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MX29F800BTC-12

Description
8M-BIT [1Mx8/512Kx16] CMOS FLASH MEMORY
Categorystorage    storage   
File Size703KB,42 Pages
ManufacturerMacronix
Websitehttp://www.macronix.com/en-us/Pages/default.aspx
Download Datasheet Parametric View All

MX29F800BTC-12 Overview

8M-BIT [1Mx8/512Kx16] CMOS FLASH MEMORY

MX29F800BTC-12 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMacronix
Parts packaging codeTSOP1
package instructionTSOP1, TSSOP48,.8,20
Contacts48
Reach Compliance Codeunknow
ECCN codeEAR99
Maximum access time120 ns
Spare memory width8
startup blockBOTTOM
command user interfaceYES
Data pollingYES
Durability100000 Write/Erase Cycles
JESD-30 codeR-PDSO-G48
JESD-609 codee0
length18.4 mm
memory density8388608 bi
Memory IC TypeFLASH
memory width16
Number of functions1
Number of departments/size1,2,1,15
Number of terminals48
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512KX16
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP1
Encapsulate equivalent codeTSSOP48,.8,20
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Programming voltage5 V
Certification statusNot Qualified
ready/busyYES
Maximum seat height1.2 mm
Department size16K,8K,32K,64K
Maximum standby current0.000005 A
Maximum slew rate0.05 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
switch bitYES
typeNOR TYPE
width12 mm
PRELIMINARY
MX29F800T/B
8M-BIT [1Mx8/512Kx16] CMOS FLASH MEMORY
FEATURES
• 1,048,576 x 8/524,288 x 16 switchable
• Single power supply operation
- 5.0V only operation for read, erase and program
operation
• Fast access time: 70/90/120ns
• Low power consumption
- 50mA maximum active current
- 0.2uA typical standby current
• Command register architecture
- Byte/word Programming (7us/12us typical)
- Sector Erase (Sector structure 16K-Bytex1,
8K-Bytex2, 32K-Bytex1, and 64K-Byte x15)
• Auto Erase (chip & sector) and Auto Program
- Automatically erase any combination of sectors with
Erase Suspend capability.
- Automatically program and verify data at specified
address
• Erase suspend/Erase Resume
- Suspends sector erase operation to read data from,
or program data to, another sector that is not being
erased, then resumes the erase.
• Status Reply
- Data polling & Toggle bit for detection of program and
erase operation completion.
Ready/Busy pin (RY/BY)
- Provides a hardware method of detecting program
or erase operation completion.
Sector protection
- Sector protect/chip unprotect for 5V/12V system.
- Hardware method to disable any combination of
sectors from program or erase operations
- Tempory sector unprotect allows code changes in
previously locked sectors.
100,000 minimum erase/program cycles
Latch-up protected to 100mA from -1V to VCC+1V
Boot Code Sector Architecture
- T = Top Boot Sector
- B = Bottom Boot Sector
Low VCC write inhibit is equal to or less than 3.2V
Package type:
- 44-pin SOP
- 48-pin TSOP
Compatibility with JEDEC standard
- Pinout and software compatible with single-power
supply Flash
GENERAL DESCRIPTION
The MX29F800T/B is a 8-mega bit Flash memory or-
ganized as 1M bytes of 8 bits or 512K words of 16 bits.
MXIC's Flash memories offer the most cost-effective and
reliable read/write non-volatile random access memory.
The MX29F800T/B is packaged in 44-pin SOP, 48-pin
TSOP. It is designed to be reprogrammed and erased
in system or in standard EPROM programmers.
The standard MX29F800T/B offers access time as fast
as 70ns, allowing operation of high-speed microproces-
sors without wait states. To eliminate bus contention,
the MX29F800T/B has separate chip enable (CE) and
output enable (OE) controls.
MXIC's Flash memories augment EPROM functionality
with in-circuit electrical erasure and programming. The
MX29F800T/B uses a command register to manage this
functionality. The command register allows for 100%
TTL level control inputs and fixed power supply levels
during erase and programming, while maintaining maxi-
mum EPROM compatibility.
MXIC Flash technology reliably stores memory contents
even after 100,000 erase and program cycles. The MXIC
cell is designed to optimize the erase and programming
mechanisms. In addition, the combination of advanced
tunnel oxide processing and low internal electric fields
for erase and program operations produces reliable cy-
cling. The MX29F800T/B uses a 5.0V±10% VCC sup-
ply to perform the High Reliability Erase and auto Pro-
gram/Erase algorithms.
The highest degree of latch-up protection is achieved
with MXIC's proprietary non-epi process. Latch-up pro-
tection is proved for stresses up to 100 milliamps on
address and data pin from -1V to VCC + 1V.
P/N:PM0578
REV. 1.7, JUL. 24, 2001
1

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