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HY23C16202F-100

Description
MASK ROM, 1MX16, 100ns, CMOS, PDSO48, 12 X 20 MM, PLASTIC, TSOP1-48
Categorystorage    storage   
File Size118KB,8 Pages
ManufacturerSK Hynix
Websitehttp://www.hynix.com/eng/
Download Datasheet Parametric Compare View All

HY23C16202F-100 Overview

MASK ROM, 1MX16, 100ns, CMOS, PDSO48, 12 X 20 MM, PLASTIC, TSOP1-48

HY23C16202F-100 Parametric

Parameter NameAttribute value
MakerSK Hynix
Parts packaging codeTSOP1
package instructionTSOP1,
Contacts48
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time100 ns
Spare memory width8
JESD-30 codeR-PDSO-G48
JESD-609 codee6
length18.4 mm
memory density16777216 bit
Memory IC TypeMASK ROM
memory width16
Number of functions1
Number of terminals48
word count1048576 words
character code1000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize1MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP1
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTIN BISMUTH
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
width12 mm
HY23C16202
Description
1MX16/2MX8 BIT
CMOS MASK ROM
The HY23C16202 high performance read only memory is organized either as 2,097,152 x 8 bit (byte mode) or
as 1,048,576 x 16 bit(word mode) followed by BHE mode select. The low power feature allows the battery
operation.
The large size of 16M bit memory density is ideal for character generator, data or program
memory in micro-processor application. The HY23C16202 is packaged 42pin DIP , 44 pin SOP or 44 pin
TSOP-II.
Key features
• Switchable Organization
Byte Mode : 2,097,152 X 8 bit
Word Mode : 1,048,576 X 16 bit
• Single 5V power supply operation
• Access Time : 100/120ns (Max)
• Standby Current : 50 (Max)
• Operating Current : 60 (Max)
• TTL compatible inputs and outputs
• 3-State outputs for wired-OR expansion
• Word or Byte switchable by BHE pin
• Fully static operation
• Package
HY23C16202D
: 42pin Plastic DIP(600 mil)
HY23C16202S
: 44pin Plastic SOP(500mil)
HY23C16202T
: 44pin Plastic TSOP-II(400mil)
HY23C16202M
: 48pin Plastic TSOP-I(12x20mm)
HY23C16202F
: 48pin Plastic TSOP-I(12x20mm)
Pin Description
Pin
A0~A19
Q0~Q14
Q15/A-1
BHE
CEB*
OEB*
VCC
VSS
NC
Function
Address inputs
Data Outputs
Output Q15(Word Mode)/
LSB Address(Byte Mode)
Byte High Enable input
(Word/Byte selection)
Chip Enable input
Output Enable input
Power supply
Ground
No Connection
Pin Configuration
A18
A17
A7
A6
A5
A4
A3
A2
A1
A0
CEB
VSS
OEB
Q0
Q8
Q1
Q9
Q2
Q10
Q3
Q11
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
A19
A8
A9
A10
A11
A12
A13
A14
A15
A16
BHE
VSS
Q15/A-1
Q7
Q14
Q6
Q13
Q5
Q12
Q4
VCC
NC
A18
A17
A7
A6
A5
A4
A3
A2
A1
A0
CEB
VSS
OEB
Q0
Q8
Q1
Q9
Q2
Q10
Q3
Q11
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
42DIP
13
14
15
16
17
18
19
20
21
22
32
31
30
29
28
27
26
25
24
23
VSS
Q15/A-1
Q7
Q14
Q6
Q13
Q5
Q12
Q4
VCC
HY23C16202T
HY23C16202D
Rev1 Page 1 of 8
HY23C16202S
¢
¢
¡
 
* User selectable polarity
44
43
42
41
40
39
38
37
36
35
NC
A19
A8
A9
A10
A11
A12
A13
A14
A15
A16
BHE
NC
A18
A17
A7
A6
A5
A4
A3
A2
A1
A0
CEB
VSS
OEB
Q0
Q8
Q1
Q9
Q2
Q10
Q3
Q11
1
2
3
4
5
6
7
8
9
10
11
12
44
43
42
41
40
39
38
37
36
35
34
44SOP
34
33
44TSOP-
33
32
31
30
29
28
27
26
25
24
23
NC
A19
A8
A9
A10
A11
A12
A13
A14
A15
A16
BHE
VSS
Q15/A-1
Q7
Q14
Q6
Q13
Q5
Q12
Q4
VCC

HY23C16202F-100 Related Products

HY23C16202F-100 HY23C16202D-100 HY23C16202T-120 HY23C16202T-100 HY23C16202M-100 HY23C16202S-100 HY23C16202D-120 HY23C16202F-120 HY23C16202S-120 HY23C16202M-120
Description MASK ROM, 1MX16, 100ns, CMOS, PDSO48, 12 X 20 MM, PLASTIC, TSOP1-48 MASK ROM, 1MX16, 100ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42 MASK ROM, 1MX16, 120ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, TSOP2-44 MASK ROM, 1MX16, 100ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, TSOP2-44 MASK ROM, 1MX16, 100ns, CMOS, PDSO48, 12 X 20 MM, PLASTIC, TSOP1-48 MASK ROM, 1MX16, 100ns, CMOS, PDSO44, 0.500 INCH, PLASTIC, SOP-44 MASK ROM, 1MX16, 120ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42 MASK ROM, 1MX16, 120ns, CMOS, PDSO48, 12 X 20 MM, PLASTIC, TSOP1-48 MASK ROM, 1MX16, 120ns, CMOS, PDSO44, 0.500 INCH, PLASTIC, SOP-44 MASK ROM, 1MX16, 120ns, CMOS, PDSO48, 12 X 20 MM, PLASTIC, TSOP1-48
Parts packaging code TSOP1 DIP TSOP2 TSOP2 TSOP1 SOIC DIP TSOP1 SOIC TSOP1
package instruction TSOP1, DIP, TSOP2, TSOP2, TSOP1, SOP, DIP, TSOP1, SOP, TSOP1,
Contacts 48 42 44 44 48 44 42 48 44 48
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknow unknow
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 100 ns 100 ns 120 ns 100 ns 100 ns 100 ns 120 ns 120 ns 120 ns 120 ns
Spare memory width 8 8 8 8 8 8 8 8 8 8
JESD-30 code R-PDSO-G48 R-PDIP-T42 R-PDSO-G44 R-PDSO-G44 R-PDSO-G48 R-PDSO-G44 R-PDIP-T42 R-PDSO-G48 R-PDSO-G44 R-PDSO-G48
length 18.4 mm 52.451 mm 18.41 mm 18.41 mm 18.4 mm 28.5 mm 52.451 mm 18.4 mm 28.5 mm 18.4 mm
memory density 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bi 16777216 bi
Memory IC Type MASK ROM MASK ROM MASK ROM MASK ROM MASK ROM MASK ROM MASK ROM MASK ROM MASK ROM MASK ROM
memory width 16 16 16 16 16 16 16 16 16 16
Number of functions 1 1 1 1 1 1 1 1 1 1
Number of terminals 48 42 44 44 48 44 42 48 44 48
word count 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words
character code 1000000 1000000 1000000 1000000 1000000 1000000 1000000 1000000 1000000 1000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 1MX16 1MX16 1MX16 1MX16 1MX16 1MX16 1MX16 1MX16 1MX16 1MX16
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSOP1 DIP TSOP2 TSOP2 TSOP1 SOP DIP TSOP1 SOP TSOP1
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE IN-LINE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE IN-LINE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm 4.826 mm 1.2 mm 1.2 mm 1.2 mm 3.2 mm 4.826 mm 1.2 mm 3.2 mm 1.2 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES NO YES YES YES YES NO YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form GULL WING THROUGH-HOLE GULL WING GULL WING GULL WING GULL WING THROUGH-HOLE GULL WING GULL WING GULL WING
Terminal pitch 0.5 mm 2.54 mm 0.8 mm 0.8 mm 0.5 mm 1.27 mm 2.54 mm 0.5 mm 1.27 mm 0.5 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
width 12 mm 15.24 mm 10.16 mm 10.16 mm 12 mm 12.6 mm 15.24 mm 12 mm 12.6 mm 12 mm
Maker SK Hynix SK Hynix - - SK Hynix SK Hynix SK Hynix SK Hynix SK Hynix SK Hynix
JESD-609 code e6 - e6 e6 e6 - - e6 - e6
Terminal surface TIN BISMUTH - TIN BISMUTH TIN BISMUTH TIN BISMUTH - - TIN BISMUTH - TIN BISMUTH

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