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70V7288L25PF9

Description
TQFP-100, Tray
Categorystorage    storage   
File Size146KB,16 Pages
ManufacturerIDT (Integrated Device Technology)
Download Datasheet Parametric View All

70V7288L25PF9 Overview

TQFP-100, Tray

70V7288L25PF9 Parametric

Parameter NameAttribute value
Brand NameIntegrated Device Technology
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Objectid8072826341
Parts packaging codeTQFP
package instructionLFQFP,
Contacts100
Manufacturer packaging codePN100
Reach Compliance Codenot_compliant
ECCN codeEAR99
Maximum access time25 ns
JESD-30 codeS-PQFP-G100
JESD-609 codee0
length14 mm
memory density1048576 bit
Memory IC TypeMULTI-PORT SRAM
memory width16
Humidity sensitivity level3
Number of functions1
Number of terminals100
word count65536 words
character code64000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize64KX16
Package body materialPLASTIC/EPOXY
encapsulated codeLFQFP
Package shapeSQUARE
Package formFLATPACK, LOW PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)225
Maximum seat height1.6 mm
Maximum supply voltage (Vsup)3.465 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTIN LEAD
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationQUAD
width14 mm
HIGH-SPEED 3.3V
64K x 16 BANK-SWITCHABLE
DUAL-PORTED SRAM WITH
EXTERNAL BANK SELECTS
IDT70V7288S/L
Features
64K x 16 Bank-Switchable Dual-Ported SRAM Architecture
– Four independent 16K x 16 banks
– 1 Megabit of memory on chip
Fast asynchronous address-to-data access time: 15ns
User-controlled input pins included for bank selects
Independent port controls with asynchronous address & data
busses
Four 16-bit mailboxes available to each port for inter-
processor communications; interrupt option
Interrupt flags with programmable masking
Dual Chip Enables allow for depth expansion without
external logic
UB
and
LB
are available for x8 or x16 bus matching
LVTTL-compatible, single 3.3V (±5%) power supply
Available in a 100-pin Thin Quad Flatpack (14mm x 14mm)
Industrial temperature range (-40°C to +85°C) is available
for selected speeds
Functional Block Diagram
MUX
R/W
L
CE
0L
CE
1L
UB
L
LB
L
OE
L
16Kx16
MEMORY
ARRAY
(BANK 0)
MUX
I/O
8L-15L
I/O
0L-7L
I/O
CONTROL
MUX
16Kx16
MEMORY
ARRAY
(BANK 1)
MUX
I/O
CONTROL
I/O
8R-15R
I/O
0R-7R
R/W
R
CE
0R
CE
1R
UB
R
LB
R
OE
R
CONTROL
LOGIC
CONTROL
LOGIC
A
13L
A
0L(1)
ADDRESS
DECODE
ADDRESS
DECODE
A
13R
A
0R(1)
BA
1L
BA
0L
BANK
DECODE
MUX
16Kx16
MEMORY
ARRAY
(BANK 3)
MUX
BANK
DECODE
BA
1R
BA
0R
BKSEL
3(2)
BKSEL
0(2)
BANK
SELECT
A
5L (1)
A
0L (1)
LB
L
/UB
L
OE
L
R/W
L
CE
L
MAILBOX
INTERRUPT
LOGIC
A
5R(1)
A
0R(1)
LB
R
/UB
R
OE
R
R/W
R
CE
R
MBSEL
L
INT
L
MBSEL
R
INT
R
4077 drw 01
NOTES:
1. The first six address pins for each port serve dual functions. When
MBSEL
= V
IH
, the pins serve as memory address inputs. When
MBSEL
= V
IL
, the pins serve as mailbox
address inputs.
2. Each bank has an input pin assigned that allows the user to toggle the assignment of that bank between the two ports. Refer to Truth Table I for more details.
JUNE 2000
1
©2000 Integrated Device Technology, Inc.
DSC-4077/6
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