H
200-V/160 Ohm, 1 Form A,
Small-Signal Solid State Relay
Technical Data
HSSR-8200
Features
• Compact Solid-State
Bidirectional Signal Switch
• Normally-Off Single-Pole
Relay Function (1 Form A)
• Very High Output Off-
Impedance: 10,000
Gigaohms Typical at 25
°
C
• Very Low Output Offset
Voltage: < 0.5
µ
V at
I
F
= 1 mA
• 200-Volt Output Withstand
Voltage at 25
°
C
• High-Transient Immunity:
> 2000 V/µs
• Monolithic High-Voltage IC
• Operating Range: -40
°
C to
+85
°
C
• Very Low Input Current
(1 mA); CMOS Compatibility
• High-Speed Switching: 50
µ
s
Typical
• 160-Ohm Maximum On-
Resistance at 25
°
C
• Surface Mount Option
• 8-kV ESD Immunity: MIL-
STD-883 Method 3015
• Input-to-Output Insulation
Voltage: 2500 Vac, 1 Minute
• UL 508 Recognized
• CSA Approved
Applications
• Relay Scanners & Analog
Input Modules of Data
Acquisition Systems
• Analog Input Modules of
Programmable Logic
Controllers
• Relay Multiplexers of High-
Performance Voltmeters
• Telecommunication Test
Instruments
• Functional Tester of Board
Test Equipment
• Analog Signal Multiplexer
• Flying Capacitor Multiplexer
• Reed Relay Replacement
Description
The HSSR-8200 consists of a high-
voltage integrated circuit optically
coupled with a light emitting diode.
This device is a solid-state
replacement for single-pole,
normally-open electromechanical
relays used for general purpose
switching of analog signals.
The light-emitting diode controls
the ON/OFF function of the solid-
state relay. The detector contains
high voltage MOS transistors and a
high speed photosensitive drive
circuit. This relay has superior OFF
impedance, very low output offset
voltage and input drive current.
Functional Diagram
TRUTH TABLE
(POSITIVE LOGIC)
LED
OUTPUT
ON
L
OFF
H
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.
1-454
5965-3574E
The electrical and switching
characteristics of the HSSR-8200
are specified from –40°C to
+85°C. The low I
F
allows
compatibility with TTL, LSTTL,
and CMOS logic resulting in low
power consumption compared to
other solid state and mechanical
relays.
Selection Guide
6-Pin DIP
(300 Mil)
Single
Channel
Package
HSSR-8400
[1]
HSSR-8060
[1]
4-Pin DIP
(300 Mil)
Dual
Channel
Package
Maximum
Maximum
ON
Speed
Resistance
t(ON)
R(ON)
Ω
msec
25
°
C
25
°
C
0.95
10
1.4
0.7
1.5
200
6
1
Maximum
Output
Voltage
VO(off)
V
25
°
C
400
60
200
90
Maximum
Output
Current
Io(ON)
mA
25
°
C
150
750
40
800
Minimum
Input
Current
mA
5
5
1
5
Hermetic
8-Pin
Single
Channel
Packages
HSSR-8200
HSSR-7110
[1]
Note:
1. Technical data are on separate HP publication.
Ordering Information
Specify part number followed by Option Number (if desired).
HSSR-8200#XXX
300 = Gull Wing Surface Mount Lead Option
500 = Tape/Reel Package Option (1 K min)
Option data sheets available. Contact your Hewlett-Packard sales representative or authorized distributor for
information.
Schematic
8
+
1
I
F
V
F
SWITCH
DRIVER
–
4
5
1-455
Package Outline Drawings
4-Pin DIP Package (HSSR-8200)
9.40 (0.370)
9.90 (0.390)
8
5
7.37 (0.290)
7.87 (0.310)
TYPE
NUMBER
DATE CODE
6.10 (0.240)
6.60 (0.260)
5° TYP.
4
0.02 (0.008)
0.33 (0.013)
HP RXXXX
YYWW
PIN
ONE
1
1.19 (0.047) MAX.
4.70 (0.185) MAX.
0.51 (0.020) MIN.
2.92 (0.115) MIN.
0.76 (0.030)
1.40 (0.055)
7.37 (0.290)
7.87 (0.310)
0.65 (0.025) MAX.
DIMENSIONS IN MILLIMETERS
AND (INCHES).
4-Pin DIP Package with Gull Wing Surface Mount Option 300
9.65 ± 0.25
(0.380 ± 0.010)
8
5
PIN 1
1
4
9.65 ± 0.25
(0.380 ± 0.010)
7.62 ± 0.25
(0.300 ± 0.010)
1.19
(0.047)
MAX.
4.19 MAX.
(0.165)
6.35 ± 0.25
(0.250 ± 0.010)
0.20 (0.008)
0.33 (0.013)
1.080 ± 0.320
(0.043 ± 0.013)
7.62 ± 0.25
(0.300 ± 0.010)
0.50 ± 0.130
(0.020 ± 0.005)
0.635 ± 0.25
(0.025 ± 0.010)
12° NOM.
DIMENSIONS IN MILLIMETERS (INCHES).
1-456
Thermal Profile (Option #300)
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
1
2
3
4
5
6
7
8
9
10
11
12
∆T
= 145°C, 1°C/SEC
∆T
= 115°C, 0.3°C/SEC
TEMPERATURE – °C
∆T
= 100°C, 1.5°C/SEC
TIME – MINUTES
Figure 1. Maximum Solder Reflow Thermal Profile.
(Note: Use of non-chlorine activated fluxes is recommended.)
Regulatory Information
The HSSR-8200 has been
approved by the following
organizations:
UL
Recognized under UL 508,
Component Recognition
Program, Industrial Control
Switches, File E142465.
CSA
Approved under CAN/CSA-C22.2
No. 14-95, Industrial Control
Equipment, File LR 87683.
Insulation and Safety Related Specifications
Parameter
Min. External Air Gap
(External Clearance)
Min. External Tracking Path
(External Creepage)
Min. Internal Plastic Gap
(Internal Clearance)
Symbol
L(IO1)
L(IO2)
Value Units
7.0
7.5
0.5
mm
mm
mm
Conditions
Measured from input terminals to output
terminals, shortest distance through air
Measured from input terminals to output
terminals, shortest distance path along body
Through insulation distance, conductor to
conductor, usually the direct distance
between the photoemitter and photodetector
inside the optocoupler cavity
DIN IEC 112/VDE 0303 PART 1
Material Group (DIN VDE 0110, 1/89, Table 1)
Tracking Resistance
(Comparative Tracking Index)
Isolation Group
CTI
200
IIIa
Volts
Option 300 – surface mount classification is Class A in accordance with CECC 00802.
1-457
Absolute Maximum Ratings
Storage Temperature ................................................... -55°C to+125°C
Operating Temperature ................................................. -40°C to +85°C
Lead Solder Temperature .... 260°C for 10 s (1.6 mm below seating plane)
Average Input Current - I
F
............................................................ 10 mA
Repetitive Peak Input Current - I
F
.................... 20 mA; 50% Duty Cycle
Transient Peak Input Current - I
F
............................................... 100 mA
(≤ 1
µs
pulse width; 1 kHz Pulse Repetition Rate)
Reverse Input Voltage ....................................................................... 5 V
Average Output Current – I
O
................................................... 40 mA
[1]
Input Output Insulation Voltage ......................................... 2500 VAC
[6]
Output Power Dissipation ..................................................... 320 mW
[2]
Output Voltage – V
O
..................................................... -200 V to 200 V
Infrared and Vapor Phase Reflow Temperature
(Option #300) .......................................... see Fig. 1, Thermal Profile
Recommended Operating Conditions
Parameter
Input Current (ON)
Input Voltage (OFF)
Operating Temperature
Output Voltage
Output Current
Symbol
I
F(ON)
V
F(OFF)
T
A
V
O(OFF)
I
O(ON)
Min.
1
0
-40
-200
-40
Max.
5
0.6
+85
200
40
Units
mA
Volt
°C
Volt
mA
1-458
Embedded System
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