MMSD4148, SMMSD4148
Switching Diode
Features
•
•
•
•
SOD−123 Surface Mount Package
High Breakdown Voltage
Fast Speed Switching Time
S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable*
•
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS
Rating
Continuous Reverse Voltage
Forward Current
Forward Surge Current
(Note 1)
t < 1 sec
t = 1
msec
Symbol
V
R
I
F
I
FSM
I
FRM
T
J
, T
stg
Value
100
200
1.0
2.0
0.5
−55 to
+150
Unit
V
mA
A
A
°C
www.onsemi.com
SOD−123
CASE 425
STYLE 1
1
CATHODE
2
ANODE
Repetitive Peak Forward Current
(Pulse Wave = 1 sec, Duty Cycle = 66%)
Operating and Storage Junction Temperature
Range
MARKING DIAGRAM
1
5I M
G
G
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Typical Values
5I
M
G
= Device Code
= Date Code
= Pb−Free Package
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR−5 Board (Note 2)
T
A
= 25°C
Derate above 25°C
Thermal Resistance Junction−to−Ambient
2. FR−5 = 1.0 oz Cu, 1.0 in
z
pad
Symbol
P
D
Max
425
3.4
R
qJA
290
Unit
mW
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
SOD−123
(Pb−Free)
SOD−123
(Pb−Free)
SOD−123
(Pb−Free)
SOD−123
(Pb−Free)
Shipping
†
3,000 /
Tape & Reel
3,000 /
Tape & Reel
10,000 /
Tape & Reel
10,000 /
Tape & Reel
mW/°C
°C/W
MMSD4148T1G
SMMSD4148T1G*
MMSD4148T3G
SMMSD4148T3G*
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2016
1
June, 2016 − Rev. 13
Publication Order Number:
MMSD4148T1/D
MMSD4148, SMMSD4148
ELECTRICAL CHARACTERISTICS
(T
A
= 25°C unless otherwise noted)
Characteristic
OFF CHARACTERISTICS
Reverse Breakdown Voltage
(I
BR
= 100
mA)
Reverse Voltage Leakage Current
(V
R
= 20 V)
(V
R
= 75 V)
Forward Voltage
(I
F
= 10 mA)
Diode Capacitance
(V
R
= 0 V, f = 1.0 MHz)
Reverse Recovery Time
(I
F
= I
R
= 10 mA) (Figure 1)
V
(BR)
100
I
R
−
−
V
F
−
C
D
−
t
rr
−
4.0
4.0
ns
1000
pF
25
5.0
nA
mA
mV
−
V
Symbol
Min
Max
Unit
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
820
W
+10 V
2k
100
mH
0.1
mF
DUT
50
W
OUTPUT
PULSE
GENERATOR
50
W
INPUT
SAMPLING
OSCILLOSCOPE
90%
V
R
INPUT SIGNAL
I
R
i
R(REC)
= 1 mA
OUTPUT PULSE
(I
F
= I
R
= 10 mA; measured
at i
R(REC)
= 1 mA)
I
F
0.1
mF
t
r
10%
t
p
t
I
F
t
rr
t
1. A 2.0 kW variable resistor adjusted for a Forward Current (I
F
) of 10 mA.
2. Input pulse is adjusted so I
R(peak)
is equal to 10 mA.
3. t
p
» t
rr
Figure 1. Recovery Time Equivalent Test Circuit
www.onsemi.com
2
MMSD4148, SMMSD4148
PACKAGE DIMENSIONS
SOD−123
CASE 425−04
ISSUE G
D
A
A1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
A
A1
b
c
D
E
H
E
L
q
MIN
0.94
0.00
0.51
---
1.40
2.54
3.56
0.25
0
°
MILLIMETERS
NOM
MAX
1.17
1.35
0.05
0.10
0.61
0.71
---
0.15
1.60
1.80
2.69
2.84
3.68
3.86
---
---
---
10
°
MIN
0.037
0.000
0.020
---
0.055
0.100
0.140
0.010
0
°
INCHES
NOM
0.046
0.002
0.024
---
0.063
0.106
0.145
---
---
MAX
0.053
0.004
0.028
0.006
0.071
0.112
0.152
---
10
°
H
E
2.36
0.093
4.19
0.165
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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www.onsemi.com
4
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ÉÉ
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ÂÂÂÂ
ÂÂÂÂ
2
1
E
q
b
C
L
STYLE 1:
PIN 1. CATHODE
2. ANODE
SOLDERING FOOTPRINT*
0.91
0.036
1.22
0.048
SCALE 10:1
mm
inches
MMSD4148T1/D
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