M24C32-WMN6TP datasheet, PDF - EEWORLD Datasheet

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M24C32-WMN6TP: DescriptionMemory interface type: I2C Memory capacity: 32Kb (4K x 8) Working voltage: 2.5V ~ 5.5V Memory type: Non-Volatile 32-Kbit (4K x 8bit), I2C interface, working voltage: 2.5V to 5.5V; Categorystorage storage; File Size274KB，39 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/

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M24C32-WMN6TP Overview

Memory interface type: I2C Memory capacity: 32Kb (4K x 8) Working voltage: 2.5V ~ 5.5V Memory type: Non-Volatile 32-Kbit (4K x 8bit), I2C interface, working voltage: 2.5V to 5.5V

M24C32-WMN6TP Parametric

Parameter Name	Attribute value
Brand Name	STMicroelectronics
Maker	STMicroelectronics
Parts packaging code	SOIC
package instruction	SOP,
Contacts	8
Reach Compliance Code	compliant
Factory Lead Time	13 weeks
Samacsys Description	M24C32-WMN6TP, Serial EEPROM Memory 32kbit, Serial-I2C, 900ns 2.5 → 5.5 V, 8-Pin SOIC
Maximum clock frequency (fCLK)	1 MHz
JESD-30 code	R-PDSO-G8
JESD-609 code	e4
length	4.9 mm
memory density	32768 bit
Memory IC Type	EEPROM
memory width	8
Humidity sensitivity level	1
Number of functions	1
Number of terminals	8
word count	4096 words
character code	4000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	4KX8
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Maximum seat height	1.75 mm
Serial bus type	I2C
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	3.9 mm
Maximum write cycle time (tWC)	5 ms

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M24128

M24C64 M24C32

128 Kbit, 64 Kbit and 32 Kbit serial I²C bus EEPROM

Features

■

Two-wire I

C serial interface

supports 400 kHz protocol

Single supply voltages (see

Table 1

for root

part numbers):

– 2.5 V to 5.5 V

– 1.8 V to 5.5 V

– 1.7 V to 5.5 V

Write Control input

Byte and Page Write

Random and Sequential Read modes

Self-timed programming cycle

Automatic address incrementing

Enhanced ESD/latch-up protection

More than 1 Million write cycles

More than 40-year data retention

Packages

– ECOPACK

(RoHS compliant)

Device summary

Part number

M24128-BW

Supply voltage

2.5 V to 5.5V

1.8 V to 5.5V

1.7 V to 5.5V

2.5 V to 5.5V

1.8 V to 5.5V

1.7 V to 5.5V

2.5 V to 5.5V

1.8 V to 5.5V

1.7 V to 5.5V

WLCSP (CS)

PDIP8 (BN)

■

SO8 (MN)

150 mil width

Table 1.

Reference

TSSOP8 (DW)

169 mil width

M24128

M24128-BR

M24128-BF

M24C64-W

UFDFPN8 (MB)

2 × 3 mm (MLP)

M24C64

M24C64-R

M24C64-F

M24C32-W

M24C32

M24C32-R

M24C32-F

September 2008

Rev 15

1/39

www.st.com

Contents

M24128, M24C64, M24C32

Contents

Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Signal description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.1

2.2

2.3

2.4

2.5

2.6

Serial Clock (SCL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Serial Data (SDA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Chip Enable (E0, E1, E2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Write Control (WC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Supply voltage (V

) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

2.6.1

2.6.2

2.6.3

2.6.4

Operating supply voltage V

CC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Power-up conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Device reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Power-down conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Memory organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

4.1

4.2

4.3

4.4

4.5

4.6

4.7

4.8

4.9

4.10

4.11

4.12

4.13

4.14

4.15

Start condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Stop condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Acknowledge bit (ACK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Data Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Memory addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Write operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Byte Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Page Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

ECC (error correction code) and write cycling . . . . . . . . . . . . . . . . . . . . . 17

Minimizing system delays by polling on ACK . . . . . . . . . . . . . . . . . . . . . . 18

Read operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Random Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Current Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Sequential Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Acknowledge in Read mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

2/39

List of tables

M24128, M24C64, M24C32

List of tables

Table 1.

Table 2.

Table 3.

Table 4.

Table 5.

Table 6.

Table 7.

Table 8.

Table 9.

Table 10.

Table 11.

Table 12.

Table 13.

Table 14.

Table 15.

Table 16.

Table 17.

Table 18.

Table 19.

Table 20.

Table 21.

Table 22.

Table 23.

Table 24.

Table 25.

Table 26.

Table 27.

Table 28.

Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Address most significant byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Address least significant byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Operating modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Operating conditions (M24xxx-W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Operating conditions (M24xxx-R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Operating conditions (M24xxx-F) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

AC test measurement conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Input parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

DC characteristics (M24xxx-W, device grade 6). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

DC characteristics (M24xxx-W, device grade 3). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

DC characteristics (M24xxx-R - device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

DC characteristics (M24xxx-F) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

AC characteristics (M24xxx-W6, M24xxW3, M24xxR6) . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

AC characteristics (M24xxx-F) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

PDIP8 – 8 pin plastic DIP, 0.25 mm lead frame, package mechanical data. . . . . . . . . . . . 29

SO8 narrow – 8 lead plastic small outline, 150 mils body width,

package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

TSSOP8 – 8 lead thin shrink small outline, package mechanical data. . . . . . . . . . . . . . . . 31

UFDFPN8 (MLP8) – 8-lead ultra thin fine pitch dual flat package no lead

2 × 3mm, package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

M24128 WLCSP, 0.5 mm pitch, package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . 33

Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Available M24C32 products (package, voltage range, temperature grade) . . . . . . . . . . . . 35

Available M24C64 products (package, voltage range, temperature grade) . . . . . . . . . . . . 35

Available M24128 products (package, voltage range, temperature grade) . . . . . . . . . . . . 35

Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

4/39

M24128, M24C64, M24C32

List of figures

Figure 1.

Figure 2.

Figure 3.

Figure 4.

Figure 5.

Figure 6.

Figure 7.

Figure 8.

Figure 9.

Figure 10.

Figure 11.

Figure 12.

Figure 13.

Figure 14.

Figure 15.

Figure 16.

Figure 17.

Figure 18.

Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

DIP, SO, TSSOP and UFDFPN connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

M24128 WLCSP connections (top view, marking side, with balls on the

underside) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Maximum R

value versus bus parasitic capacitance (C) for an I

C bus . . . . . . . . . . . . . . 10

C bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Write mode sequences with WC = 1 (data write inhibited) . . . . . . . . . . . . . . . . . . . . . . . . . 15

Write mode sequences with WC = 0 (data write enabled) . . . . . . . . . . . . . . . . . . . . . . . . . 17

Write cycle polling flowchart using ACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Read mode sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

AC test measurement I/O waveform. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

PDIP8 – 8 pin plastic DIP, 0.25 mm lead frame, package outline . . . . . . . . . . . . . . . . . . . 29

SO8 narrow – 8 lead plastic small outline, 150 mils body width, package outline . . . . . . . 30

TSSOP8 – 8 lead thin shrink small outline, package outline . . . . . . . . . . . . . . . . . . . . . . . 31

UFDFPN8 (MLP8) – 8-lead ultra thin fine pitch dual flat package no lead

2 × 3mm, package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

M24128 WLCSP, 0.5 mm pitch, package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

5/39

M24C32-WMN6TP Related Products

	M24C32-WMN6TP	24C32W6 SOP-8
Description	Memory interface type: I2C Memory capacity: 32Kb (4K x 8) Working voltage: 2.5V ~ 5.5V Memory type: Non-Volatile 32-Kbit (4K x 8bit), I2C interface, working voltage: 2.5V to 5.5V	Memory interface type: I2C Memory capacity: 32Kb (4K x 8) Operating voltage: 2.5V ~ 5.5V Memory type: Non-Volatile 32KBIT I2C EEPROM memory

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