9
8
7
6
5
4
3
2
1
A
C
B
E
Z
6
±
0.05
2
±
0.05
(公差非累積)
(PITCH)
(NON-ACCUMULATIVE)
6.95
±
0.05
1.25
±
0.05
1.25
±
0.05
0.18
±
0.05
⌯
0.2
Z
6.95
±
0.05
0.5
±
0.05
E
1
2
(PITCH)
TYP.
4.35
3.275
±
0.05
D
B
ハウジング
HOUSING
金具
4
FITTING NAIL
2.47
±
0.05
2.15
±
0.1
2.15
±
0.1
8
2
(
0.3
)
(
3.1
)
(PITCH)
1
C
3
6.35
0.15
C
1.47
B
4.85
4.6
2.47
±
0.05
D
3.275
±
0.05
D
ターミナル
TERMINAL
2.275
0.8
13.21 15.3
6.0
19.1
11.21 13.3
4.0
17.1
9.21 11.3
2.0
15.1
D
C
B
A
5051470490
5051470390
5051470290
EMBOSSED PACKAGE
4
3
2
極数
B
CONNECTOR SERIES NO. 505147**11
2016/05/10
2016/05/13
2016/05/13
GENERAL
TOLERANCES
(UNLESS SPECIFIED)
ANGULAR TOL ±
3.0
°
DIMENSION UNITS
オーダー番号 ORDER NO. CIRCUITS
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
SCALE
MM
DRWN BY
DATE
5:1
2015/10/21
DATE
4 PLACES
±
±
±
±
±
0.2
0.2
0.2
0.2
0.2
AISHII
CHK'D BY
104966
AISHII
KTAKAHASHI
TKUSUHARA01
A
3 PLACES
2 PLACES
1 PLACE
0 PLACES
2.0 FPC TO BOARD CONN REC. HSG ASSY(RA)
KTAKAHASHI
APPR BY
DATE
2015/12/03
2015/12/04
A
PRODUCT CUSTOMER DRAWING
SERIES
MATERIAL NUMBER
CUSTOMER
YNOGAWA
DRAWING SIZE
EC NO:
DRWN:
CHK'D:
APPR:
THIRD ANGLE PROJECTION
RELEASE STATUS
FORMAT: master-tb-prod-A3
REVISION: G
DATE: 2015/12/14
9
P1
RELEASE DATE
13.05.2016
8
05:58:41
7
6
5
B
REV
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
505147
DOCUMENT NUMBER
SEE CHART
GENERAL
DOC TYPE
DOC PART
SHEET NUMBER
A3
3
4
5051471000
2
PSD
000
1
1 OF 3
9
8
7
6
5
4
3
2
1
(
2.0×(N-1)+7.16
)
E
参考 プラグコネクタ
REFERENCE PLUG CONNECTOR
注記 NOTES
1. ½用材料 MATERIAL
ハウジング
：液晶ポリマー(LCP),ガラス充填
UL94V-0,色；黒色
HOUSING :LIQUID QRYSTAL POLYMER(LCP),GLASS FILLED
E
UL94V-0,COLOR;BLACK
ターミナル
：銅合金(t=0.18)
TERMINAL :COPPER ALLOY(t=0.18)
金具
：銅合金(t=0.25)
FITTING NAIL :COPPER ALLOY(t=0.25)
5
D
プラグジャケット
PLUG JACKET
2. めっき仕様 PLATING
ターミナル TERMINAL
コンタクト部：部分金めっき(0.1μm以上)
テール部 ：部分金めっき
下地 ：ニッケルめっき(1.0μm以上)
CONTACT AREA :SEPARATED GOLD PLATING
(0.1 MICROMETER MINIMUM)
SOLDER TAIL AREA :SEPARATED GOLD PLATING
UNDERPLATE
:NICKEL OVERALL
(1.0 MICROMETER MINIMUM)
金具 FITTING NAIL
錫めっき(1.0μm以上)
下地 ：ニッケルめっき(1.0μm以上)
TIN PLATING (0.1 MICROMETER MINIMUM)
UNDERPLATE
:NICKEL OVERALL
(1.0 MICROMETER MINIMUM)
3
D
C
Ｎ＝偶数に適用（Ｎ：極数）
APPLY FOR N=EVEN(N:CIRCUIT)
パターン剥離止め用金具
FITTING NAIL FOR PREVENTION OF PEELING OF P.C.B PATTERN.
C
(
5.16
)
(
11.5
)
4
5
適合プラグジャケット：505148**08
½品詳細寸法は5051480000を参照下さい。
APPLICABLE PLUG JACKET:505148**08.
DETAILED DIMENSION,SEE 5051480000.
B
B
6. テールと金具を½せた平坦度は0.1mm以下とする。
TAILS AND NAILS COPLANARITY TO BE 0.1mm MAXIMUM.
7. ELV及びRoHS適合品
ELV AND RoHS COMPLIANT.
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
2016/05/10
2016/05/13
2016/05/13
GENERAL
TOLERANCES
(UNLESS SPECIFIED)
ANGULAR TOL ±
3.0
°
DIMENSION UNITS
SCALE
MM
DRWN BY
DATE
5:1
2015/10/21
DATE
4 PLACES
±
±
±
±
±
0.2
0.2
0.2
0.2
0.2
AISHII
CHK'D BY
104966
AISHII
KTAKAHASHI
TKUSUHARA01
A
3 PLACES
2 PLACES
1 PLACE
0 PLACES
2.0 FPC TO BOARD CONN REC. HSG ASSY(RA)
KTAKAHASHI
APPR BY
DATE
2015/12/03
2015/12/04
A
PRODUCT CUSTOMER DRAWING
SERIES
MATERIAL NUMBER
CUSTOMER
YNOGAWA
DRAWING SIZE
EC NO:
DRWN:
CHK'D:
APPR:
FPC
RELEASE STATUS
FORMAT: master-tb-prod-A3
REVISION: G
DATE: 2015/12/14
THIRD ANGLE PROJECTION
9
P1
RELEASE DATE
13.05.2016
8
05:58:41
7
6
5
B
REV
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
505147
DOCUMENT NUMBER
SEE CHART
GENERAL
DOC TYPE
DOC PART
SHEET NUMBER
A3
3
4
5051471000
2
PSD
000
1
2 OF 3
9
8
7
6
5
4
補強板：ポリイミド
STIFFENER: POLYIMIDE
熱硬化接着剤
THERMOSET ADHESIVE
ベースフィルム：ポリイミド(25μm)
BASE FILM: POLYIMIDE(25μm)
熱硬化接着剤
THERMOSET ADHESIVE
3
2
1
(
2.0×(N-1)+7.6
±
0.05
)
2.0×(N-1)+3.6
±
0.05
⌯
0.03
X
E
°
60
60
°
80
°
R
0.2
E
R
0.2
MAX.
R
0.2
R
0.3
±
0.1
R
0.2
R
0.3
0.15
±
0.15
±
0.1
熱硬化接着剤
THERMOSET ADHESIVE
カバーレイ：ポリイミド(25μm)
COVER FILM: POLYIMIDE(25μm)
めっき：金めっき (0.2μm)
下地ニッケル(1-5μm)
PLATING: GOLD(0.2μm)
NICKEL UNDER (1-5μm)
FPC構成推奨仕様
RECOMMENDED STRUCTURE OF FPC
0.35
±
0.03
45
°
D
仕上がり厚さ
THICKNESS
導½部：銅箔(35μm)
COPPER FOIL (35μm)
0.3
±
0.03
R
0.2
R
0.3
±
0.1
2
±
0.05
(PITCH)
7
(補強板)
(STIFFENER)
R
0.2
C
FPC について:
打ち抜き方向は導½側から補強板側を推奨します。
導½部については軟銅箔35μmまたは50μmを推奨します
補強フィルム材質はポリイミドを推奨します。ベ－スフィルムは25μmを推奨します。
接着剤は熱硬化接着剤を推奨します。
接点部に異物が無い様お願い致します。
NOTES OF FPC :
RECOMMENDED PUNCHER DIRECTION : FROM CONDUCTOR SIDE TOWARDS STIFFENER SIDE.
RECOMMENDED CONDUCTOR SPEC :
THICKNESS OF SOFT COPPER FOIL : 35 MICROMETER OR 50 MICROMETER.
RECOMMENDED MATERIAL/THICKNESS.
STIFFERNER : POLYIMIDE
BASE FILM THICKNESS : 25μm
ADHESIVE : THERMOSET ADHESIVE
THE CONTACT PAD AREA SHOULD BE WELL INSPECTED AND AVOID ALL FOREIGN CONTAMINATIONS.
D
0.2
1.5
±
0.1
2.6
±
0.05
0.35
±
0.15
5.57
±
0.05
8.15
±
0.07
2.0×(N-1)
±
0.1
2.0×(N-1)+3.05
±
0.1
2.0×(N-1)+5.2
±
0.05
B
参考FPC寸法
REFERENCE FPC DIMENSION
(仕上がり厚さ ： 接点部0.3±0.03)
(THICKNESS : CONTACT AREA 0.3 +/-0.03)
PLUG CONNECTOR
PLUG JACKET
X
B
REC CONNECTOR
2016/05/10
2016/05/13
2016/05/13
11.15
±
0.1
(
8.612
)
2.6
±
0.5
2.6
±
0.15
C
HOUSING
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
GENERAL
TOLERANCES
(UNLESS SPECIFIED)
ANGULAR TOL ±
3.0
°
DIMENSION UNITS
SCALE
MM
DRWN BY
DATE
5:1
2015/10/21
DATE
TERMINAL
FPC
4 PLACES
±
±
±
±
±
0.2
0.2
0.2
0.2
0.2
AISHII
CHK'D BY
104966
AISHII
KTAKAHASHI
TKUSUHARA01
A
嵌合断面
MATED CONNECTOR SECTION
RELEASE STATUS
FORMAT: master-tb-prod-A3
REVISION: G
DATE: 2015/12/14
3 PLACES
2 PLACES
1 PLACE
0 PLACES
2.0 FPC TO BOARD CONN REC. HSG ASSY(RA)
KTAKAHASHI
APPR BY
DATE
2015/12/03
2015/12/04
A
PRODUCT CUSTOMER DRAWING
SERIES
MATERIAL NUMBER
CUSTOMER
YNOGAWA
DRAWING SIZE
EC NO:
DRWN:
CHK'D:
APPR:
THIRD ANGLE PROJECTION
9
P1
RELEASE DATE
13.05.2016
8
05:58:41
7
6
5
B
REV
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
505147
DOCUMENT NUMBER
SEE CHART
GENERAL
DOC TYPE
DOC PART
SHEET NUMBER
A3
3
4
5051471000
2
PSD
000
1
3 OF 3
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