NE5050N datasheet, PDF - EEWORLD Datasheet

NE5050N: DescriptionIC 300 kbps DATA, MODEM, PDIP20, 0.300 INCH, PLASTIC, SOT-146-1, DIP-20, Modem; CategoryWireless rf/communication Telecom circuit; File Size312KB，6 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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NE5050N Overview

IC 300 kbps DATA, MODEM, PDIP20, 0.300 INCH, PLASTIC, SOT-146-1, DIP-20, Modem

Parameter Name	Attribute value
Maker	NXP
Parts packaging code	DIP
package instruction	DIP,
Contacts	20
Reach Compliance Code	unknown
Is Samacsys	N
data rate	300 Mbps
JESD-30 code	R-PDIP-T20
length	26.73 mm
Number of functions	1
Number of terminals	20
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
Maximum seat height	4.2 mm
Nominal supply voltage	12 V
surface mount	NO
Telecom integrated circuit types	MODEM
Temperature level	COMMERCIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	7.62 mm
Base Number Matches	1

	NE5050N	NE5050D	RNN70C2180BPRSL
Description	IC 300 kbps DATA, MODEM, PDIP20, 0.300 INCH, PLASTIC, SOT-146-1, DIP-20, Modem	IC 300 kbps DATA, MODEM, PDSO20, 7.50 MM, PLASTIC, SOT-163-1, SO-20, Modem	Fixed Resistor, Metal Film, 0.5W, 218ohm, 350V, 0.1% +/-Tol, 50ppm/Cel, Through Hole Mount, AXIAL LEADED
package instruction	DIP,	SOP,	AXIAL LEADED
Reach Compliance Code	unknown	unknown	unknown
Number of terminals	20	20	2
Maximum operating temperature	70 °C	70 °C	175 °C
Package form	IN-LINE	SMALL OUTLINE	Axial
surface mount	NO	YES	NO
Maker	NXP	NXP	-
Parts packaging code	DIP	SOIC	-
Contacts	20	20	-
Is Samacsys	N	N	-
data rate	300 Mbps	300 Mbps	-
JESD-30 code	R-PDIP-T20	R-PDSO-G20	-
length	26.73 mm	12.8 mm	-
Number of functions	1	1	-
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	-
encapsulated code	DIP	SOP	-
Package shape	RECTANGULAR	RECTANGULAR	-
Certification status	Not Qualified	Not Qualified	-
Maximum seat height	4.2 mm	2.65 mm	-
Nominal supply voltage	12 V	12 V	-
Telecom integrated circuit types	MODEM	MODEM	-
Temperature level	COMMERCIAL	COMMERCIAL	-
Terminal form	THROUGH-HOLE	GULL WING	-
Terminal pitch	2.54 mm	1.27 mm	-
Terminal location	DUAL	DUAL	-
width	7.62 mm	7.5 mm	-
Base Number Matches	1	1	-

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