HBL5006 Series
LED Shunt
The HBL5006 Series are electronic shunts which provide a current
bypass in the case of LEDs going into open circuit. LEDs are by nature
quite fragile when subjected to transients and surge conditions. There
are also many cases where high reliability of the LED lighting must be
maintained such as in headlights, lighthouses, bridges, aircraft, runways
and so forth. In these cases the low cost addition of the shunt device will
provide full assurance that an entire string of LEDs will not extinguish
should one LED fail open. The shunt device is also applicable to other
loads where circuit continuity is required. The devices are designed to
be used with LED string currents from 50 to 350 mA.
Features
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MARKING
DIAGRAMS
SOD−323
CASE 477
1
HD
M
2
•
Protection for the Following IEC Standards:
•
•
•
•
•
•
•
•
•
•
•
•
IEC 61000−4−2 (Level 4)
ISO 10605
Low ESD Clamping Voltage
Automatically Resets Itself if the LED Heals Itself or is Replaced
ON−State Voltage Typically 1.1 V
OFF−State Current less than 1.0
mA
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
These Devices are Pb−Free and are RoHS Compliant
SOD−523
CASE 502
1
56
M
2
LD M
2
SOD−923
CASE 514AB
XX
M
1
= Specific Device Code
= Date Code
Typical Applications
HBL5006
LEDs where Preventive Maintenance is Impractical
LED Headlights in Automobiles
Automotive LED Applications
LEDs with High Reliability Requirements
Crowbar Protection for Open Circuit Conditions
Overvoltage Protection for Sensitive Circuits
Control
Circuit
ESD
1
+
HBL5006
−
2
Apply heat sinking to pin 2
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
©
Semiconductor Components Industries, LLC, 2014
1
August, 2014 − Rev. 0
Publication Order Number:
HBL5006/D
HBL5006 Series
MAXIMUM RATINGS
Rating
On−State Current, (T
A
= 25°C) (Note 2)
SOD−323 (Note 1)
SOD−323 (Note 2)
SOD−523 (Note 1)
SOD−523 (Note 2)
SOD−923 (Note 1)
SOD−923 (Note 2)
Thermal Resistance, Junction−to−Air (All Packages)
SOD−323 (Note 1)
SOD−323 (Note 2)
SOD−523 (Note 1)
SOD−523 (Note 2)
SOD−923 (Note 1)
SOD−923 (Note 2)
Operating Temperature Range
Non−Operating Temperature Range
Lead Temperature, Soldering (10 Sec)
IEC 61000−4−2 Contact (ESD)
IEC 61000−4−2 Air (ESD)
(Note 3)
T
J
T
J
T
L
ESD
ESD
q
JA
Symbol
I
T(AVG)
Value
250
200
300
250
350
300
435
550
360
435
285
360
−40 to 150
150
260
±15
±15
°C
°C
°C
kV
°C/W
Unit
mA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Mounted onto a 2−layer, 1000 mm
2
per layer, 3 oz Cu, FR4 PCB with pin 2 connected to the heat sink and pin 1 only connected to a signal
trace. The heat sinking must be connected to pin 2, which is the LED cathode connection.
Normally this device would be mounted on the same copper heat sink and adjacent to the LED(s). If the LED(s) were to go open, then the
HBL shunt would now dissipate the power using the same copper heat sink. Since the shunt has a voltage that is nominally 30% of the LED,
then the power dissipation would be much lower, and easily handled by the same heat sink as the LED.
2. Mounted onto a 2−layer, 50 mm
2
per layer, 1 oz Cu, FR4 PCB.
3. Max operating temperature for DC conditions is 150°C, but not to exceed 175°C for pulsed conditions with low duty cycle or non−repetitive.
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2
HBL5006 Series
ELECTRICAL CHARACTERISTICS
(Unless otherwise noted: T
A
= 25°C)
Symbol
V
BR
Characteristics
Breakdown Voltage: The minimum voltage across the device in or
at the breakdown region. Measured at I
BR
= 1 mA.
Package
SOD−323
SOD−523
SOD−923
I
H
Holding Current: The minimum current required to maintain the
device in the on-state.
SOD−323
SOD−523
SOD−923
I
L
Latching Current: The minimum current required to turn from the
off-state to the on-state.
SOD−323
SOD−523
SOD−923
V
BO
Breakover Voltage: The voltage across the device in the breakover
region.
SOD−323
SOD−523
SOD−923
I
R
Off−State Current: The dc value of current that results from the
application of the off-state voltage. Measured at 3.3 V.
SOD−323
SOD−523
SOD−923
V
T
On−State Voltage. Measured at 100 mA.
SOD−323
SOD−523
SOD−923
V
C
Clamping Voltage
TLP (Note 4)
I
PP
= 8 A
SOD−323
6100−4−2
equivalent
}
IECkV Contact,Level 2 Air)
(±4
±4
kV
6100−4−2
4
}
IECkV Contact,LevelkVequivalent
(±8
±15
Air)
SOD−523
SOD−923
0.9
0.9
0.9
1.1
1.1
1.1
6.5
11.2
6.5
11.2
6.5
11.2
6.5
6.5
6.5
Min
6.2
6.2
6.2
Typ
7.0
7.0
7.0
25
25
25
9.0
9.0
9.0
7.2
7.2
7.2
8.0
8.0
8.0
1.0
1.0
1.0
1.3
1.3
1.3
V
V
mA
V
40
40
40
mA
mA
Max
Unit
V
I
PP
= 16 A
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. ANSI/ESD STM5.5.1 − Electrostatic Discharge Sensitivity Testing using Transmission Line Pulse (TLP) Model TLP conditions: Z
0
= 50
W,
t
p
= 100 ns, t
r
= 4 ns, averaging window; t
1
= 30 ns to t
2
= 60 ns.
Current
On−state
Current
Holding Current
Latching Current
Voltage
Off−state
Current
Breakdown
Voltage
Breakover
Voltage
Figure 1. I−V Characteristics
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3
HBL5006 Series
TYPICAL APPLICATION CIRCUIT
Typical Application Circuit for HBL5006
Current
Source
HBL5006
Control
Circuit
ESD
HBL5006
Control
Circuit
ESD
HBL5006
Control
Circuit
ESD
HBL5006
Control
Circuit
ESD
Figure 2. Typical Application Circuit
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4
HBL5006 Series
DEVICE ORDERING INFORMATION
Device
HBL5006HT1G
SZHBL5006HT1G*
HBL5006XV2T1G
SZHBL5006XV2T1G*
HBL5006P2T5G
SZHBL5006P2T5G*
Marking
HD
HD
56
56
LD
LD
Package
SOD−323
(Pb−Free)
SOD−523
(Pb−Free)
SOD−923
(Pb−Free)
Shipping
†
3000 / Tape & Reel
3000 / Tape & Reel
8000 / Tape & Reel
†For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
*SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP
Capable.
PACKAGE DIMENSIONS
SOD−323
CASE 477−02
ISSUE H
H
E
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. LEAD THICKNESS SPECIFIED PER L/F DRAWING
WITH SOLDER PLATING.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
5. DIMENSION L IS MEASURED FROM END OF RADIUS.
MILLIMETERS
DIM MIN
NOM MAX
A
0.80
0.90
1.00
A1
0.00
0.05
0.10
A3
0.15 REF
b
0.25
0.32
0.4
C
0.089
0.12 0.177
D
1.60
1.70
1.80
E
1.15
1.25
1.35
L
0.08
H
E
2.30
2.50
2.70
MIN
0.031
0.000
INCHES
NOM MAX
0.035 0.040
0.002 0.004
0.006 REF
0.010 0.012 0.016
0.003 0.005 0.007
0.062 0.066 0.070
0.045 0.049 0.053
0.003
0.090 0.098 0.105
b
1
2
E
A3
A
L
NOTE 5
C
NOTE 3
A1
SOLDERING FOOTPRINT*
0.63
0.025
0.83
0.033
1.60
0.063
2.85
0.112
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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5
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