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MV1N6507

Description
Trans Voltage Suppressor Diode, Unidirectional, 8 Element, Silicon, HERMETIC SEALED, CERAMIC, DIP-14
CategoryDiscrete semiconductor    diode   
File Size81KB,2 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric Compare View All

MV1N6507 Overview

Trans Voltage Suppressor Diode, Unidirectional, 8 Element, Silicon, HERMETIC SEALED, CERAMIC, DIP-14

MV1N6507 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMicrosemi
Parts packaging codeDIP
package instructionR-CDIP-T14
Contacts14
Reach Compliance Codecompliant
ECCN codeEAR99
Is SamacsysN
Other featuresLOW CAPACITANCE, HIGH RELIABILITY
Minimum breakdown voltage60 V
ConfigurationCOMMON ANODE, 8 ELEMENTS
Diode component materialsSILICON
Diode typeTRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 codeR-CDIP-T14
JESD-609 codee0
Number of components8
Number of terminals14
Maximum operating temperature150 °C
Minimum operating temperature-65 °C
Package body materialCERAMIC, METAL-SEALED COFIRED
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
polarityUNIDIRECTIONAL
Maximum power dissipation0.6 W
Certification statusNot Qualified
surface mountNO
technologyAVALANCHE
Terminal surfaceTIN LEAD
Terminal formTHROUGH-HOLE
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
Base Number Matches1
1N6507
Isolated Diode Array with
HiRel MQ, MX, MV, and MSP Screening Options
SCOTTSDALE DIVISION
DESCRIPTION
These low capacitance diode arrays with common anode are multiple, discrete, isolated
junctions fabricated by a planar process and mounted in a 10-PIN package for use as
steering diodes protecting up to eight I/O ports from ESD, EFT, or surge by directing
them to ground (see figure 1). This circuit application is further complimented by the
1N6506 (separate data sheet) that has a common cathode. An external TVS diode
may be added between the positive supply line and ground to prevent overvoltage on
the supply rail. They may also be used in fast switching core-driver applications. This
includes computers and peripheral equipment such as magnetic cores, thin-film
memories, plated-wire memories, etc., as well as decoding or encoding applications.
These arrays offer many advantages of integrated circuits such as high-density
packaging and improved reliability. This is a result of fewer pick and place operations,
smaller footprint, smaller weight, and elimination of various discrete packages that may
not be as user friendly in PC board mounting.
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
APPEARANCE
WWW .
Microsemi
.C
OM
14-PIN Ceramic DIP
FEATURES
Hermetic Ceramic Package
Isolated Diodes to Eliminate Cross-Talk Voltages
High Breakdown Voltage V
BR
> 60 V at 10
μA
Low Leakage I
R
< 100nA at 40 V
Low Capacitance C < 8.0 pF
Options for screening in accordance with MIL-PRF-
19500/474 for JAN, JANTX, JANTXV, and JANS are
available by adding MQ, MX, MV, or MSP prefixes
respectively to part numbers. For example, designate
MX1N6507 for a JANTX screen.
APPLICATIONS / BENEFITS
High Frequency Data Lines
RS-232 & RS-422 Interface Networks
Ethernet: 10 Base T
Computer I/O Ports
LAN
Switching Core Drivers
IEC 61000-4 Compatible (see circuit in figure 1)
61000-4-2 ESD: Air 15 kV, contact 8 kW
61000-4-4 (EFT): 40 A – 5/50 ns
61000-4-5 (surge): 12 A 8/20
μs
MAXIMUM RATINGS
V
BR
Reverse Breakdown Voltage 60 V min (Notes 1 & 2)
I
O
Continuous Forward Current of 300 mA (Notes 1 & 3)
I
FSM
Forward Surge Current (tp=1/120 s) 500 mA (Note 1)
400 mW Power Dissipation per Junction @ 25
o
C
600 mW Power Dissipation per Package @ 25
o
C (Note 4)
o
Operating Junction Temperature range –65 to +150 C
Storage Temperature range of –65 to +200
o
C
NOTE 1:
NOTE 2:
NOTE 3:
NOTE 4:
Each Diode
Pulsed: P
W
= 100 ms max; duty cycle <20%
o
o
Derate at 2.4 mA/ C above +25 C
o
o
Derate at 4.0 mW/ C above +25 C
MECHANICAL AND PACKAGING
14-PIN Ceramic DIP
Weight 2.05 grams (approximate)
Marking: Logo, part number, date code
Pin #1 to the left of the indent on top of package
Carrier Tubes; 25 pcs (standard)
ELECTRICAL CHARACTERISTICS (Per Diode) @ 25
o
C unless otherwise specified
MAXIMUM
FORWARD
VOLTAGE
V
F1
I
F
= 100 mA
(Note 1)
V
MAXIMUM
FORWARD
VOLTAGE
V
F2
I
F
= 500 mA
(Note 1)
V
MAXIMUM
REVERSE
CURRENT
I
R1
V
R
= 40 V
μA
MAXIMUM
CAPACITANCE
(PIN TO PIN)
MAXIMUM
FORWARD
RECOVERY TIME
t
fr
I
F
= 500 mA
ns
MAXIMUM
REVERSE
RECOVERY TIME
trr
I
F
=
I
R
= 200 mA
i
rr
= 20 mA
R
L
= 100 ohms
ns
1N6507
C
t
V
R
= 0 V
F = 1 MHz
pF
PART
NUMBER
1N6507
Copyright
©
2006
01-24-2006 REV C
1
1.5
0.1
8.0
40
20
NOTE 1:
Pulsed: P
W
= 300 us +/- 50 µs, duty cycle <2%, 90 µs after leading edge.
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1

MV1N6507 Related Products

MV1N6507 MSP1N6507 MQ1N6507 MX1N6507
Description Trans Voltage Suppressor Diode, Unidirectional, 8 Element, Silicon, HERMETIC SEALED, CERAMIC, DIP-14 Trans Voltage Suppressor Diode, Unidirectional, 8 Element, Silicon, HERMETIC SEALED, CERAMIC, DIP-14 Trans Voltage Suppressor Diode, Unidirectional, 8 Element, Silicon, HERMETIC SEALED, CERAMIC, DIP-14 Trans Voltage Suppressor Diode, Unidirectional, 8 Element, Silicon, HERMETIC SEALED, CERAMIC, DIP-14
Is it lead-free? Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible
Maker Microsemi Microsemi Microsemi Microsemi
Parts packaging code DIP DIP DIP DIP
package instruction R-CDIP-T14 R-CDIP-T14 R-CDIP-T14 R-CDIP-T14
Contacts 14 14 14 14
Reach Compliance Code compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99
Is Samacsys N N N N
Other features LOW CAPACITANCE, HIGH RELIABILITY LOW CAPACITANCE, HIGH RELIABILITY LOW CAPACITANCE, HIGH RELIABILITY LOW CAPACITANCE, HIGH RELIABILITY
Minimum breakdown voltage 60 V 60 V 60 V 60 V
Configuration COMMON ANODE, 8 ELEMENTS COMMON ANODE, 8 ELEMENTS COMMON ANODE, 8 ELEMENTS COMMON ANODE, 8 ELEMENTS
Diode component materials SILICON SILICON SILICON SILICON
Diode type TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 code R-CDIP-T14 R-CDIP-T14 R-CDIP-T14 R-CDIP-T14
JESD-609 code e0 e0 e0 e0
Number of components 8 8 8 8
Number of terminals 14 14 14 14
Maximum operating temperature 150 °C 150 °C 150 °C 150 °C
Minimum operating temperature -65 °C -65 °C -65 °C -65 °C
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
polarity UNIDIRECTIONAL UNIDIRECTIONAL UNIDIRECTIONAL UNIDIRECTIONAL
Maximum power dissipation 0.6 W 0.6 W 0.6 W 0.6 W
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
surface mount NO NO NO NO
technology AVALANCHE AVALANCHE AVALANCHE AVALANCHE
Terminal surface TIN LEAD TIN LEAD TIN LEAD TIN LEAD
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal location DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Base Number Matches 1 1 1 1

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