XBS304F11R-G
Schottky Barrier Diode, 3A, 40V Type
ETR16028-001
■FEATURES
Low Forward voltage
Environmentally Friendly
: EU RoHS Compliant
■APPLICATIONS
●Rectification
●Protection
against reverse connection of battery
■PRODUCT
NAME
PRODUCT NAME
XBS304F11R-G *
EU RoHS compliant.
* The high-melting solder paste (lead-containing) is used as attachment.
PACKAGE
SMA-PG
ORDER UNIT
1,800/Reel
■
PACKAGING INFORMATION
●SMA-PG
Unit : inch (mm)
* The “-G” suffix denotes Halogen and Antimony free as well as being fully
■MARKING
①②③④⑤⑥⑦⑧:
Control Number
■ABSOLUTE
MAXIMUM RATINGS
PARAMETER
Repetitive Peak Reverse Voltage
Reverse Voltage (DC)
Forward Current (Average) at Ta=75℃
Non Continuous
Forward Surge Current
(8.3 ms single half-sine wave)
Junction Temperature
Storage Temperature
Tj
Tstg
125
-55 to +150
I
FSM
50
SYMBOL
V
RM
V
R
I
F(AV)
RATINGS
40
40
3
Ta=25℃
UNITS
V
V
A
A
℃
℃
■ELECTRICAL
CHARACTERISTICS
LIMITS
PARAMETER
SYMBOL
V
F
１
V
F2
I
R1
Reverse Current
I
R2
V
R
=40V
2
I
F
=1A
I
F
=3A
V
R
=20V
TEST CONDITIONS
MIN.
Forward Voltage
-
-
TYP.
-
-
MAX.
0.35
0.45
1
Ta=25℃
UNITS
V
V
mA
mA
1/5
XBS304F11R-G
■
TYPICAL PERFORMANCE CHARACTERISTICS
(1) Forward Current vs. Forward Voltage
(2) Reverse Current vs. Reverse Voltage
10
Ta=125℃
100
Ta=100℃
Forward Current: I
F
(A)
1
75℃
25℃
Reverse Current: I
R
(mA)
10
75℃
1
25℃
0.1
0.1
0.01
-25℃
0.01
0.001
0
0.2
0.4
0.6
Forward Voltage: V
F
(V)
0.001
0
10
20
30
40
Reverse Voltage: V
R
(V)
(3) Terminal Capacitance vs. Reverse Voltage
(4) Average Forward Current vs. Operating Temperature
1000
Average Forward Current: I
F(AVE)
(A)
5
Terminal Capacitance: C
t
(pF)
800
4
600
3
400
2
200
1
0
0
10
20
30
40
Reverse Voltage: V
R
(V)
0
0
50
100
150
Operating Temperature: Ta (℃)
■NOTES
ON USE
1. Please use this IC within the absolute maximum ratings.
Even within the ratings, in case of high load use continuously such as high temperature, high voltage, high current and thermal stress may
cause reliability degradation of the IC.
2. Torex places an importance on improving our products and their reliability.
We request that users incorporate fail-safe designs and post-aging protection treatment when using Torex products in their systems.
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XBS304F11R-G
■REFERENCE
PATTERN LAYOUT
●SMA-PG
Unit : inch (mm)
3/5
XBS304F11R-G
■TAPING
SPECIFICATIONS
●SMA-PG
Note:
1. There shall be leader of 230mm minimum which may consist of carrier and or cover tape follower by a minimum of
160mm of carrier tape sealded with cover tape.
2. There shall be minimum of 160mm of empty component pockets sealded with cover tape.
SYMBOL
d
D
D1
D2
E
F
P
P0
P1
W
W1
mm
1.55 ± 0.05
178.0 ± 2.0
min. 50.0
13.0 ± 0.2
1.75 ± 0.10
5.50 ± 0.10
4.00 ± 0.10
4.00 ± 0.10
2.00 ± 0.10
12.0 ± 0.3
13.4 ± 1.0
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XBS304F11R-G
1. The products and product specifications contained herein are subject to change without
notice to improve performance characteristics.
Consult us, or our representatives
before use, to confirm that the information in this datasheet is up to date.
2. We assume no responsibility for any infringement of patents, patent rights, or other
rights arising from the use of any information and circuitry in this datasheet.
3. Please ensure suitable shipping controls (including fail-safe designs and aging
protection) are in force for equipment employing products listed in this datasheet.
4. The products in this datasheet are not developed, designed, or approved for use with
such equipment whose failure of malfunction can be reasonably expected to directly
endanger the life of, or cause significant injury to, the user.
(e.g. Atomic energy; aerospace; transport; combustion and associated safety
equipment thereof.)
5. Please use the products listed in this datasheet within the specified ranges.
Should you wish to use the products under conditions exceeding the specifications,
please consult us or our representatives.
6. We assume no responsibility for damage or loss due to abnormal use.
7. All rights reserved. No part of this datasheet may be copied or reproduced without the
prior permission of TOREX SEMICONDUCTOR LTD.
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