2. Zener voltage is measured with a pulse test current I
Z
at an ambient temperature of 25°C.
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2
MM3ZxxxT1G Series, SZMM3ZxxxT1G Series
TYPICAL CHARACTERISTICS
1000
T
J
= 25°C
I
Z(AC)
= 0.1 I
Z(DC)
f = 1 kHz
1000
IF, FORWARD CURRENT (mA)
Z ZT , DYNAMIC IMPEDANCE (
Ω
)
100
100
I
Z
= 1 mA
10
5 mA
10
150°C
75°C
1.0
3.0
10
V
Z
, NOMINAL ZENER VOLTAGE
80
0.4
0.5
25°C
0°C
1.1
1.2
1.0
0.6
0.7
0.8
0.9
1.0
V
F
, FORWARD VOLTAGE (V)
Figure 1. Effect of Zener Voltage on Zener Impedance
Figure 2. Typical Forward Voltage
1000
T
A
= 25°C
C, CAPACITANCE (pF)
0 V BIAS
1 V BIAS
IR, LEAKAGE CURRENT (
μ
A)
1000
100
10
1.0
0.1
0.01
+ 25°C
−55°C
0
10
20
30
40
50
60
V
Z
, NOMINAL ZENER VOLTAGE (V)
70
+150°C
100
10
BIAS AT
50% OF V
Z
NOM
0.001
0.0001
1.0
4.0
10
V
Z
, NOMINAL ZENER VOLTAGE (V)
70
0.00001
Figure 3. Typical Capacitance
Figure 4. Typical Leakage Current
100
T
A
= 25°C
I Z , ZENER CURRENT (mA)
100
IZ , ZENER CURRENT (mA)
T
A
= 25°C
10
10
1.0
1
0.1
0.1
0.01
0.01
0
2.0
4.0
6.0
8.0
V
Z
, ZENER VOLTAGE (V)
10
12
10
30
50
70
V
Z
, ZENER VOLTAGE (V)
90
Figure 5. Zener Voltage versus Zener Current
(V
Z
Up to 12 V)
Figure 6. Zener Voltage versus Zener Current
(12 V to 75 V)
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3
MM3ZxxxT1G Series, SZMM3ZxxxT1G Series
TYPICAL CHARACTERISTICS
100
80
POWER DISSIPATION (%)
60
40
20
0
0
25
50
75
100
TEMPERATURE (°C)
125
150
Figure 7. Steady State Power Derating
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4
MM3ZxxxT1G Series, SZMM3ZxxxT1G Series
PACKAGE DIMENSIONS
SOD−323
CASE 477−02
ISSUE H
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. LEAD THICKNESS SPECIFIED PER L/F DRAWING
WITH SOLDER PLATING.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
5. DIMENSION L IS MEASURED FROM END OF
RADIUS.
MILLIMETERS
DIM MIN
NOM MAX
A
0.80
0.90
1.00
A1
0.00
0.05
0.10
A3
0.15 REF
b
0.25
0.32
0.4
C
0.089
0.12 0.177
D
1.60
1.70
1.80
E
1.15
1.25
1.35
L
0.08
H
E
2.30
2.50
2.70
STYLE 1:
PIN 1. CATHODE
2. ANODE
INCHES
NOM MAX
0.035 0.040
0.002 0.004
0.006 REF
0.010 0.012 0.016
0.003 0.005 0.007
0.062 0.066 0.070
0.045 0.049 0.053
0.003
0.090 0.098 0.105
H
E
D
b
1
2
E
MIN
0.031
0.000
A3
A
L
NOTE 5
C
NOTE 3
A1
SOLDERING FOOTPRINT*
0.63
0.025
0.83
0.033
1.60
0.063
2.85
0.112
SCALE 10:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone:
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