WED3C755E8MF-300BI datasheet, PDF

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WED3C755E8MF-300BI: DescriptionRISC Microprocessor, 300MHz, CMOS, CBGA255, 21 X 25 MM, 3.90 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255; CategoryThe embedded processor and controller Microcontrollers and processors; File Size357KB，14 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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WED3C755E8MF-300BI Overview

RISC Microprocessor, 300MHz, CMOS, CBGA255, 21 X 25 MM, 3.90 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255

WED3C755E8MF-300BI Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Objectid	1652026142
package instruction	21 X 25 MM, 3.90 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255
Reach Compliance Code	unknown
ECCN code	3A991.A.2
Address bus width	32
boundary scan	NO
maximum clock frequency	66 MHz
External data bus width	64
Format	FIXED POINT
Integrated cache	YES
JESD-30 code	R-CBGA-B255
low power mode	YES
Number of terminals	255
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	BGA
Package shape	RECTANGULAR
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	3.85 mm
speed	300 MHz
Maximum supply voltage	2.1 V
Minimum supply voltage	1.9 V
Nominal supply voltage	2 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC

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White Electronic Designs

RISC Microprocessor Multichip Package

OVERVIEW

The WEDC 755E/SSRAM multichip package is targeted

for high performance, space sensitive, low power systems

and supports the following power management features:

doze, nap, sleep and dynamic power management.

The WED3C755E8MF-XBX multichip package consists

of:

755 RISC processor (E die revision)

Dedicated 1MB SSRAM L2 cache, conﬁgured as

128Kx72

21mmx25mm, 255 Ceramic Ball Grid Array (CBGA)

Core Frequency/L2 Cache Frequency (300MHz/

150MHz, 350MHz/175MHz)

Maximum 60x Bus frequency = 66MHz

WED3C755E8MF-XBX

The WED3C755E8MF-XBX is offered in Commercial

(0°C to +70°C), industrial (-40°C to +85°C) and military

(-55°C to +125°C) temperature ranges and is well suited

for embedded applications such as missiles, aerospace,

ﬂight computers, ﬁre control systems and rugged critical

systems.

FEATURES

Footprint compatible with WED3C7558M-XBX and

WED3C750A8M-200BX

Footprint compatible with Motorola MPC 745

Replaces WED3C755E8M-XBX

Note: SSRAM JTAG function no longer available in WED3C755E8MF

* This product is subject to change without notice.

FIGURE 1 – MULTI-CHIP PACKAGE DIAGRAM

SSRAM

μP

755E

SSRAM

April 2006

Rev. 1

White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com

WED3C755E8MF-300BI Related Products

	WED3C755E8MF-300BI	WED3C755E8MF-350BM	WED3C755E8MF-300BC	WED3C755E8MF-350BC
Description	RISC Microprocessor, 300MHz, CMOS, CBGA255, 21 X 25 MM, 3.90 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255	RISC Microprocessor, 350MHz, CMOS, CBGA255, 21 X 25 MM, 3.90 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255	RISC Microprocessor, 300MHz, CMOS, CBGA255, 21 X 25 MM, 3.90 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255	RISC Microprocessor, 350MHz, CMOS, CBGA255, 21 X 25 MM, 3.90 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Objectid	1652026142	1820318076	1820318071	1820318074
package instruction	21 X 25 MM, 3.90 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255	BGA,	BGA,	BGA,
Reach Compliance Code	unknown	compliant	compliant	compliant
ECCN code	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2
Address bus width	32	32	32	32
boundary scan	NO	NO	NO	NO
maximum clock frequency	66 MHz	66 MHz	66 MHz	66 MHz
External data bus width	64	64	64	64
Format	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT
Integrated cache	YES	YES	YES	YES
JESD-30 code	R-CBGA-B255	R-CBGA-B255	R-CBGA-B255	R-CBGA-B255
low power mode	YES	YES	YES	YES
Number of terminals	255	255	255	255
Maximum operating temperature	85 °C	125 °C	70 °C	70 °C
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	BGA	BGA	BGA	BGA
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	3.85 mm	3.85 mm	3.85 mm	3.85 mm
speed	300 MHz	350 MHz	300 MHz	350 MHz
Maximum supply voltage	2.1 V	2.1 V	2.1 V	2.1 V
Minimum supply voltage	1.9 V	1.9 V	1.9 V	1.9 V
Nominal supply voltage	2 V	2 V	2 V	2 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	MILITARY	COMMERCIAL	COMMERCIAL
Terminal form	BALL	BALL	BALL	BALL
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC
Is it lead-free?	-	Contains lead	Contains lead	Contains lead
Parts packaging code	-	BGA	BGA	BGA
Contacts	-	255	255	255

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