RB520S30T1G,
RB520S30T5G
Schottky Barrier Diode
These Schottky barrier diodes are designed for high−speed
switching applications, circuit protection, and voltage clamping.
Extremely low forward voltage reduces conduction loss. Miniature
surface mount package is excellent for hand−held and portable
applications where space is limited.
Features
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•
•
•
•
Extremely Fast Switching Speed
Extremely Low Forward Voltage 0.6 V (max) @ I
F
= 200 mA
Low Reverse Current
ESD Rating: Class 3B per Human Body Model
Class C per Machine Model
•
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS
Rating
Reverse Voltage
Forward Current DC
Symbol
V
R
I
F
Value
30
200
Unit
Vdc
mA
30 VOLT SCHOTTKY
BARRIER DIODE
1
CATHODE
2
ANODE
2
1
SOD−523
CASE 502
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
MARKING DIAGRAM
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR−5 Board,
(Note 1) T
A
= 25°C
Derate above 25°C
Thermal Resistance, Junction−to−Ambient
Junction and Storage Temperature Range
Non−Repetitive Peak Forward
Current, t
p
< 10 msec
Repetitive Peak Forward Current
Pulse Wave = 1 sec, Duty Cycle = 66%
Thermal Resistance,
Junction−to−Ambient
1. FR−5 Minimum Pad.
Symbol
P
D
Max
200
1.57
R
qJA
T
J
, T
stg
I
FSM
I
FRM
R
qJA
635
−55 to +150
600
300
635
Unit
mW
mW/°C
°C/W
°C
mA
mA
1
5J M
G
G
2
5J = Device Code
M = Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation position may vary depending
upon manufacturing location.
ORDERING INFORMATION
°C/W
Device
RB520S30T1G
Package
SOD−523
(Pb−Free)
SOD−523
(Pb−Free)
Shipping
†
4 mm Pitch
3000/Tape & Reel
2 mm Pitch
8000/Tape & Reel
ELECTRICAL CHARACTERISTICS
(T
A
= 25°C unless otherwise noted)
Characteristic
Reverse Leakage
(V
R
= 10 V)
Forward Voltage
(I
F
= 200 mA)
Symbol
I
R
V
F
Min
−
−
Typ
−
−
Max
1.0
0.60
Unit
mA
Vdc
RB520S30T5G
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2011
1
August, 2017 − Rev. 11
Publication Order Number:
RB520S30T1/D
RB520S30T1G, RB520S30T5G
820
W
+10 V
2k
100
mH
0.1
mF
DUT
50
W
Output
Pulse
Generator
50
W
Input
Sampling
Oscilloscope
90%
V
R
INPUT SIGNAL
I
R
i
R(REC)
= 1 mA
OUTPUT PULSE
(I
F
= I
R
= 10 mA; measured
at i
R(REC)
= 1 mA)
I
F
0.1
mF
t
r
t
p
10%
t
I
F
t
rr
t
Notes: 1. A 2.0 kW variable resistor adjusted for a Forward Current (I
F
) of 10 mA.
Notes:
2. Input pulse is adjusted so I
R(peak)
is equal to 10 mA.
Notes:
3. t
p
» t
rr
Figure 1. Recovery Time Equivalent Test Circuit
200
100
I
F
, FORWARD CURRENT (mA)
1000
T
A
=
150°C
100
I
R
, REVERSE CURRENT (mA)
T
A
=
125°C
10
1.0
T
A
=
85°C
0.1
0.01
T
A
=
25°C
1 50°C
10
1 25°C
85°C
25°C
−40°C
−55°C
0.4
0.5
0.6
1.0
0.1
0.0
0.001
0.1
0.2
0.3
0
5
10
15
20
25
30
V
F
, FORWARD VOLTAGE (VOLTS)
V
R
, REVERSE VOLTAGE (VOLTS)
Figure 2. Forward Voltage
Figure 3. Leakage Current
I
FSM
, FORWARD SURGE MAX CURRENT (A)
14
12
C
T
, TOTAL CAPACITANCE (pF)
10
8
6
4
2
0
0
5
10
15
20
25
30
25
Based on square wave currents
T
J
= 25°C prior to surge
20
15
10
5
0
0.001
0.01
0.1
1
10
100
1000
V
R
, REVERSE VOLTAGE (VOLTS)
t
P
, PULSE ON TIME (ms)
Figure 4. Total Capacitance
Figure 5. Forward Surge Current
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2
RB520S30T1G, RB520S30T5G
PACKAGE DIMENSIONS
SOD−523
CASE 502
ISSUE E
−X−
D
−Y−
E
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO-
TRUSIONS, OR GATE BURRS.
DIM
A
b
c
D
E
H
E
L
L2
MILLIMETERS
MIN
NOM
MAX
0.50
0.60
0.70
0.25
0.30
0.35
0.07
0.14
0.20
1.10
1.20
1.30
0.70
0.80
0.90
1.50
1.60
1.70
0.30 REF
0.15
0.20
0.25
b
0.08
1
M
2
X Y
TOP VIEW
A
c
H
E
SIDE VIEW
2X
RECOMMENDED
SOLDERING FOOTPRINT*
L
2X
1.80
2X
0.48
0.40
2X
L2
PACKAGE
OUTLINE
DIMENSION: MILLIMETERS
BOTTOM VIEW
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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3
RB520S30T1/D
Embedded System
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