5116X85M00000LC datasheet, PDF

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5116X85M00000LC: DescriptionACMOS Output Clock Oscillator; CategoryPassive components oscillator; File Size374KB，18 Pages; ManufacturerVectron International, Inc.; Websitehttp://www.vectron.com/

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5116X85M00000LC Overview

ACMOS Output Clock Oscillator

5116X85M00000LC Parametric

Parameter Name	Attribute value
Maker	Vectron International, Inc.
Reach Compliance Code	compliant
Is Samacsys	N
Maximum control voltage	3 V
Minimum control voltage	0.3 V
maximum descent time	3 ns
Frequency Adjustment - Mechanical	NO
Frequency offset/pull rate	30 ppm
linearity	10%
Installation features	SURFACE MOUNT
Nominal operating frequency	85 MHz
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Oscillator type	ACMOS
Output load	10 KOHM, 15 pF
longest rise time	3 ns
Maximum supply voltage	3.465 V
Minimum supply voltage	3.135 V
Nominal supply voltage	3.3 V
surface mount	YES
maximum symmetry	60/40 %
Base Number Matches	1

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REV

DESCRIPTION

NIR-63439

DATE

4/14/16

PREP

DF/SM

APPD

Oscillator Specification, Hybrid VCXO

ACMOS, 9x14 mm, J-Lead

MOUNT HOLLY SPRINGS, PA 17065

THE RECORD OF APPROVAL FOR THIS

DOCUMENT IS MAINTAINED ELECTRONICALLY

WITHIN THE ERP SYSTEM

CODE IDENT NO

Hi-Rel Standard

SIZE

DWG. NO.

REV

00136

DOC206218

UNSPECIFIED TOLERANCES: N/A

SHEET 1 0F 18

1.1

SCOPE

General. This specification defines the design, assembly and functional evaluation of high

reliability, VCXO’s produced by Vectron International. Devices delivered to this specification

represent the standardized Parts, Materials and Processes (PMP) Program developed,

implemented and certified for advanced applications and extended environments.

Applications Overview. The designs represented by these products were primarily developed

for the MIL-Aerospace community. The lesser Design Pedigrees and Screening Options

imbedded within DOC206218 bridge the gap between Space and COTS hardware by providing

custom hardware with measures of mechanical, assembly and reliability assurance needed for

Military or Ruggedized COTS environments.

APPLICABLE DOCUMENTS

Specifications and Standards. The following specifications and standards form a part of this

document to the extent specified herein. The issue currently in effect on the date of quotation

will be the product baseline, unless otherwise specified. In the event of conflict between the

texts of any references cited herein, the text of this document shall take precedence.

Military

MIL-PRF-55310

MIL-PRF-38534

Standards

MIL-STD-202

MIL-STD-883

Other

DOC206251

QSP-90100

DOC011627

DOC203982

QSP-91502

1.2

2.1

Oscillators, Crystal Controlled, General Specification For

Hybrid Microcircuits, General Specification For

Test Method Standard, Electronic and Electrical Component Parts

Test Methods and Procedures for Microelectronics

Test Specification, DOC206218 Hybrids, Hi-Rel Standard

Quality Systems Manual, Vectron International

Identification Common Documents, Materials and Processes, Hi-Rel XO

DPA Specification

Procedure for Electrostatic Discharge Precautions

3.1

GENERAL REQUIREMENTS

Classification. All devices delivered to this specification are of hybrid technology conforming

to Type 2, Class 2 of MIL-PRF-55310. Primarily developed as a Class S equivalent

specification, options are imbedded within it to also produce Class B, Engineering Model and

Ruggedized COTS devices. Devices carry a Class 2 ESDS classification per MIL-PRF-38534.

Item Identification. See paragraph 7.1 for part number configuration.

3.2

3.3

Absolute Maximum Ratings.

a. Supply Voltage Range (V

UNSPECIFIED TOLERANCES

-0.5Vdc to +7.0Vdc

DWG NO.

REV.

SHEET

SIZE

CODE IDENT NO.

00136

N/A

DOC206218

b. Storage Temperature Range (T

STG

c. Junction Temperature (T

d. Lead Temperature (soldering, 10 seconds):

e. Output Source/Sink Current:

3.4

3.4.1

-65°C to +125°C

+175°C

+300°C

±70 mA

Design, Parts, Materials and Processes, Assembly, Inspection and Test.

Design. The ruggedized designs implemented for these devices are proven in military and

space applications under extreme environments. The design utilizes a 4-point crystal mount in

compliment with Established Reliability (MIL-ER) componentry. When specified, radiation

hardening up to 100krad(Si) (RHA level R) can be included without altering the device’s

internal topography.

3.4.1.1 Design and Configuration Stability. Barring changes to improve performance by reselecting

passive chip component values to offset component tolerances, there will not be fundamental

changes to the design or assembly or parts, materials and processes after first product delivery

of that item without written approval from the procuring activity.

3.4.1.2 Environmental Integrity. Designs have passed the environmental qualification levels of MIL-

PRF-55310.

3.4.2

Prohibited Parts, Materials and Processes. The items listed are prohibited for use in high

reliability devices produced to this specification.

a. Gold metallization of package elements without a barrier metal.

b. Zinc chromate as a finish.

c. Cadmium, zinc, or pure tin external or internal to the device.

d. Plastic encapsulated semiconductor devices.

e. Ultrasonically cleaned electronic parts.

f. Heterojunction Bipolar Transistor (HBT) technology.

g. ‘getter’ materials

Assembly. Manufacturing utilizes standardized procedures, processes and verification

methods to produce MIL-PRF-55310 Class S / MIL-PRF-38534 Class K equivalent devices.

MIL-PRF-38534 Group B Option 1 in-line inspection is included on radiation hardened part

numbers to further verify lot pedigree. Traceability of all components and production lots are

in accordance with MIL-PRF-38534, as a minimum. Tabulated records are provided as a part

of the deliverable data package. Devices are handled in accordance with Vectron document

QSP-91502 (Procedure for Electrostatic Discharge Precautions).

Inspection. The inspection requirements of MIL-PRF-55310 apply to all devices delivered to

this document. Inspection conditions and standards are documented in accordance with the

Quality Assurance, ISO-9001 and AS9100 derived, System of QSP-90100.

Test. The Screening test matrix of Table 4 is tailored for selectable-combination testing to

eliminate costs associated with the development/maintenance of device-specific documentation

packages while maintaining performance integrity.

Marking. Device marking shall be in accordance with the requirements of MIL-PRF-55310.

UNSPECIFIED TOLERANCES

3.4.3

3.4.4

3.4.5

3.4.6

SIZE

CODE IDENT NO.

DWG NO.

REV.

SHEET

00136

N/A

DOC206218

3.4.7

Ruggedized COTS Design Implementation. Design Pedigree “D” devices (see ¶ 5.2) use the

same robust designs found in the other device pedigrees. They do not include the provisions of

traceability or the Class-qualified componentry noted in paragraphs 3.4.3 and 4.1.

DETAIL REQUIREMENTS

Components

Crystals. Cultured quartz crystal resonators are used to provide the selected frequency for the

devices. The optional use of Premium Q swept quartz can, because of its processing to remove

impurities, be specified to minimize frequency drift when operating in radiation environments.

In accordance with MIL-PRF-55310, the manufacturer has a documented crystal element

evaluation program.

Passive Components. Passive components will have the same pedigree as the die specified in

paragraph 7.1. Lot evaluations are in accordance with MIL-PRF-38534 or Enhanced Element

Evaluation as specified in Table 7. When used, inductors may be open construction and may

use up to 47 gauge wire.

Class S Microcircuits. Devices are assembled with a varactor diode and an ACMOS chip

which are procured from wafer lots that have passed MIL-PRF-38534 Class K Lot Acceptance

Tests for Class S devices. The prescribed die carries a Class 2 ESDS classification in

accordance with MIL-PRF-38534. When optionally specified, further testing in accordance

with MIL-PRF-55310 and MIL-PRF-38534 is performed for radiation hardness assurance and

for Enhanced Element Evaluation as specified in Table 6. Those microcircuits, identified by a

unique part number, are certified for 100krad(Si) total ionizing dose (TID), RHA level R (2X

minimum margin). NSC, as the original 54ACT designer, rates the SEU LET at >40 MeV and

SEL at >120MeV for the FACT™ family (AN-932). Vectron has conducted additional SEE

testing in 2008 to verify this performance since our lot wafer testing does not include these

parameters and determinations. In addition, the varactor diode is considered insensitive to TID

and Single Event Effects.

4.1

4.1.1

4.1.2

4.1.3

4.1.3.1 Class B Microcircuits. When specified, microcircuits assembled into OS-68338 Design

Pedigree letters “B” and “C” devices (¶ 5.2a) are procured from wafer lots that have passed

MIL-PRF-55310 element evaluations for Class B devices.

4.1.4

Packages. Packages are procured that meet the construction, lead materials and finishes as

specified in MIL-PRF-55310. Package lots are upscreened in accordance with the

requirements of MIL-PRF-38534 as applicable.

Traceability and Homogeneity. All design pedigrees except option D have active device lots

that are traceable to the manufacturer’s individual wafer; all other elements and materials are

traceable to their manufacturer and incoming inspection lots. Design pedigrees E, R, V and X

have homogeneous material. In addition, swept quartz crystals are traceable to the quartz bar

and the processing details of the autoclave lot, as applicable.

4.1.5

SIZE

CODE IDENT NO.

UNSPECIFIED TOLERANCES

DWG NO.

REV.

SHEET

00136

N/A

DOC206218

4.1.6

Enhanced Element Evaluation. When Design Pedigree Option “E” is specified, active and

passive devices with Enhanced Element Evaluation as listed in Table 5, 6 and 7 shall be

implemented for the highest reliability preference.

Mechanical.

Package Outline. See Figure 1.

Thermal Characteristics. The worst case thermal characteristics are found in Table 3.

Electrical.

Input Power. Devices are available with an input voltage of either +5.0 Vdc (±5%) or +3.3

Vdc (±5%). Current is measured, no load, at maximum rated operating voltage.

Temperature Range. Operating range is -40°C to +85°C.

Absolute Pull Range. Absolute pull range is defined as the minimum guaranteed amount the

VCXO can be varied about the center frequency (fo). It accounts for degradations including

temperature stability (-40°C to +85°C), aging (15 years), radiation effects, power supply

variations (±5%) and load variations (±10%).

Frequency Aging. When tested in accordance with MIL-PRF-55310 Group B inspection, the

15-year aging projection shall not cause the minimum APR limit to be exceeded.

Operating Characteristics. Symmetrical square wave limits are dependent on the device

frequency and are in accordance with Table 1. Waveform measurement points and logic limits

are in accordance with MIL-PRF-55310. Start-up time is 10.0 msec. maximum.

Output Load. ACMOS (10k , 15pF) test loads are in accordance with MIL-PRF-55310.

QUALITY ASSURANCE PROVISIONS AND VERIFICATION

Verification and Test. Device lots shall be tested prior to delivery in accordance with the

applicable Screening Option letter as stated by the 15

character of the part number. Table 4

tests are conducted in the order shown and annotated on the appropriate process travelers and

data sheets of the governing test procedure. For devices that require Screening Options that

include MIL-PRF-55310 Group A testing, the Post-Burn-In Electrical Test and the Group A

Electrical Test are combined into one operation.

Screening Options. The Screening Options, by letter, are summarized as:

Modified MIL-PRF-38534 Class K

Modified MIL-PRF-55310 Class B Screening & Group A Quality Conformance

Inspection (QCI)

Modified MIL-PRF-55310 Class S Screening & Group A QCI

Modified MIL-PRF-38534 Class K with Group B Aging

Modified MIL-PRF-55310 Class B Screening, Groups A & B QCI

4.2

4.2.1

4.2.2

4.3

4.3.1

4.3.2

4.3.3

4.3.4

4.3.5

4.3.6

5.1

5.1.1

SIZE

CODE IDENT NO.

UNSPECIFIED TOLERANCES

DWG NO.

REV.

SHEET

00136

N/A

DOC206218

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