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F100156DCQM

Description
Network Interface, ECL100K, CDIP24,
CategoryWireless rf/communication    Telecom circuit   
File Size220KB,7 Pages
ManufacturerFairchild
Websitehttp://www.fairchildsemi.com/
Download Datasheet Parametric Compare View All

F100156DCQM Overview

Network Interface, ECL100K, CDIP24,

F100156DCQM Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerFairchild
Reach Compliance Codecompliant
Is SamacsysN
JESD-30 codeR-XDIP-T24
JESD-609 codee0
Number of terminals24
Maximum operating temperature85 °C
Minimum operating temperature
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP24,.4
Package shapeRECTANGULAR
Package formIN-LINE
Certification statusNot Qualified
surface mountNO
technologyECL100K
Temperature levelOTHER
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Base Number Matches1

F100156DCQM Related Products

F100156DCQM F100156DC F100156DCQR F100156FCQM F100156FC F100156FCQR
Description Network Interface, ECL100K, CDIP24, Network Interface, ECL100K, CDIP24, Network Interface, ECL100K, CDIP24, Network Interface, ECL100K, CQFP24, Network Interface, ECL100K, CQFP24, Network Interface, ECL100K, CQFP24,
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
Maker Fairchild Fairchild Fairchild Fairchild Fairchild Fairchild
Reach Compliance Code compliant compliant compliant compliant compliant compliant
Is Samacsys N N N N N N
JESD-30 code R-XDIP-T24 R-XDIP-T24 R-XDIP-T24 S-XQFP-F24 S-XQFP-F24 S-XQFP-F24
JESD-609 code e0 e0 e0 e0 e0 e0
Number of terminals 24 24 24 24 24 24
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Package body material CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC
encapsulated code DIP DIP DIP QFF QFF QFF
Encapsulate equivalent code DIP24,.4 DIP24,.4 DIP24,.4 QFL24,.4SQ QFL24,.4SQ QFL24,.4SQ
Package shape RECTANGULAR RECTANGULAR RECTANGULAR SQUARE SQUARE SQUARE
Package form IN-LINE IN-LINE IN-LINE FLATPACK FLATPACK FLATPACK
surface mount NO NO NO YES YES YES
technology ECL100K ECL100K ECL100K ECL100K ECL100K ECL100K
Temperature level OTHER OTHER OTHER OTHER OTHER OTHER
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE FLAT FLAT FLAT
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL DUAL QUAD QUAD QUAD
Base Number Matches 1 1 1 1 1 1
Certification status Not Qualified Not Qualified - Not Qualified Not Qualified -
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