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BCP69; BC869; BC69PA
20 V, 2 A PNP medium power transistors
Rev. 7 — 12 October 2011
Product data sheet
1. Product profile
1.1 General description
PNP medium power transistor series in Surface-Mounted Device (SMD) plastic packages.
Table 1.
Product overview
Package
NXP
BCP69
BC869
BC69PA
[1]
Type number
[1]
NPN complement
JEITA
SC-73
SC-62
-
JEDEC
-
TO-243
-
BCP68
BC868
BC68PA
SOT223
SOT89
SOT1061
Valid for all available selection groups.
1.2 Features and benefits
High current
Three current gain selections
High power dissipation capability
Exposed heatsink for excellent thermal and electrical conductivity (SOT89, SOT1061)
Leadless very small SMD plastic package with medium power capability (SOT1061)
AEC-Q101 qualified
1.3 Applications
Linear voltage regulators
High-side switches
Battery-driven devices
Power management
MOSFET drivers
Amplifiers
1.4 Quick reference data
Table 2.
Symbol
V
CEO
I
C
I
CM
Quick reference data
Parameter
collector-emitter voltage
collector current
peak collector current
single pulse; t
p
1 ms
Conditions
open base
Min
-
-
-
Typ
-
-
-
Max
20
2
3
Unit
V
A
A
NXP Semiconductors
BCP69; BC869; BC69PA
20 V, 2 A PNP medium power transistors
Quick reference data
…continued
Parameter
DC current gain
h
FE
selection -16
h
FE
selection -25
Conditions
V
CE
=
1
V;
I
C
=
500
mA
V
CE
=
1
V;
I
C
=
500
mA
V
CE
=
1
V;
I
C
=
500
mA
[1]
Table 2.
Symbol
h
FE
Min
85
100
160
Typ
-
-
-
Max
375
250
375
Unit
[1]
[1]
[1]
Pulse test: t
p
300
s;
= 0.02.
2. Pinning information
Table 3.
Pin
SOT223
1
2
3
4
base
collector
emitter
collector
1
2
3
3
sym028
Pinning
Description
Simplified outline
Graphic symbol
4
1
2, 4
SOT89
1
2
3
emitter
collector
base
3
2
1
3
1
006aaa231
2
SOT1061
1
2
3
base
emitter
collector
3
1
2
1
2
sym013
3
Transparent top view
BCP69_BC869_BC69PA
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 7 — 12 October 2011
2 of 24
NXP Semiconductors
BCP69; BC869; BC69PA
20 V, 2 A PNP medium power transistors
3. Ordering information
Table 4.
Ordering information
Package
Name
BCP69
BC869
BC69PA
[1]
Type number
[1]
Description
plastic surface-mounted package with increased
heatsink; 4 leads
plastic surface-mounted package; exposed die pad for
good heat transfer; 3 leads
Version
SOT223
SOT89
SOT1061
SC-73
SC-62
HUSON3 plastic thermal enhanced ultra thin small outline
package; no leads; 3 terminals; body 2
2
0.65 mm
Valid for all available selection groups.
4. Marking
Table 5.
BCP69
BCP69-16
BCP69-25
BC869
BC869-16
BC869-25
BC69PA
BC69-16PA
BC69-25PA
Marking codes
Marking code
BCP69
BCP69/16
BCP69/25
CEC
CGC
CHC
B3
BM
BN
Type number
BCP69_BC869_BC69PA
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 7 — 12 October 2011
3 of 24
NXP Semiconductors
BCP69; BC869; BC69PA
20 V, 2 A PNP medium power transistors
5. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
V
CBO
V
CEO
V
EBO
I
C
I
CM
I
B
I
BM
P
tot
Parameter
collector-base voltage
collector-emitter voltage
emitter-base voltage
collector current
peak collector current
base current
peak base current
total power dissipation
BCP69
single pulse;
t
p
1 ms
T
amb
25
C
[1]
[2]
[3]
Conditions
open emitter
open base
open collector
single pulse;
t
p
1 ms
Min
-
-
-
-
-
-
-
Max
32
20
5
2
3
0.4
0.4
Unit
V
V
V
A
A
A
A
-
-
-
-
-
-
-
-
-
-
-
-
55
65
0.65
1.00
1.35
0.50
0.95
1.35
0.42
0.83
1.10
0.81
1.65
150
+150
+150
W
W
W
W
W
W
W
W
W
W
W
C
C
C
BC869
[1]
[2]
[3]
BC69PA
[1]
[2]
[3]
[4]
[5]
T
j
T
amb
T
stg
[1]
[2]
[3]
[4]
[5]
junction temperature
ambient temperature
storage temperature
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm
2
.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm
2
.
Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint.
Device mounted on an FR4 PCB, 4-layer copper, tin-plated, mounting pad for collector 1 cm
2
.
BCP69_BC869_BC69PA
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 7 — 12 October 2011
4 of 24
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