EDI8F32256C45MZC datasheet, PDF

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EDI8F32256C45MZC: DescriptionSRAM Module, 256KX32, 45ns, CMOS,; Categorystorage storage; File Size116KB，4 Pages; ManufacturerEDI [Electronic devices inc.]

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EDI8F32256C45MZC Overview

SRAM Module, 256KX32, 45ns, CMOS,

EDI8F32256C45MZC Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	EDI [Electronic devices inc.]
Reach Compliance Code	unknown
Maximum access time	45 ns
Other features	CONFIGURABLE AS 256K X 32
I/O type	COMMON
JESD-30 code	R-XZMA-T64
JESD-609 code	e0
memory density	8388608 bit
Memory IC Type	SRAM MODULE
memory width	32
Number of functions	1
Number of ports	1
Number of terminals	64
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256KX32
Output characteristics	3-STATE
Exportable	YES
Package body material	UNSPECIFIED
encapsulated code	ZIP
Encapsulate equivalent code	ZIP64/68,.1,.1
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	13.462 mm
Maximum standby current	0.03 A
Minimum standby current	4.5 V
Maximum slew rate	0.96 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	1.27 mm
Terminal location	ZIG-ZAG
Maximum time at peak reflow temperature	NOT SPECIFIED

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Description	SRAM Module, 256KX32, 45ns, CMOS,	SRAM Module, 256KX32, 17ns, CMOS,	SRAM Module, 256KX32, 45ns, CMOS,	SRAM Module, 256KX32, 45ns, CMOS,	SRAM Module, 256KX32, 20ns, CMOS,	SRAM Module, 256KX32, 20ns, CMOS,	SRAM Module, 256KX32, 20ns, CMOS,	SRAM Module, 256KX32, 45ns, CMOS,	SRAM Module, 256KX32, 17ns, CMOS,
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Maximum access time	45 ns	17 ns	45 ns	45 ns	20 ns	20 ns	20 ns	45 ns	17 ns
JESD-30 code	R-XZMA-T64	R-XZMA-T64	R-XSMA-N64	R-XZMA-T64	R-XZMA-T64	R-XSMA-N64	R-XZMA-T64	R-XDMA-T60	R-XSMA-N64
memory density	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit
Memory IC Type	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE
memory width	32	32	32	32	32	32	32	32	32
Number of functions	1	1	1	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1	1	1	1
Number of terminals	64	64	64	64	64	64	64	60	64
word count	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words
character code	256000	256000	256000	256000	256000	256000	256000	256000	256000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	256KX32	256KX32	256KX32	256KX32	256KX32	256KX32	256KX32	256KX32	256KX32
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	YES	YES	YES	YES	YES	YES	YES	NO	YES
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	NO LEAD
Terminal location	ZIG-ZAG	ZIG-ZAG	SINGLE	ZIG-ZAG	ZIG-ZAG	SINGLE	ZIG-ZAG	DUAL	SINGLE
Maker	EDI [Electronic devices inc.]	EDI [Electronic devices inc.]	-	EDI [Electronic devices inc.]	EDI [Electronic devices inc.]	EDI [Electronic devices inc.]	EDI [Electronic devices inc.]	EDI [Electronic devices inc.]	EDI [Electronic devices inc.]

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