PCF8575CDGVRE4 datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > The embedded processor and controller> Microcontrollers and processors> PCF8575CDGVRE4

PCF8575CDGVRE4: DescriptionInterface - I/O Expanders Remote 16-Bit I2C & SMBus I/O Expander; CategoryThe embedded processor and controller Microcontrollers and processors; File Size642KB，26 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance; Related ProductsFound19parts with similar functions to PCF8575CDGVRE4

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Interface - I/O Expanders Remote 16-Bit I2C & SMBus I/O Expander

PCF8575CDGVRE4 Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Texas Instruments
Parts packaging code	SOIC
package instruction	TSSOP, TSSOP24,.25,16
Contacts	24
Reach Compliance Code	compli
ECCN code	EAR99
JESD-30 code	R-PDSO-G24
JESD-609 code	e4
length	5 mm
Humidity sensitivity level	1
Number of digits	16
Number of I/O lines	16
Number of ports	2
Number of terminals	24
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Encapsulate equivalent code	TSSOP24,.25,16
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	260
power supply	5 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	GULL WING
Terminal pitch	0.4 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	4.4 mm
uPs/uCs/peripheral integrated circuit type	PARALLEL IO PORT, GENERAL PURPOSE

PCF8575CDGVRE4 Related Products

	PCF8575CDGVRE4	PCF8575CPWRE4	PCF8575CPWE4	PCF8575CDWRE4	PCF8575CDBRE4	PCF8575CDBQRE4	PCF8575CDBQRG4
Description	Interface - I/O Expanders Remote 16-Bit I2C & SMBus I/O Expander	Interface - I/O Expanders Remote 16-Bit I2C & SMBus I/O Expander	Interface - I/O Expanders Remote 16-Bit I2C & SMBus I/O Expander	Interface - I/O Expanders Remote 16-Bit I2C & SMBus I/O Expander	Interface - I/O Expanders Remote 16-Bit I2C & SMBus I/O Expander	Interface - I/O Expanders Remote 16-Bit I2C & SMBus I/O Expander	Interface - I/O Expanders Remote 16-Bit I2C & SMBus I/O Expander
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Parts packaging code	SOIC	TSSOP	TSSOP	SOIC	SSOP	SOIC	SOIC
package instruction	TSSOP, TSSOP24,.25,16	TSSOP, TSSOP24,.25	TSSOP, TSSOP24,.25	SOP, SOP24,.4	SSOP, SSOP24,.3	SSOP, SSOP24,.24	SSOP, SSOP24,.24
Contacts	24	24	24	24	24	24	24
Reach Compliance Code	compli	compli	compli	compli	compli	compli	compli
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
JESD-30 code	R-PDSO-G24	R-PDSO-G24	R-PDSO-G24	R-PDSO-G24	R-PDSO-G24	R-PDSO-G24	R-PDSO-G24
JESD-609 code	e4	e4	e4	e4	e4	e4	e4
length	5 mm	7.8 mm	7.8 mm	15.4 mm	8.2 mm	8.2 mm	8.2 mm
Humidity sensitivity level	1	1	1	1	1	2	2
Number of digits	16	16	16	16	16	16	16
Number of I/O lines	16	16	16	16	16	16	16
Number of ports	2	2	2	2	2	2	2
Number of terminals	24	24	24	24	24	24	24
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSSOP	TSSOP	TSSOP	SOP	SSOP	SSOP	SSOP
Encapsulate equivalent code	TSSOP24,.25,16	TSSOP24,.25	TSSOP24,.25	SOP24,.4	SSOP24,.3	SSOP24,.24	SSOP24,.24
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	260	260	260	260	260	260	260
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	1.2 mm	1.2 mm	2.65 mm	2 mm	2 mm	2 mm
Maximum supply voltage	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.4 mm	0.65 mm	0.65 mm	1.27 mm	0.65 mm	0.65 mm	0.65 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	4.4 mm	4.4 mm	4.4 mm	7.5 mm	5.3 mm	5.3 mm	5.3 mm
uPs/uCs/peripheral integrated circuit type	PARALLEL IO PORT, GENERAL PURPOSE	PARALLEL IO PORT, GENERAL PURPOSE	PARALLEL IO PORT, GENERAL PURPOSE	PARALLEL IO PORT, GENERAL PURPOSE	PARALLEL IO PORT, GENERAL PURPOSE	PARALLEL IO PORT, GENERAL PURPOSE	PARALLEL IO PORT, GENERAL PURPOSE

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