BAS40-06HMFHT116 datasheet, PDF

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BAS40-06HMFHT116: DescriptionDC reverse withstand voltage (Vr): 40V Average rectified current (Io): 120mA Forward voltage drop (Vf): 1V @ 40mA; CategoryDiscrete semiconductor diode; File Size957KB，7 Pages; ManufacturerROHM Semiconductor; Websitehttps://www.rohm.com/

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BAS40-06HMFHT116 Overview

DC reverse withstand voltage (Vr): 40V Average rectified current (Io): 120mA Forward voltage drop (Vf): 1V @ 40mA

BAS40-06HMFHT116 Parametric

Parameter Name	Attribute value
Maker	ROHM Semiconductor
package instruction	R-PDSO-G3
Reach Compliance Code	unknown
Factory Lead Time	12 weeks
Other features	HIGH RELIABILITY
application	GENERAL PURPOSE
Configuration	COMMON ANODE, 2 ELEMENTS
Diode component materials	SILICON
Diode type	RECTIFIER DIODE
Maximum forward voltage (VF)	1 V
JESD-30 code	R-PDSO-G3
Maximum non-repetitive peak forward current	0.6 A
Number of components	2
Phase	1
Number of terminals	3
Maximum operating temperature	150 °C
Maximum output current	0.12 A
Package body material	PLASTIC/EPOXY
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Guideline	AEC-Q101
Maximum repetitive peak reverse voltage	40 V
Maximum reverse current	10 µA
Reverse test voltage	40 V
surface mount	YES
technology	SCHOTTKY
Terminal form	GULL WING
Terminal location	DUAL

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Schottky Barrier Diode

BAS40-06HMFH

Application

Small current rectification

2.4

Datasheet

Dimensions

(Unit : mm)

AEC-Q101 Qualified

Land

Size Figure

(Unit : mm)

1.9

Features

1) Small mold type

(SOT-23)

2) High reliability

3) Low V

ROHM : SSD3

JEDEC : SOT-23

JEITA : -

1.0MIN

SOT-23

0.8MIN

Structure

(3)

(1) Cathode

(2) Cathode

(1)

(2)

(3) Anode

Construction

Silicon epitaxial planar type

Taping

Dimensions

(Unit : mm)

T116

Absolute

Maximum Ratings

= 25°C)

Parameter

Repetitive peak reverse voltage

Reverse voltage

Average forward rectified current

Repetitive peak forward current

Non-repetitive forward surge current

Symbol

FRM

FSM

stg

Conditions

Duty≦0.5

Direct reverse voltage

Direct current, per diode

≦1s,

Duty≦0.5, per diode

Square wave, tp<10ms,

non-repetitive at T

=25ºC, per diode

Limits

120

0.6

150

55

150

Unit

°C

Operating junction temperature

Storage temperature

Electrical

Characteristics

= 25°C)

Parameter

Symbol

Forward voltage

Reverse current

Conditions

=1mA

=10mA

=40mA

=30V

=40V

Min.

Typ. Max. Unit

0.38

0.50

A

www.rohm.com

1/3

2016.11 - Rev.B

Notice

Precaution on using ROHM Products

If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment

aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,

bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales

representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any

ROHM’s Products for Specific Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

CHINA

CLASSⅢ

CLASSⅡb

CLASSⅢ

CLASSⅣ

CLASSⅢ

ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

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Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the

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[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl

S, NH

, SO

, and NO

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[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

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[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

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[h] Use of the Products in places subject to dew condensation

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Please verify and confirm characteristics of the final or mounted products in using the Products.

In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

Confirm that operation temperature is within the specified range described in the product specification.

ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

(Note 1)

Precaution for Mounting / Circuit board design

When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PAA-E

Rev.003

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are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

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caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

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isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

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Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

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exceeding the recommended storage time period.

Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

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Other Precaution

Notice-PAA-E

Rev.003

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