EEWORLDEEWORLDEEWORLD

Part Number

Search

TE28F800C2TA120

Description
Flash, 512KX16, 120ns, PDSO48, 12 X 20 MM, TSOP-48
Categorystorage    storage   
File Size271KB,56 Pages
ManufacturerIntel
Websitehttp://www.intel.com/
Download Datasheet Parametric Compare View All

TE28F800C2TA120 Overview

Flash, 512KX16, 120ns, PDSO48, 12 X 20 MM, TSOP-48

TE28F800C2TA120 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Parts packaging codeTSOP
package instruction12 X 20 MM, TSOP-48
Contacts48
Reach Compliance Codecompli
ECCN codeEAR99
Maximum access time120 ns
Other featuresTOP BOOT BLOCK
startup blockTOP
command user interfaceYES
Universal Flash InterfaceYES
Data pollingNO
JESD-30 codeR-PDSO-G48
JESD-609 codee0
length18.4 mm
memory density8388608 bi
Memory IC TypeFLASH
memory width16
Number of functions1
Number of departments/size8,15
Number of terminals48
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize512KX16
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP1
Encapsulate equivalent codeTSSOP48,.8,20
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply2.4/3 V
Programming voltage1.8 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Department size4K,32K
Maximum standby current0.000005 A
Maximum slew rate0.055 mA
Maximum supply voltage (Vsup)3 V
Minimum supply voltage (Vsup)2.4 V
Nominal supply voltage (Vsup)2.4 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
switch bitNO
typeNOR TYPE
width12 mm
Base Number Matches1
E
n
n
n
PRELIMINARY
2.4 VOLT ADVANCED+ BOOT BLOCK
FLASH MEMORY
28F800C2, 28F160C2 (x16)
Flexible SmartVoltage Technology
2.4 V–3.0 V Read/Program/Erase
12 V for Fast Production
Programming
High Performance
2.4 V–3.0 V: 100 ns Max Access
Time
2.7 V–3.0 V: 90 ns Max Access Time
Optimized Architecture for Code Plus
Data Storage
Eight 4- Kword Blocks,
Top or Bottom Locations
Up to Sixty-Three 32-Kword Blocks
Fast Program Suspend Capability
Fast Erase Suspend Capability
Flexible Block Locking
Lock/Unlock Any Block
Full Protection on Power-Up
WP# Pin for Hardware Block
Protection
V
PP
=
GND Option
V
CC
Lockout Voltage
Low Power Consumption
8 mA Typical Read Power
10 µA Typical Standby Power with
Automatic Power Savings Feature
Extended Temperature Operation
–40 °C to +85 °C
n
n
n
n
Improved 12 V Production
Programming
Faster Production Programming
No Additional System Logic
128-bit Protection Register
64-bit Unique Device Identifier
64-bit User Programmable OTP
Cells
Extended Cycling Capability
Minimum 100,000 Block Erase
Cycles
Supports Flash Data Integrator
Software
Flash Memory Manager
System Interrupt Manager
Supports Parameter Storage,
Streaming Data (e.g., voice)
Automated Word/Byte Program and
Block Erase
Command User Interface
Status Registers
Cross-Compatible Command Support
Intel Basic Command Set
Common Flash Interface
x16 I/O for Various Applications
48-Ball
µBGA*
Package
48-Lead TSOP Package
0.25
µ
ETOX™ VI Flash Technology
n
n
n
n
n
n
n
The 0.25 µm 2.4 Volt Advanced+ Boot Block flash memory, manufactured on Intel’s latest 0.25 µ technology,
represents a feature-rich solution for low power applications. These flash memory devices incorporate low
voltage capability (2.4 V read, program and erase) with high-speed, low-power operation. Flexible block
locking allows any block to be independently locked or unlocked. A 128-bit protection register enhances
customers’ ability to develop secure systems. Add to this the Intel-developed Flash Data Integrator (FDI)
software and you have a cost-effective, flexible, monolithic code plus data storage solution. 2.4 Volt
Advanced+ Boot Block products will be available in 48-lead TSOP and 48-ball µBGA* packages. All devices
have a 16-bit data bus. Additional information on this product family can be obtained by accessing Intel’s
Flash website: http://www.intel.com/design/flash.
June 1999
Order Number: 290647-002

TE28F800C2TA120 Related Products

TE28F800C2TA120 GT28F160C2TA100 GT28F160C2BA100 GT28F160C2BA120 TE28F160C2TA120 TE28F160C2BA100 TE28F160C2BA120 TE28F160C2TA100 TE28F800C2BA100 TE28F800C2TA100
Description Flash, 512KX16, 120ns, PDSO48, 12 X 20 MM, TSOP-48 Flash, 1MX16, 100ns, PBGA48, CSP, MICRO, BGA-48 Flash, 1MX16, 100ns, PBGA48, CSP, MICRO, BGA-48 Flash, 1MX16, 120ns, PBGA48, CSP, MICRO, BGA-48 Flash, 1MX16, 120ns, PDSO48, 12 X 20 MM, TSOP-48 Flash, 1MX16, 100ns, PDSO48, 12 X 20 MM, TSOP-48 Flash, 1MX16, 120ns, PDSO48, 12 X 20 MM, TSOP-48 Flash, 1MX16, 100ns, PDSO48, 12 X 20 MM, TSOP-48 Flash, 512KX16, 100ns, PDSO48, 12 X 20 MM, TSOP-48 Flash, 512KX16, 100ns, PDSO48, 12 X 20 MM, TSOP-48
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code TSOP BGA BGA BGA TSOP TSOP TSOP TSOP TSOP TSOP
package instruction 12 X 20 MM, TSOP-48 CSP, MICRO, BGA-48 VFBGA, BGA48,6X8,30 VFBGA, BGA48,6X8,30 12 X 20 MM, TSOP-48 12 X 20 MM, TSOP-48 12 X 20 MM, TSOP-48 12 X 20 MM, TSOP-48 12 X 20 MM, TSOP-48 12 X 20 MM, TSOP-48
Contacts 48 48 48 48 48 48 48 48 48 48
Reach Compliance Code compli compli compli compli unknow unknow unknow unknow compli compli
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 120 ns 100 ns 100 ns 120 ns 120 ns 100 ns 120 ns 100 ns 100 ns 100 ns
Other features TOP BOOT BLOCK TOP BOOT BLOCK BOTTOM BOOT BLOCK BOTTOM BOOT BLOCK TOP BOOT BLOCK BOTTOM BOOT BLOCK BOTTOM BOOT BLOCK TOP BOOT BLOCK BOTTOM BOOT BLOCK TOP BOOT BLOCK
startup block TOP TOP BOTTOM BOTTOM TOP BOTTOM BOTTOM TOP BOTTOM TOP
command user interface YES YES YES YES YES YES YES YES YES YES
Universal Flash Interface YES YES YES YES YES YES YES YES YES YES
Data polling NO NO NO NO NO NO NO NO NO NO
JESD-30 code R-PDSO-G48 R-PBGA-B48 R-PBGA-B48 R-PBGA-B48 R-PDSO-G48 R-PDSO-G48 R-PDSO-G48 R-PDSO-G48 R-PDSO-G48 R-PDSO-G48
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0 e0 e0
length 18.4 mm 9.81 mm 9.81 mm 9.81 mm 18.4 mm 18.4 mm 18.4 mm 18.4 mm 18.4 mm 18.4 mm
memory density 8388608 bi 16777216 bi 16777216 bi 16777216 bi 16777216 bi 16777216 bi 16777216 bi 16777216 bi 8388608 bi 8388608 bi
Memory IC Type FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH
memory width 16 16 16 16 16 16 16 16 16 16
Number of functions 1 1 1 1 1 1 1 1 1 1
Number of departments/size 8,15 8,31 8,31 8,31 8,31 8,31 8,31 8,31 8,15 8,15
Number of terminals 48 48 48 48 48 48 48 48 48 48
word count 524288 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 524288 words 524288 words
character code 512000 1000000 1000000 1000000 1000000 1000000 1000000 1000000 512000 512000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
organize 512KX16 1MX16 1MX16 1MX16 1MX16 1MX16 1MX16 1MX16 512KX16 512KX16
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSOP1 VFBGA VFBGA VFBGA TSOP1 TSOP1 TSOP1 TSOP1 TSOP1 TSOP1
Encapsulate equivalent code TSSOP48,.8,20 BGA48,6X8,30 BGA48,6X8,30 BGA48,6X8,30 TSSOP48,.8,20 TSSOP48,.8,20 TSSOP48,.8,20 TSSOP48,.8,20 TSSOP48,.8,20 TSSOP48,.8,20
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 2.4/3 V 2.4/3 V 2.4/3 V 2.4/3 V 2.4/3 V 2.4/3 V 2.4/3 V 2.4/3 V 2.4/3 V 2.4/3 V
Programming voltage 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm 1 mm 1 mm 1 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm
Department size 4K,32K 4K,32K 4K,32K 4K,32K 4K,32K 4K,32K 4K,32K 4K,32K 4K,32K 4K,32K
Maximum standby current 0.000005 A 0.000005 A 0.000005 A 0.000005 A 0.000005 A 0.000005 A 0.000005 A 0.000005 A 0.000005 A 0.000005 A
Maximum slew rate 0.055 mA 0.055 mA 0.055 mA 0.055 mA 0.055 mA 0.055 mA 0.055 mA 0.055 mA 0.055 mA 0.055 mA
Maximum supply voltage (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V
Minimum supply voltage (Vsup) 2.4 V 2.4 V 2.4 V 2.4 V 2.4 V 2.4 V 2.4 V 2.4 V 2.4 V 2.4 V
Nominal supply voltage (Vsup) 2.4 V 2.4 V 2.4 V 2.4 V 2.4 V 2.4 V 2.4 V 2.4 V 2.4 V 2.4 V
surface mount YES YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING BALL BALL BALL GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.5 mm 0.75 mm 0.75 mm 0.75 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm
Terminal location DUAL BOTTOM BOTTOM BOTTOM DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
switch bit NO NO NO NO NO NO NO NO NO NO
type NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE
width 12 mm 7.58 mm 7.58 mm 7.58 mm 12 mm 12 mm 12 mm 12 mm 12 mm 12 mm
Base Number Matches 1 1 1 1 1 1 1 1 1 1
Electronic filter design
:Sweat: Can you give me a complete version?...
luolin3858 Analog electronics
Please help me get out of the misunderstanding of ARM learning
I have been studying embedded technology since this time last year. Here are some questions I have. I would like to ask the experts for guidance. 1. I started learning embedded technology from ARM. Be...
123sqq ARM Technology
[Original] When the MCU is working, the voltage suddenly becomes unstable. What is the status of the program running? Experts, please give me some advice! !
When the MCU is running, the voltage suddenly becomes unstable, sometimes high and sometimes low, but not low enough to reset the MCU program. It's just that the voltage fluctuates violently. I want t...
jakey0225 Microcontroller MCU
Isolated low power pH test system with temperature compensation
>>Isolated low power consumption pH value test system with temperature compensation[media=x,500,375]http://v.youku.com/v_show/id_XNzkxOTUwMTAw.html[/media]...
雨中 ADI Reference Circuit
Where are the WinCE desktop drawing and key processing functions?
My desktop only shows the file name but not the icon. Double clicking the lnk file does not open the corresponding file. I am depressed. I read the code and think that CDefShellView::Refresh() is used...
liweify Embedded System
Windows Embedded CE 60.pdf
Windows Embedded CE 60.pdf...
yuandayuan6999 MCU

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1253  782  57  1732  662  26  16  2  35  14 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号