SRAM Module, 256KX32, 17ns, CMOS,
| Parameter Name | Attribute value |
| Maker | EDI [Electronic devices inc.] |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| Maximum access time | 17 ns |
| JESD-30 code | R-XZMA-T64 |
| memory density | 8388608 bit |
| Memory IC Type | SRAM MODULE |
| memory width | 32 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 64 |
| word count | 262144 words |
| character code | 256000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 256KX32 |
| Output characteristics | 3-STATE |
| Exportable | YES |
| Package body material | UNSPECIFIED |
| Package shape | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | THROUGH-HOLE |
| Terminal location | ZIG-ZAG |
| Base Number Matches | 1 |
| EDI8F32257B17MZC | EDI8F32256C45MMC | EDI8F32257C45MZC | EDI8F32257B20MZC | EDI8F32256B20MMC | EDI8F32256B20MZC | EDI8F32256C45M6C | EDI8F32256B17MMC | EDI8F32256C45MZC | |
|---|---|---|---|---|---|---|---|---|---|
| Description | SRAM Module, 256KX32, 17ns, CMOS, | SRAM Module, 256KX32, 45ns, CMOS, | SRAM Module, 256KX32, 45ns, CMOS, | SRAM Module, 256KX32, 20ns, CMOS, | SRAM Module, 256KX32, 20ns, CMOS, | SRAM Module, 256KX32, 20ns, CMOS, | SRAM Module, 256KX32, 45ns, CMOS, | SRAM Module, 256KX32, 17ns, CMOS, | SRAM Module, 256KX32, 45ns, CMOS, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| Maximum access time | 17 ns | 45 ns | 45 ns | 20 ns | 20 ns | 20 ns | 45 ns | 17 ns | 45 ns |
| JESD-30 code | R-XZMA-T64 | R-XSMA-N64 | R-XZMA-T64 | R-XZMA-T64 | R-XSMA-N64 | R-XZMA-T64 | R-XDMA-T60 | R-XSMA-N64 | R-XZMA-T64 |
| memory density | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit |
| Memory IC Type | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE |
| memory width | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of ports | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 64 | 64 | 64 | 64 | 64 | 64 | 60 | 64 | 64 |
| word count | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| character code | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Exportable | YES | YES | YES | YES | YES | YES | NO | YES | YES |
| Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | THROUGH-HOLE |
| Terminal location | ZIG-ZAG | SINGLE | ZIG-ZAG | ZIG-ZAG | SINGLE | ZIG-ZAG | DUAL | SINGLE | ZIG-ZAG |
| Maker | EDI [Electronic devices inc.] | - | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] |