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The problem of dynamic sealing of equipment always exists with the operation of the equipment. Today, we have specially sorted out the various commonly used sealing forms, usage scope and character...[Details]
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Flip-chip and ball grid array (BGA) are two widely used packaging technologies in the electronics industry. Each has its own advantages and limitations, and in some cases, they can complement each ...[Details]
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The most significant feature of IPS panels is that both electrodes are located on the same surface, unlike other LCD panels, which have electrodes arranged on top and bottom surfaces in a three-dim...[Details]
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Today's security industry has entered the era of massive networking. Many enterprises, especially financial institutions, have established multi-level video surveillance networking platforms. Lever...[Details]
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According to foreign media reports, researchers at the University of Surrey have developed an artificial intelligence system that can accurately locate the location of equipment in densely populate...[Details]
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According to foreign media reports, BMW has just been granted a patent for a screen that could cover the entire roof. BMW hopes to transform at least a portion of the vehicle's headliner into a dis...[Details]
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The automotive industry in 2025 is undergoing a thorough intelligent reshuffle.
Geely wants to make changes in the field of AI cockpits: in the future, there will be no traditional smart...[Details]
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As “energy conservation and emission reduction” has become an indicator of the National Economic Development Outline of the 11th Five-Year Plan, people’s awareness of green enviro...[Details]
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In the scorching summer, electric fans are a must-have for cooling down people's homes. However, I believe most people have encountered this situation: the fan is plugged in, the switch is pressed,...[Details]
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Electric vehicles' 12V batteries don't rely on a generator to power them. Only gasoline-powered vehicles rely on the engine to drive a generator to generate electricity while driving, which is used...[Details]
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Learned the following information.
Customer product: industrial computer motherboard
Glue application area: CPU/BGA filling
Glue color requirements: black or t...[Details]
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Reflow soldering is one of the most commonly used methods in electronics manufacturing, allowing for the soldering of large numbers of components in a relatively short time. However, any experience...[Details]
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On August 22, the Wall Street Journal reported on the 21st local time that the new US government does not plan to acquire equity in semiconductor wafer foundry giant TSMC and Micron, one of the thr...[Details]
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On August 20, Geely announced its focus on "One Cockpit". Through a unified AI OS architecture, a unified AI Agent, and a unified user ID, it will achieve an All-in-One AI cockpit, create the first...[Details]
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The difference between a series inverter and a parallel inverter is that they use different oscillation circuits. A series inverter connects L, R, and C in series, while a parallel inverter connect...[Details]
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