using highly repetitive MMIC processing with thin film resistors on GaAs substrates. They contain through-
wafer Cu metallization vias to realize low thermal resistance and very wideband operation. YAT attenuator
dice are available from stock with nominal attenuation values of 0 to 10 dB (in 1 dB steps), and 12, 15, 20,
and 30 dB.
Key Features
Feature
Wideband operation, DC to 26.5 GHz
Usable to 40 GHz
Advantages
YAT-D-series attenuator dice support a wide array of applications including wire-
less cellular, microwave communications, satellite, defense and aerospace, medical
broadband and optical applications. They are also usable in applications up to 40
GHz such as 5G systems (See application note AN-70-019).
Power handling up to 2W makes YAT attenuator dice suitable for a wide range of
system power requirements.
Small increment offerings enable circuit designers to change attenuation values without
motherboard redesign, making the YAT-D-series ideal for adjusting attenuation values
based on test results.
Provides precise, consistent attenuation across the entire frequency band, ideal for broad-
band and multi-band usage.
Enables the user to integrate the attenuator die directly into hybrids.
High power handling, up to 2W
Wide range of nominal attenuation values:
• 0 to 10 dB (in 1 dB steps) and 12, 15, 20
and 30 dB
Excellent attenuation flatness
Unpackaged die
Notes
A.
Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document.
B.
Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions.
C.
The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled
to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp
www.minicircuits.com
P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com
Mini-Circuits
®
Page 1 of 5
Fixed Attenuator Die
50Ω
1.6W
15dB
DC to 26.5 GHz
Product Features
• wide bandwidth, DC-26.5 GHz
• excellent attenuation accuracy & flatness
• exceptional power handling, up to 2W
Microwave Precision
YAT-15-D+
+RoHS Compliant
Typical Applications
• Cellular
• PCS
• communications
• radar
• defense
The +Suffix identifies RoHS Compliance. See our web site
for RoHS Compliance methodologies and qualifications
General Description
YAT-15-D+ is a absorptive attenuator die fabricated using highly repetitive MMIC process including thin
film resistors on Silicon substrate. YAT-15-D+ attenuator die contains through-wafer Cu metallization vias
to realize low thermal resistance and wideband operation.
Simplified Schematic and Pad description
Pad
RF-IN
RF-OUT
GND
Description
RF input pad
RF output pad
GND pads
Notes
A.
Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document.
B.
Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions.
C.
The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled
to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp
www.minicircuits.com
P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com
Mini-Circuits
®
REV. OR
M152022
YAT-15-D+
RS/CP/AM
170113
Page 2 of 5
Fixed Attenuator Die
Electrical Specifications at 25°C, 50Ω
Parameter
Frequency Range
DC - 5
Attenuation
1
5 - 15
15 - 18
18 - 26.5
DC - 5
VSWR
1
YAT-15-D+
Condition (GHz)
Min.
DC
15.0
15.1
15.2
15.4
1.1
1.2
1.2
1.3
1.6
1
W
W
:1
dB
Typ.
Max.
26.5
Unit
GHz
5 - 15
15 - 18
18 - 26.5
25°C
85°C
DC - 18
DC - 18
Operating Input Power at
2
:
1. Electrical specifications are typical measured characteristics on die using MPI Titan Series 250 µm pitch GSG probe.
2. Tested in industry standard 2x2 mm, 6-lead MCLP package.
Absolute Maximum Ratings
Operating Temperature (ground)
RF Input Power
-40°C to 85°C
1.6W
Permanent damage may occur if any of these limits are exceeded.
Die Layout
Bonding Pad Position
(Dimensions in µm, Typical)
15dB
15dB
Fig 2. Die Layout
Critical Dimensions
Parameter
Die Thickness, µm
Die Width, µm
Die Length, µm
RF IN and RF OUT Bond Pad Size, µm
Values
100
725
700
110 x 75
Fig 3. Bonding Pad Positions
Ground Bond Pad Size, µm
110 x 150
Notes
A.
Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document.
B.
Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions.
C.
The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled
to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp
www.minicircuits.com
P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com
Mini-Circuits
®
Page 3 of 5
Fixed Attenuator Die
Assembly and Handling Procedure
1. Storage
Dice should be stored in a dry nitrogen purged desiccators or equivalent.
YAT-15-D+
2. ESD
MMIC Silicon Attenuator dice are susceptible to electrostatic and mechanical damage. Die are supplied in
antistatic protected material, which should be opened in clean room conditions at an appropriately grounded anti-static worksta
tion. Devices need careful handling using correctly designed collets, vacuum pickup tips or sharp antistatic tweezers to deter
ESD damage to dice.
3. Die Attach
The die mounting surface must be clean and flat. Using conductive silver filled epoxy, recommended epoxies are DieMat
DM6030HK-PT/H579 or Ablestik 84-1LMISR4. Apply sufficient epoxy to meet required epoxy bond line thickness, epoxy fillet
height and epoxy coverage around total die periphery. Parts shall be cured in a nitrogen filled atmosphere per manufacturer’s
cure condition. It is recommended to use antistatic die pick up tools only.
4. Wire Bonding
Bond pad openings in the surface passivation above the bond pads are provided to allow wire bonding to the dice gold bond
pads. Thermosonic bonding is used with minimized ultrasonic content. Bond force, time, ultrasonic power and temperature are
all critical parameters. Suggested wire is pure gold, 1 mil diameter. Bonds must be made from the bond pads on the die to
the package or substrate. All bond wires should be kept as short as low as reasonable to minimize performance degradation due
to undesirable series inductance.
Assembly Diagram
Recommended Wire Length, Typical
Wire
ALL WIRES
Wire Length (mm)
0.25
Wire Loop Height (mm)
0.15
Notes
A.
Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document.
B.
Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions.
C.
The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled
to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp
www.minicircuits.com
P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com
Mini-Circuits
®
Page 4 of 5
Fixed Attenuator Die
Additional Detailed Technical Information
additional information is available on our dash board.
YAT-15-D+
Data Table
Performance Data
Swept Graphs
S-Parameter (S2P Files) Data Set with port extension(.zip file)
Case Style
Die
Quantity, Package
Die Ordering and packaging
information
Small, Gel - Pak: 10,50,100 KGD*
Medium
†
, Partial wafer: KGD*<5K
Large
†
, Full Wafer
†
YAT-15-DG+
YAT-15-DP+
YAT-15-DF+
Available upon request contact sales representative
Refer to
AN-60-067
Environmental Ratings
ENV-80
*Known Good Dice (“KGD”) means that the dice in question have been subjected to Mini-Circuits DC test performance criteria and measurement
instructions and that the parametric data of such dice fall within a predefined range. While DC testing is not definitive, it does help to provide a higher
degree of confidence that dice are capable of meeting typical RF electrical parameters specified by Mini-Circuits.
ESD Rating**
Human Body Model (HBM): Class 1A (250 to 500V) in accordance with JESD22 - A114
Machine Model (MB): Class B (>200V) in accordance with JESD22-A115
** Tested in industry standard 2x2 mm, 6-lead MCLP package.
Additional Notes
A. Performance and quality attributes and conditions not expressly stated in this specification document are intended
to be excluded and do not form a part of this specification document.
B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s
applicable established test performance criteria and measurement instructions.
C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms
and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights and benefits
contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder,
please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp
D. Mini-Circuits does not warrant the accuracy or completeness of the information, text, graphics and other items
contained within this document and same are provided as an accommodation and on an “As is” basis, with all faults.
E. Purchasers of this part are solely responsible for proper storing, handling, assembly and processing of Known
Good Dice (including, without limitation, proper ESD preventative measures, die preparation, die attach, wire bond
ing and related assembly and test activities), and Mini-Circuits assumes no responsibility therefor or for environmental
effects on Known Good Dice.
F. Mini-Circuits and the Mini-Circuits logo are registered trademarks of Scientific Components Corporation d/b/a Mini-
Circuits. All other third-party trademarks are the property of their respective owners. A reference to any third-party
Notes
trademark does not constitute or imply any endorsement, affiliation, sponsorship, or recommendation by any such
A.
Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document.
third-party of
performance data contained in this
B.
Electrical specifications and
Mini-Circuits or its products.
specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions.
C.
The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled
to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp
www.minicircuits.com
P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com
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