｗ) (4)Characteristics (5)Typical Impedance at 100MHz
(6)Performance (7)Category (8)Numbers of Circuit (9)Packaging(D:Taping / B:Bulk)
3.Rating
Customer
Part Number
MURATA
Part Number
Impedance ()
(Under Standard
Testing Condition)
at 1GHz
at 100MHz
Typical
RatedCurrent
(mA)
at 85℃
at 125℃
DC Resistance
( max.)
Values
Initial
After
Values
Testing
0.13
0.37
0.085
0.155
0.225
0.310
For
general
use
Remark
BLM15EG121SN1D
900
*1
0.095
120±25% 100min 145
1500
*1
BLM15EG121SN1B
BLM15EG221SN1D
500
*1
0.28
220±25% 180min 270
700
*1
BLM15EG221SN1B
BLM15EX121SN1D
1200
*1
0.075
120±25%
170±40%
1800
*1
BLM15EX121SN1B
BLM15EX221SN1D
850
*1
0.140
220±25%
300±40%
1300
*1
BLM15EX221SN1B
BLM15EX331SN1D
700
*1
0.205
330±25%
450±40%
1100
*1
BLM15EX331SN1B
BLM15EX471SN1D
600
*1
0.280
470±25%
630±40%
950
*1
BLM15EX471SN1B
■Operating
Temperature : -55°C to +125°C
■Storage
Temperature : -55°C to +125°C
R a te d C u rre n t ( A )
Rated current
at 85°C
(Note) As for the Rated current marked with
*1,
Rated Current is derated as right figure
depending on the operating temperature.
Rated current
at 125°C
0
85
125
4
.Style and Dimensions
1.0±0.05
0.5±0.05
0.5±0.05
Operating Temperature (°C)
■
Equivalent Circuit
0.25±0.1
(
: Electrode
(in mm)
Resistance element becomes
dominant at high frequencies.
)
■
Unit Mass (Typical value)
0.001g
5.Marking
No marking.
6.Standard Testing Conditions
Unless otherwise specified
Temperature : Ordinary Temp. (15 °C to 35 °C )
Humidity : Ordinary Humidity (25%(RH) to 85%(RH))
In case of doubt
Temperature : 20°C±2 °C
Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
MURATA MFG.CO.,LTD.
Spec.No.JENF243A-0023L-01
7.Specifications
7-1.Electrical Performance
No.
Item
7-1-1 Impedance
Reference Only
P.2/9
Specification
Meet item 3.
7-1-2 DC Resistance
Meet item 3.
Test Method
Measuring Frequency : 100MHz±1MHz , 1GHz±1MHz
Measuring Equipment : KEYSIGHT4291A or the equivalent
Test Fixture : KEYSIGHT16192A or the equivalent
Measuring Equipment : Digital multi meter
*Except resistance of the Substrate and Wire
7-2. Mechanical Performance
No.
Item
7-2-1 Appearance and
Dimensions
7-2-2 Bonding
Strength
Specification
Meet item 4.
Meet Table 1.
Table 1
Appearance
Impedance
Change
(at 100MHz)
DC
Resistance
No damage
Within ±30%
Meet item 3.
Substrate
Test Method
Visual Inspection and measured with Slide Calipers.
It shall be soldered on the substrate.
Applying Force(F) : 5N
Applying Time : 5s±1s
Applying Direction: Parallel to the substrate.
Ｆ
R0.5
Side view
Ｆ
7-2-3 Bending
Strength
It shall be soldered on the substrate.
Substrate: Glass-epoxy 100mm40mm0.8mm
Deflection : 2.0mm
Speed of Applying Force : 0.5mm/s
Keeping Time : 30s
Pressure jig
F
Deflection
45mm
45mm
R340
Product
7-2-4
Vibration
7-2-5 Resistance
to Soldering
Heat
7-2-6
Drop
Products shall be no failure
after tested.
It shall be soldered on the substrate.
Oscillation Frequency : 10Hz to 2000Hz to 10Hz
for 20 min
Total Amplitude 1.5mm or Acceleration 196m/s
2
whichever is smaller
Testing Time : A period of 2 hours in each of 3 mutually
perpendicular directions. (Total 6 h)
Pre-Heating : 150°C±10°C, 60s½90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 270°C±5°C
Immersion Time : 10s±0.5s
Immersion and emersion rates : 25mm/s
Then measured after exposure in the room condition
for 48h±4h.
It shall be dropped on concrete or steel board.
Method : free fall
Height : 75cm
Attitude from which the product is dropped : 3 direction
The number of times : 3 times for each direction
(Total 9 times)
MURATA MFG.CO.,LTD.
Spec.No.JENF243A-0023L-01
No.
Item
7½2-7 Solderability
Reference Only
Test Method
Flux : Ethanol solution of rosin,25(wt)%
Pre-Heating : 150°C±10°C, 60s½90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 240°C±5°C
Immersion Time : 3s±1s
Immersion and emersion rates : 25mm/s
P.3/9
Specification
The electrodes shall be at
least 95% covered with new
solder coating.
7-3.Environmental Performance
It shall be soldered on the substrate.
No.
Item
Specification
7-3-1 Heat Shock
Meet Table 1.
Test Method
1 cycle :
1 step : -55
°C(+0 °C,-3 °C)
/ 30min±3min
2 step : +125
°C(+3 °C,-0 °C)
/ 30min±3min
Shift Time:30s max
Total of 500 cycles
Then measured after exposure in the room condition for 48h±4h.
Temperature : 70°C±2°C
Humidity : 90%RH to 95%RH
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
Temperature : 125°C±3°C
Applying Current : Rated Current (at Test temperature)
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
Temperature : -55±2°C
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
7-3-2 Humidity
7-3-3 Heat Life
7-3-4 Cold
Resistance
8. Specification of Packaging
8-1.Appearance and Dimensions
(8mm-wide paper tape)
2.0±0.05
2.0±0.05 4.0±0.1
1.5
-0
+0.1
1.15(Typ.)
3.5±0.05
1.75±0.1
8.0±0.3
(in mm)
(1) Taping
Products shall be packaged in the cavity of the base tape of 8mm-wide, 2mm-pitch continuously and sealed
by top tape and bottom tape.
(2) Sprocket hole:Sprocket hole shall be located on the right hand side toward the direction of feed.
(3) Spliced point:The base tape and top tape have no spliced point
(4) Cavity:There shall not be burr in the cavity.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not
continuous. The specified quantity per reel is kept.
Direction of Feed
0.65(Typ.)
0.8max.
MURATA MFG.CO.,LTD.
Spec.No.JENF243A-0023L-01
8-2.Tape Strength
Reference Only
P.4/9
(1)Pull Strength
Top tape
5N min.
Bottom tape
(2)Peeling off force of Cover tape
0.1N to 0.6N (Minimum value is typical.)
*Speed of Peeling off:300mm/min
165 to 180 degree
Top tape
F
Bottom tape
Base tape
8-3.Taping Condition
(1)Standard quantity per reel
Quantity per 180mm reel
10000 pcs. / reel
(2)There shall be leader-tape(top tape and empty tape) and trailer- tape(empty tape) as follows.
(3)On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape
for more than 5 pitch.
(4)Marking for reel
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity, etc)
1)
« Expression of Inspection No. »
(1)
Factory Code
(2)
Date
□□
(1)
OOOO
(2)
(3)
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep.
1 to 9, Oct. to Dec.
O,N,D
Third, Fourth digit : Day
ROHS – Y (△)
(1) (2)
(3)
Serial No.
2)
« Expression of RoHS marking »
(1)
RoHS regulation conformity parts.
(2)
MURATA classification number
(5) Outside package
These reels shall be packed in the corrugated cardboard package and the following items shall be marked on
a label and the label is stuck on the box.
(Customer name, Purchasing Order Number, Customer Part Number, MURATA part number,
RoHS marking(2) , Quantity , etc)
(6)Dimensions of reel and taping(leader-tape, trailer-tape)
Trailer
2.0±0.5
160 min.
Leader
Label
190 min.
Empty tape
13.0±0.2
210 min.
Top tape
60±
0
21.0±0.8
1
9±
1
0
13±1.4
180±
3
0
Direction of feed
(in mm)
8-4. Specification of Outer Case
Outer Case Dimensions
Standard Reel Quantity in Outer Case
(mm)
(Reel)
W
D
H
186
186
93
5
Above
Outer Case size is typical. It depends on a quantity of an order.
Label
H
D
W
MURATA MFG.CO.,LTD.
Spec.No.JENF243A-0023L-01
9.
！
Caution
9-1. Surge current
Reference Only
P.5/9
Excessive surge current ( pulse current or rush current) than specified rated current applied to the product may cause
a critical failure, such as an open circuit, burnout caused by excessive temperature rise.
Please contact us in advance in case of applying the surge current.
9-2.Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1)Aircraft equipment
(6)Disaster prevention / crime prevention equipment
(2)Aerospace equipment
(7)Traffic signal equipment
(3)Undersea equipment
(8)Transportation equipment (vehicles, trains, ships, etc.)
(4)Power plant control equipment
(9) Data-processing equipment
(5)Medical equipment
(10)Applications of similar complexity and /or reliability
requirements to the applications listed in the above
10. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
10-1.Land pattern designing
Standard
land dimensions (Reflow soldering)
<For BLM15EG series>
Chip Ferrite Bead
0.5
0.4
1.2½1.4
Solder Resist
Pattern
(in mm)
<For BLM15EX series>
Chip Ferrite Bead
½
½
½
½
Solder Resist
Pattern
Land pad thickness
and dimension d
a
b
c
18µm 35µm 70µm
0.5
0.5
0.5
0.4 1.2 to 1.4 0.5
1.2
0.7
0.5
(in mm)
The
excessive heat by land pads may cause
deterioration at joint of products with substrate.
Rated
Current
(A)
1.5 Max
1.8 Max
10-2.Soldering Conditions
Products can be applied to reflow soldering.
(1) Flux,Solder
Flux
Solder
Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100
µm
to 200
m
MURATA MFG.CO.,LTD.
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