
Number of groups of voltage outputs: 1 Maximum input voltage: 4.8V Output voltage: 1.2V Output current (max/full load): 600mA 600mA fully integrated low-noise buck converter module in MicroSiP® package
| Parameter Name | Attribute value |
| Brand Name | Texas Instruments |
| Is it Rohs certified? | conform to |
| Maker | Texas Instruments |
| Parts packaging code | SIP |
| package instruction | VFBGA, BGA8,3X3,40/32 |
| Contacts | 8 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Factory Lead Time | 1 week |
| Samacsys Description | 600mA Fully Integrated, Low Noise Step-Down Converter Module in MicroSiP Package |
| Other features | ALSO HAS CONTROL TECHNIQUE OF PFM |
| Analog Integrated Circuits - Other Types | SWITCHING REGULATOR |
| control mode | VOLTAGE-MODE |
| Control Technology | PULSE WIDTH MODULATION |
| Maximum input voltage | 5.5 V |
| Minimum input voltage | 2.3 V |
| Nominal input voltage | 3.6 V |
| JESD-30 code | R-PBGA-B8 |
| JESD-609 code | e1 |
| length | 2.9 mm |
| Humidity sensitivity level | 2 |
| Number of functions | 1 |
| Number of terminals | 8 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Maximum output current | 0.6 A |
| Maximum output voltage | 1.248 V |
| Minimum output voltage | 0.0098 V |
| Nominal output voltage | 1.2 V |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | VFBGA |
| Encapsulate equivalent code | BGA8,3X3,40/32 |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) | 260 |
| Certification status | Not Qualified |
| Maximum seat height | 1 mm |
| surface mount | YES |
| Switch configuration | BUCK |
| Maximum switching frequency | 6000 kHz |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal form | BALL |
| Terminal pitch | 0.8 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 2.3 mm |
| Base Number Matches | 1 |