NMC-P1206X7R105K16TRPLPF datasheet, PDF

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NMC-P1206X7R105K16TRPLPF: DescriptionMultilayer Ceramic Chip Capacitors; File Size81KB，5 Pages; ManufacturerNIC; Websitehttps://www.niccomp.com

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NMC-P1206X7R105K16TRPLPF Overview

Multilayer Ceramic Chip Capacitors

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Multilayer Ceramic Chip Capacitors

FEATURES

• CRACK RESISTANT TERMINATION

• SOFT TERMINATION, OPEN MODE FAILURE

• WIDE VOLTAGE RANGE (16V TO 5KV)

• HIGH CAPACITANCE (UP TO 10µF)

• RoHS COMPLIANT

• SAC SOLDER COMPATIBLE**

Temperature Coefﬁcient

Capacitance Range

NMC-P Series

RoHS

Compliant

includes all homogeneous materials

*See Part Number System for Details

NPO

X7R

2.2pF ~ 0.22µF

180pF ~ 10µF

For 2.2pF ~ 10pF: ±0.1pF (B), ±0.25pF (C), ±0.5pF (D), ±1pF (F)

Capacitance Tolerance

±10% (K) & ±20% (M)

Above 10pF: ±1% (F), ±2% (G), ±5% (J), ±10% (K)

Operating Temperature Range

-55°C ~ +125°C

Temperature Characteristics

±30ppm/°C

±15%

∆

Cap.

Rated Voltages

16Vdc, 25Vdc, 50Vdc, 100Vdc, 200Vdc, 250Vdc, 500Vdc, 630Vdc, 1KVdc, 2Kvdc, 3Kvdc & 5Kvdc

Q = > 1000 (more then 30pF)*

2.5% max. @ 1KHz, 1.0V ± 0.2Vrms

Q or Dissipation Factor

Q = > 400 + 20 x C in pF (30pF and below)*

insulation Resistance

10,000Megohm or 500Megohm/µF whichever is less @ +25°C

200% of rated voltage for 5 seconds, 50mA max. (16V ~ 250V)

Dielectric Withstanding Voltage

150% of rated voltage for 5 seconds, 50mA max. (500V ~ 630V)

120% of rated voltage for 5 seconds, 50mA max. (1KV ~ 5KV)

*Test Frequency & Voltage: Up to 100pF 1MHz/1.0Vrms, Above 100pF 1KHz/1.0Vrms

**Reﬂow soldering is recommended. Contact NIC regarding the use of other soldering methods.

PART NUMBER SYSTEM

NMC-P 1206 X7R 105 K 50 TRP or TRPLP F

RoHS Compliant

Tape & Reel (Plastic Carrier)

Tape & Reel (Paper Carrier)

Voltage (Vdc)

Capacitance Tolerance Code (see chart)

Capacitance Code, expressed in pF, ﬁrst 2 digits are

signiﬁcant, 3rd digit is no. of zeros

Temperature Characteristic (NPO or X7R)

Size Code (see chart)

Series

CONSTRUCTION

Base layer (Cu 50V ~ 250V)

(Ag 500V ~ up)

Flexible layer (Polymer)

Barrier layer (Ni)

Finish layer (Sn)

OPEN MODE FAILURE AS A RESULT OF BENDING STRESS

Termination Separation

(Open Failure Mode)

NIC COMPONENTS CORP.

NMC-P rev. 1 05302007

www.niccomp.com

www.lowESR.com

www.RFpassives.com

www.SMTmagnetics.com

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