RF/Microwave Frequency Multiplier
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | LSC/CSI |
| package instruction | DIP16,.3 |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| JESD-609 code | e0 |
| Installation features | THROUGH HOLE MOUNT |
| Number of terminals | 16 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | CERAMIC |
| Encapsulate equivalent code | DIP16,.3 |
| power supply | 5 V |
| Maximum slew rate | 30 mA |
| surface mount | NO |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Base Number Matches | 1 |
| PL1TCA | PL1GLA | PL1TLA | PL3GLA | PL3TLA | PL4GEA | PL4TLA | PL2GLA | PL2TLA | |
|---|---|---|---|---|---|---|---|---|---|
| Description | RF/Microwave Frequency Multiplier | RF/Microwave Frequency Multiplier | RF/Microwave Frequency Multiplier | RF/Microwave Frequency Multiplier | RF/Microwave Frequency Multiplier | RF/Microwave Frequency Multiplier | RF/Microwave Frequency Multiplier | RF/Microwave Frequency Multiplier | RF/Microwave Frequency Multiplier |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | LSC/CSI | LSC/CSI | LSC/CSI | LSC/CSI | LSC/CSI | LSC/CSI | LSC/CSI | LSC/CSI | LSC/CSI |
| package instruction | DIP16,.3 | GWDIP16,.3 | DIP16,.3 | GWDIP16,.3 | DIP16,.3 | GWDIP16,.3 | DIP16,.3 | GWDIP16,.3 | DIP16,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Installation features | THROUGH HOLE MOUNT | SURFACE MOUNT | THROUGH HOLE MOUNT | SURFACE MOUNT | THROUGH HOLE MOUNT | SURFACE MOUNT | THROUGH HOLE MOUNT | SURFACE MOUNT | THROUGH HOLE MOUNT |
| Number of terminals | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| Maximum operating temperature | 70 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | - | -40 °C | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| Encapsulate equivalent code | DIP16,.3 | GWDIP16,.3 | DIP16,.3 | GWDIP16,.3 | DIP16,.3 | GWDIP16,.3 | DIP16,.3 | GWDIP16,.3 | DIP16,.3 |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Maximum slew rate | 30 mA | 30 mA | 30 mA | 30 mA | 30 mA | 30 mA | 30 mA | 30 mA | 30 mA |
| surface mount | NO | YES | NO | YES | NO | YES | NO | YES | NO |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Is Samacsys | N | N | N | N | N | N | N | - | - |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | - |