HY23C16202D-100 datasheet, PDF

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HY23C16202D-100: DescriptionMASK ROM, 1MX16, 100ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42; Categorystorage; File Size118KB，8 Pages; ManufacturerSK Hynix; Websitehttp://www.hynix.com/eng/

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HY23C16202D-100 Overview

MASK ROM, 1MX16, 100ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42

HY23C16202D-100 Parametric

Parameter Name	Attribute value
Maker	SK Hynix
Parts packaging code	DIP
package instruction	DIP,
Contacts	42
Reach Compliance Code	unknown
ECCN code	EAR99
Is Samacsys	N
Maximum access time	100 ns
Spare memory width	8
JESD-30 code	R-PDIP-T42
length	52.451 mm
memory density	16777216 bit
Memory IC Type	MASK ROM
memory width	16
Number of functions	1
Number of terminals	42
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1MX16
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	4.826 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm
Base Number Matches	1

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HY23C16202

Description

1MX16/2MX8 BIT

CMOS MASK ROM

The HY23C16202 high performance read only memory is organized either as 2,097,152 x 8 bit (byte mode) or

as 1,048,576 x 16 bit(word mode) followed by BHE mode select. The low power feature allows the battery

operation.

The large size of 16M bit memory density is ideal for character generator, data or program

memory in micro-processor application. The HY23C16202 is packaged 42pin DIP , 44 pin SOP or 44 pin

TSOP-II.

Key features

• Switchable Organization

Byte Mode : 2,097,152 X 8 bit

Word Mode : 1,048,576 X 16 bit

• Single 5V power supply operation

• Access Time : 100/120ns (Max)

• Standby Current : 50 (Max)

• Operating Current : 60 (Max)

• TTL compatible inputs and outputs

• 3-State outputs for wired-OR expansion

• Word or Byte switchable by BHE pin

• Fully static operation

• Package

HY23C16202D

: 42pin Plastic DIP(600 mil)

HY23C16202S

: 44pin Plastic SOP(500mil)

HY23C16202T

: 44pin Plastic TSOP-II(400mil)

HY23C16202M

: 48pin Plastic TSOP-I(12x20mm)

HY23C16202F

: 48pin Plastic TSOP-I(12x20mm)

Pin Description

A0~A19

Q0~Q14

Q15/A-1

BHE

CEB*

OEB*

VCC

VSS

Function

Address inputs

Data Outputs

Output Q15(Word Mode)/

LSB Address(Byte Mode)

Byte High Enable input

(Word/Byte selection)

Chip Enable input

Output Enable input

Power supply

Ground

No Connection

Pin Configuration

A18

A17

CEB

VSS

OEB

Q10

Q11

A19

A10

A11

A12

A13

A14

A15

A16

BHE

VSS

Q15/A-1

Q14

Q13

Q12

VCC

A18

A17

CEB

VSS

OEB

Q10

Q11

42DIP

VSS

Q15/A-1

Q14

Q13

Q12

VCC

HY23C16202T

HY23C16202D

Rev1 Page 1 of 8

HY23C16202S

* User selectable polarity

A19

A10

A11

A12

A13

A14

A15

A16

BHE

A18

A17

CEB

VSS

OEB

Q10

Q11

44SOP

44TSOP-

A19

A10

A11

A12

A13

A14

A15

A16

BHE

VSS

Q15/A-1

Q14

Q13

Q12

VCC

HY23C16202D-100 Related Products

	HY23C16202D-100	HY23C16202T-120	HY23C16202T-100	HY23C16202M-100	HY23C16202F-100	HY23C16202S-100	HY23C16202D-120	HY23C16202F-120	HY23C16202S-120	HY23C16202M-120
Description	MASK ROM, 1MX16, 100ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42	MASK ROM, 1MX16, 120ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, TSOP2-44	MASK ROM, 1MX16, 100ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, TSOP2-44	MASK ROM, 1MX16, 100ns, CMOS, PDSO48, 12 X 20 MM, PLASTIC, TSOP1-48	MASK ROM, 1MX16, 100ns, CMOS, PDSO48, 12 X 20 MM, PLASTIC, TSOP1-48	MASK ROM, 1MX16, 100ns, CMOS, PDSO44, 0.500 INCH, PLASTIC, SOP-44	MASK ROM, 1MX16, 120ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42	MASK ROM, 1MX16, 120ns, CMOS, PDSO48, 12 X 20 MM, PLASTIC, TSOP1-48	MASK ROM, 1MX16, 120ns, CMOS, PDSO44, 0.500 INCH, PLASTIC, SOP-44	MASK ROM, 1MX16, 120ns, CMOS, PDSO48, 12 X 20 MM, PLASTIC, TSOP1-48
Parts packaging code	DIP	TSOP2	TSOP2	TSOP1	TSOP1	SOIC	DIP	TSOP1	SOIC	TSOP1
package instruction	DIP,	TSOP2,	TSOP2,	TSOP1,	TSOP1,	SOP,	DIP,	TSOP1,	SOP,	TSOP1,
Contacts	42	44	44	48	48	44	42	48	44	48
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknow	unknow
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	100 ns	120 ns	100 ns	100 ns	100 ns	100 ns	120 ns	120 ns	120 ns	120 ns
Spare memory width	8	8	8	8	8	8	8	8	8	8
JESD-30 code	R-PDIP-T42	R-PDSO-G44	R-PDSO-G44	R-PDSO-G48	R-PDSO-G48	R-PDSO-G44	R-PDIP-T42	R-PDSO-G48	R-PDSO-G44	R-PDSO-G48
length	52.451 mm	18.41 mm	18.41 mm	18.4 mm	18.4 mm	28.5 mm	52.451 mm	18.4 mm	28.5 mm	18.4 mm
memory density	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bi	16777216 bi
Memory IC Type	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM
memory width	16	16	16	16	16	16	16	16	16	16
Number of functions	1	1	1	1	1	1	1	1	1	1
Number of terminals	42	44	44	48	48	44	42	48	44	48
word count	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words
character code	1000000	1000000	1000000	1000000	1000000	1000000	1000000	1000000	1000000	1000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	1MX16	1MX16	1MX16	1MX16	1MX16	1MX16	1MX16	1MX16	1MX16	1MX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	TSOP2	TSOP2	TSOP1	TSOP1	SOP	DIP	TSOP1	SOP	TSOP1
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE	IN-LINE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.826 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	3.2 mm	4.826 mm	1.2 mm	3.2 mm	1.2 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	YES	YES	YES	YES	NO	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	THROUGH-HOLE	GULL WING	GULL WING	GULL WING
Terminal pitch	2.54 mm	0.8 mm	0.8 mm	0.5 mm	0.5 mm	1.27 mm	2.54 mm	0.5 mm	1.27 mm	0.5 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
width	15.24 mm	10.16 mm	10.16 mm	12 mm	12 mm	12.6 mm	15.24 mm	12 mm	12.6 mm	12 mm
Maker	SK Hynix	-	-	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix
JESD-609 code	-	e6	e6	e6	e6	-	-	e6	-	e6
Terminal surface	-	TIN BISMUTH	TIN BISMUTH	TIN BISMUTH	TIN BISMUTH	-	-	TIN BISMUTH	-	TIN BISMUTH

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