TLV2370IDBVR datasheet, PDF - EEWORLD Datasheet

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TLV2370IDBVR: DescriptionGain bandwidth product (GBP): 3MHz Number of amplifier groups: 1 Op amp type: General Purpose Power consumption of each channel: 750uA Slew rate (SR): 2.1 V/us Supply voltage: 2.7V ~ 16V 550uA/ with shutdown state Channel 3MHz RRIO operational amplifier; CategoryAnalog mixed-signal IC Amplifier circuit; File Size2MB，57 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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TLV2370IDBVR Overview

Gain bandwidth product (GBP): 3MHz Number of amplifier groups: 1 Op amp type: General Purpose Power consumption of each channel: 750uA Slew rate (SR): 2.1 V/us Supply voltage: 2.7V ~ 16V 550uA/ with shutdown state Channel 3MHz RRIO operational amplifier

TLV2370IDBVR Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Texas Instruments
Parts packaging code	SOT-23
package instruction	LSSOP, TSOP6,.11,37
Contacts	6
Reach Compliance Code	compliant
ECCN code	EAR99
Factory Lead Time	12 weeks
Samacsys Description	Single 550-uA/Channel, 3MHz, RRIO op amp with shutdown
Amplifier type	OPERATIONAL AMPLIFIER
Architecture	VOLTAGE-FEEDBACK
Maximum average bias current (IIB)	0.00006 µA
Maximum bias current (IIB) at 25C	0.00006 µA
Minimum Common Mode Rejection Ratio	55 dB
Nominal Common Mode Rejection Ratio	72 dB
frequency compensation	YES
Maximum input offset current (IIO)	0.00006 µA
Maximum input offset voltage	4500 µV
JESD-30 code	R-PDSO-G6
JESD-609 code	e4
length	2.9 mm
low-bias	YES
low-dissonance	NO
micropower	NO
Humidity sensitivity level	1
Number of functions	1
Number of terminals	6
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	LSSOP
Encapsulate equivalent code	TSOP6,.11,37
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
method of packing	TR
Peak Reflow Temperature (Celsius)	260
power	NO
power supply	+-1.35/+-8/2.7/16 V
Programmable power	NO
Certification status	Not Qualified
Maximum seat height	1.45 mm
minimum slew rate	1 V/us
Nominal slew rate	2.4 V/us
Maximum slew rate	0.66 mA
Supply voltage upper limit	16.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	GULL WING
Terminal pitch	0.95 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
Nominal Uniform Gain Bandwidth	3000 kHz
Minimum voltage gain	79432
broadband	YES
width	1.6 mm

TLV2370IDBVR Related Products

	TLV2370IDBVR	TLV2371IDBVR
Description	Gain bandwidth product (GBP): 3MHz Number of amplifier groups: 1 Op amp type: General Purpose Power consumption of each channel: 750uA Slew rate (SR): 2.1 V/us Supply voltage: 2.7V ~ 16V 550uA/ with shutdown state Channel 3MHz RRIO operational amplifier	Gain bandwidth product (GBP): 3MHz Number of amplifier groups: 1 Op amp type: General Purpose Power consumption of each channel: - Slew rate (SR): 2.1 V/us Power supply voltage: 2.7V ~ 16V, ±1.35V ~ 8V
Brand Name	Texas Instruments	Texas Instruments
Is it lead-free?	Lead free	Lead free
Is it Rohs certified?	conform to	conform to
Parts packaging code	SOT-23	SOT-23
package instruction	LSSOP, TSOP6,.11,37	LSSOP, TSOP5/6,.11,37
Contacts	6	5
Reach Compliance Code	compliant	compliant
ECCN code	EAR99	EAR99
Factory Lead Time	12 weeks	1 week
Amplifier type	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER
Architecture	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK
Maximum average bias current (IIB)	0.00006 µA	0.00006 µA
Maximum bias current (IIB) at 25C	0.00006 µA	0.00006 µA
Minimum Common Mode Rejection Ratio	55 dB	55 dB
Nominal Common Mode Rejection Ratio	72 dB	72 dB
frequency compensation	YES	YES
Maximum input offset current (IIO)	0.00006 µA	0.00006 µA
Maximum input offset voltage	4500 µV	4500 µV
JESD-30 code	R-PDSO-G6	R-PDSO-G5
JESD-609 code	e4	e4
length	2.9 mm	2.9 mm
low-bias	YES	YES
low-dissonance	NO	NO
micropower	NO	NO
Humidity sensitivity level	1	1
Number of functions	1	1
Number of terminals	6	5
Maximum operating temperature	125 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LSSOP	LSSOP
Encapsulate equivalent code	TSOP6,.11,37	TSOP5/6,.11,37
Package shape	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
method of packing	TR	TR
Peak Reflow Temperature (Celsius)	260	260
power	NO	NO
power supply	+-1.35/+-8/2.7/16 V	+-1.35/+-8/2.7/16 V
Programmable power	NO	NO
Certification status	Not Qualified	Not Qualified
Maximum seat height	1.45 mm	1.45 mm
minimum slew rate	1 V/us	1 V/us
Nominal slew rate	2.4 V/us	2.4 V/us
Maximum slew rate	0.66 mA	0.66 mA
Supply voltage upper limit	16.5 V	16.5 V
Nominal supply voltage (Vsup)	5 V	5 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	AUTOMOTIVE	AUTOMOTIVE
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	GULL WING	GULL WING
Terminal pitch	0.95 mm	0.95 mm
Terminal location	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED
Nominal Uniform Gain Bandwidth	3000 kHz	3000 kHz
Minimum voltage gain	79432	79432
broadband	YES	YES
width	1.6 mm	1.6 mm

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