LRB751V-40T1G
S-LRB751V-40T1G
Schottky Barrier Diode
1. FEATURES
●
We declare that the material of product compliance with
RoHS requirements and Halogen Free.
S- prefix for automotive and other applications requiring
unique site and control change requirements; AEC-Q101
qualified and PPAP capable.
●
SOD323(SC-76)
●
●
Low reverse current and low voltage.
High reliability
2. APPLICATIONS
●
Low-power rectification
3. DEVICE MARKING AND ORDERING INFORMATION
Device
LRB751V-40T1G
LRB751V-40T3G
Marking
5E
5E
Shipping
3000/Tape&Reel
10000/Tape&Reel
4. MAXIMUM RATINGS(Ta = 25º
C)
Parameter
Peak Reverse Voltage
DC Reverse Voltage
Mean Rectifying Current
Peak Forward Surge Current
Symbol
VRM
VR
IO
IFSM
Limits
40
30
30
200
Unit
V
V
mA
mA
5. THERMAL CHARACTERISTICS
Parameter
Total Device Dissipation,
FR−5 Board (Note 1) @ TA = 25ºC
Derate above 25º
C
Thermal Resistance,
Junction–to–Ambient(Note 1)
Junction and Storage temperature
1. FR–5 = 1.0×0.75×0.062 in.
TJ,Tstg
−40∼+125
°
C
RΘJA
Symbol
PD
200
1.57
635
mW
mW/º
C
º
C/W
Limits
Unit
6. ELECTRICAL CHARACTERISTICS (Ta= 25
º
)
C
Characteristic
Forward voltage(IF=1mA)
Reverse Current(VR=30V)
Diode Capacitance(VR = 1V, f = 1.0 MHz)
Symbol
VF
IR
CT
Min.
-
-
-
Typ.
-
-
2
Max.
0.37
0.5
-
Unit
V
μA
pF
Leshan Radio Company, LTD.
Rev.B Feb 2016
1/3
LRB751V-40T1G, S-LRB751V-40T1G
Schottky Barrier Diode
7.ELECTRICAL CHARACTERISTICS CURVES
1000
1000
100
IF,Forward Current(mA)
IR,Reverse Current(uA)
100
125℃
10
1
25℃
0.1
0.01
-55℃
125℃
85℃
85℃
10
25℃
-55℃
1
0.001
0.1
0
0.5
1
1.5
VF,Forward Voltage(V)
2
0.0001
0
10
20
30
40
50
VR,Reverse Voltage(V)
60
70
Forward Characteristics
Reverse Characteristics
3
f=1MHz
C,Capacitor(pF)
2
1
0
0
5
10
15
VR, Reverse Voltage(V)
Capacitor Characteristics
Leshan Radio Company, LTD.
Rev.B Feb 2016
2/3
LRB751V-40T1G, S-LRB751V-40T1G
Schottky Barrier Diode
8.OUTLINE AND DIMENSIONS
Notes:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MILLIMETERS
INCHES
DIM
A
A1
A3
b
C
D
E
L
H
E
0.25
0.089
1.6
1.15
0.08
2.3
2.5
2.7
MIN
0.8
0
NOM
0.9
0.05
0.15REF
0.32
0.12
1.7
1.25
0.4
1.8
1.35
0.01
MAX
1
0.1
MIN
0
NOM
MAX
0.04
0.031 0.035
0.006REF
0.012 0.016
0.07
0.177 0.003 0.005 0.007
0.062 0.066
0.003
0.09
0.098 0.105
0.045 0.049 0.053
0.002 0.004
9. SOLDERING FOOTPRINT
Leshan Radio Company, LTD.
Rev.B Feb 2016
3/3