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1SMA5941BT3G

Description
Accuracy: ±5% Regulated voltage value (typical value): 47V Reverse leakage current: 500nA @ 35.8V Maximum power: 1.5W 47V, 1.5W
CategoryDiscrete semiconductor    diode   
File Size70KB,5 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
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1SMA5941BT3G Overview

Accuracy: ±5% Regulated voltage value (typical value): 47V Reverse leakage current: 500nA @ 35.8V Maximum power: 1.5W 47V, 1.5W

1SMA5941BT3G Parametric

Parameter NameAttribute value
Brand NameON Semiconductor
Is it lead-free?Lead free
MakerON Semiconductor
package instructionR-PDSO-C2
Contacts2
Manufacturer packaging code403D-02
Reach Compliance Codenot_compliant
ECCN codeEAR99
Factory Lead Time1 week
Samacsys Confidence2
Samacsys StatusReleased
Samacsys PartID410556
Samacsys Pin Count2
Samacsys Part CategoryZener Diode
Samacsys Package CategoryDiodes Moulded
Samacsys Footprint NameSMA CASE 403D-02
Samacsys Released Date2017-05-04 08:31:21
Is SamacsysN
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
Maximum dynamic impedance67 Ω
JESD-30 codeR-PDSO-C2
JESD-609 codee3
Humidity sensitivity level1
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-65 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
polarityUNIDIRECTIONAL
Maximum power dissipation0.5 W
Certification statusNot Qualified
Nominal reference voltage47 V
surface mountYES
technologyZENER
Terminal surfaceTin (Sn)
Terminal formC BEND
Terminal locationDUAL
Maximum time at peak reflow temperature40
Maximum voltage tolerance5%
Working test current8 mA
Base Number Matches1
1SMA59xxBT3G Series,
SZ1SMA59xxBT3G Series
1.5 Watt Plastic
Surface Mount
Zener Voltage Regulators
This complete new line of 1.5 Watt Zener Diodes offers the
following advantages.
Features
www.onsemi.com
Standard Zener Breakdown Voltage Range − 3.3 V to 68 V
ESD Rating of Class 3 (> 16 kV) per Human Body Model
Flat Handling Surface for Accurate Placement
Package Design for Top Slide or Bottom Circuit Board Mounting
Low Profile Package
Ideal Replacement for MELF Packages
AEC−Q101 Qualified and PPAP Capable − SZ1SMA59xxBT3G
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
These are Pb−Free Devices*
Mechanical Characteristics:
CASE:
Void-free, transfer-molded plastic
FINISH:
All external surfaces are corrosion resistant with readily
SMA
CASE 403D
STYLE 1
CATHODE
ANODE
MARKING DIAGRAM
8xxB
AYWWG
solderable leads
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 seconds
POLARITY:
Cathode indicated by molded polarity notch or cathode
band
FLAMMABILITY RATING:
UL 94 V−0 @ 0.125 in
MAXIMUM RATINGS
Rating
DC Power Dissipation @ T
L
= 75°C,
Measured Zero Lead Length (Note 1)
Derate above 75°C
Thermal Resistance, Junction−to−Lead
DC Power Dissipation @ T
A
= 25°C (Note 2)
Derate above 25°C
Thermal Resistance, Junction−to−Ambient
Operating and Storage Temperature Range
Symbol
P
D
R
qJL
P
D
R
qJA
T
J
, T
stg
1.5
20
50
0.5
4.0
250
−65 to
+150
W
mW/°C
°C/W
W
mW/°C
°C/W
°C
Value
Unit
8xxB
A
Y
WW
G
= Device Code (Refer to page 2)
= Assembly Location
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
Device
1SMA59xxBT3G
SZ1SMA59xxBT3G
Package
SMA
(Pb−Free)
SMA
(Pb−Free)
Shipping
5,000 /
Tape & Reel
5,000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. 1 in square copper pad, FR−4 board.
2. FR−4 Board, using ON Semiconductor minimum recommended footprint.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 2 of
this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2016
1
August, 2016 − Rev. 10
Publication Order Number:
1SMA5913BT3/D

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