MX27L512
512K-BIT [64K x 8] CMOS EPROM
FEATURES
•
•
•
•
•
•
64K x 8 organization
Wide voltage range, 2.7V to 3.6V
+12.5V programming voltage
Fast access time: 120/150/200/250ns
Totally static operation
Completely TTL compatible
•
Operating current: 10mA@ 3.6V, 5MHz
•
Standby current: 10uA
•
Package type:
- 28 pin plastic DIP
- 32 pin PLCC
- 28 pin 8 x 13.4 mm TSOP(I)
GENERAL DESCRIPTION
The MX27L512 is a 3V only, 512K-bit, One-Time
Programmable Read Only Memory. It is organized as
64K words by 8 bits per word, operates from a single
+3volt supply, has a static standby mode, and features
fast single address location programming. All program-
ming signals are TTL levels, requiring a single pulse. For
programming outside from the system, existing EPROM
programmers may be used. The MX27L512 supports
intelligent fast programming algorithm which can result
in programming time of less than fifteen seconds.
This EPROM is packaged in industry standard 28 pin
dual-in-line packages , 32 lead PLCC, and 28 lead
TSOP(I) packages.
PIN CONFIGURATIONS
PDIP
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
Q0
Q1
Q2
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
VCC
A14
A13
A8
A9
A11
OE/VPP
A10
CE
Q7
Q6
Q5
Q4
Q3
BLOCK DIAGRAM
PLCC
VCC
A12
A15
A14
A13
NC
A7
A6
A5
A4
A3
A2
A1
A0
NC
Q0
5
4
1
32
CE
OE/VPP
A8
A9
A11
NC
CONTROL
LOGIC
OUTPUT
BUFFERS
Q0~Q7
30
29
9
MX27L512
25
OE/VPP
A10
CE
Q7
A0~A15
ADDRESS
INPUTS
13
14
Q1
Q2
GND
17
NC
Q3
Q4
21
20
Q5
Q6
.
.
.
.
.
.
.
.
MX27L512
Y-DECODER
X-DECODER
.
.
.
.
.
.
.
.
Y-SELECT
512K BIT
CELL
MAXTRIX
VCC
GND
8 x 13.4mm 28TSOP(I)
OE/VPP
A11
A9
A8
A13
A14
VCC
A15
A12
A7
A6
A5
A4
A3
22
23
24
25
26
27
28
1
2
3
4
5
6
7
21
20
19
18
17
16
15
14
13
12
11
10
9
8
A10
CE
Q7
Q6
Q5
Q4
Q3
GND
Q2
Q1
Q0
A0
A1
A2
PIN DESCRIPTION
SYMBOL
A0~A15
Q0~Q7
CE
OE/VPP
NC
VCC
GND
PIN NAME
Address Input
Data Input/Output
Chip Enable Input
Output Enable Input/Program Supply Voltage
No Internal Connection
Power Supply Pin
Ground Pin
MX27L512
P/N: PM0256
1
REV. 2.6, AUG. 26, 2003
MX27L512
FUNCTIONAL DESCRIPTION
THE PROGRAMMING OF THE MX27L512
When the MX27L512 is delivered, or it is erased, the
chip has all 512K bits in the "ONE", or HIGH state.
"ZEROs" are loaded into the MX27L512 through the
procedure of programming.
For programming, the data to be programmed is applied
with 8 bits in parallel to the data pins.
Vcc must be applied simultaneously or before Vpp, and
removed simultaneously or after Vpp. When
programming an MXIC EPROM, a 0.1uF capacitor is
required across Vpp and ground to suppress spurious
voltage transients which may damage the device.
AUTO IDENTIFY MODE
The auto identify mode allows the reading out of a binary
code from an EPROM that will identify its manufacturer
and device type. This mode is intended for use by
programming equipment for the purpose of
automatically matching the device to be programmed
with its corresponding programming algorithm. This
mode is functional in the 25°C
±
5°C ambient
temperature range that is required when programming
the MX27L512.
To activate this mode, the programming equipment
must force 12.0
±
0.5(VH) on address line A9 of the
device. Two identifier bytes may then be sequenced
from the device outputs by toggling address line A0 from
VIL to VIH. All other address lines must be held at VIL
during auto identify mode.
Byte 0 ( A0 = VIL) represents the manufacturer code,
and byte 1 (A0 = VIH), the device identifier code. For the
MX27L512, these two identifier bytes are given in the
Mode Select Table. All identifiers for manufacturer and
device codes will possess odd parity, with the MSB (Q7)
defined as the parity bit.
FAST PROGRAMMING
The device is set up in the fast programming mode when
the programming voltage OE/VPP = 12.75V is applied,
with VCC = 6.25 V, (Algorithm is shown in Figure 1). The
programming is achieved by applying a single TTL low
level 100us pulse to the CE input after addresses and
data line are stable. If the data is not verified, an
additional pulse is applied for a maximum of 25 pulses.
This process is repeated while sequencing through each
address of the device. When the programming mode is
completed, the data in all address is verified at VCC = 5V
±
10%.
READ MODE
The MX27L512 has two control functions, both of which
must be logically satisfied in order to obtain data at the
outputs. Chip Enable (CE) is the power control and
should be used for device selection. Output Enable
(OE) is the output control and should be used to gate
data to the output pins, independent of device selection.
Assuming that addresses are stable, address access
time (tACC) is equal to the delay from CE to output (tCE).
Data is available at the outputs tOE after the falling edge
of OE, assuming that CE has been LOW and addresses
have been stable for at least tACC - tOE.
PROGRAM INHIBIT MODE
Programming of multiple MX27L512s in parallel with
different data is also easily accomplished by using the
Program Inhibit Mode. Except for CE and OE, all like
inputs of the parallel MX27L512 may be common. A TTL
low-level program pulse applied to an MX27L512 CE
input with OE/VPP = 12.5
±
0.5V will program that
MX27L512. A high-level CE input inhibits the other
MX27L512s from being programmed.
STANDBY MODE
The MX27L512 has a CMOS standby mode which
reduces the maximum VCC current to 10 uA. It is placed
in CMOS standby when CE is at VCC
±
0.3 V. The
MX27L512 also has a TTL-standby mode which
reduces the maximum VCC current to 0.25 mA. It is
placed in TTL-standby when CE is at VIH. When in
standby mode, the outputs are in a high-impedance
state, independent of the OE input.
PROGRAM VERIFY MODE
Verification should be performed on the programmed
bits to determine that they were correctly programmed.
The verification should be performed with OE/VPP and
CE, at VIL. Data should be verified tDV after the falling
edge of CE.
P/N:PM0256
2
REV. 2.6, AUG. 26, 2003
MX27L512
TWO-LINE OUTPUT CONTROL FUNCTION
To accommodate multiple memory connections, a two-
line control function is provided to allow for:
1. Low memory power dissipation,
2. Assurance that output bus contention will not
occur.
It is recommended that CE be decoded and used as the
primary device-selecting function, while OE be made a
common connection to all devices in the array and
connected to the READ line from the system control bus.
This assures that all deselected memory devices are in
their low-power standby mode and that the output pins
are only active when data is desired from a particular
memory device.
SYSTEM CONSIDERATIONS
During the switch between active and standby
conditions, transient current peaks are produced on the
rising and falling edges of Chip Enable. The magnitude
of these transient current peaks is dependent on the
output capacitance loading of the device. At a minimum,
a 0.1 uF ceramic capacitor (high frequency, low inherent
inductance) should be used on each device between
VCC and GND to minimize transient effects. In addition,
to overcome the voltage drop caused by the inductive
effects of the printed circuit board traces on EPROM
arrays, a 4.7 uF bulk electrolytic capacitor should be
used between VCC and GND for each eight devices.
The location of the capacitor should be close to where
the power supply is connected to the array.
MODE SELECT TABLE
PINS
MODE
Read
Output Disable
Standby (TTL)
Standby (CMOS)
Program
Program Verify
Program Inhibit
Manufacturer Code(3)
Device Code(3)
CE
VIL
VIL
VIH
VCC±0.3V
VIL
VIL
VIH
VIL
VIL
OE/VPP
VIL
VIH
X
X
VPP
VIL
VPP
VIL
VIL
A0
X
X
X
X
X
X
X
VIL
VIH
A9
X
X
X
X
X
X
X
VH
VH
OUTPUTS
DOUT
High Z
High Z
High Z
DIN
DOUT
High Z
C2H
91H
NOTES:
1. VH = 12.0 V
±
0.5 V
2. X = Either VIH or VIL
3. A1 - A8 = A10 - A15 = VIL(For auto select)
4. See DC Programming Characteristics for VPP voltage during
programming.
P/N:PM0256
3
REV. 2.6, AUG. 26, 2003
Discrete Device
京公网安备 11010802033920号
EEWORLD
