70V3569S5BCGI8 datasheet, PDF - EEWORLD Datasheet

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70V3569S5BCGI8: DescriptionMulti-Port SRAM, 16KX36, 5ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM, 1 MM PITCH, GREEN, BGA-256; Categorystorage storage; File Size181KB，17 Pages; ManufacturerIDT (Integrated Device Technology); Environmental Compliance

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70V3569S5BCGI8 Overview

Multi-Port SRAM, 16KX36, 5ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM, 1 MM PITCH, GREEN, BGA-256

70V3569S5BCGI8 Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	IDT (Integrated Device Technology)
package instruction	LBGA, BGA256,16X16,40
Reach Compliance Code	compliant
Is Samacsys	N
Maximum access time	5 ns
Other features	PIPELINED OUTPUT MODE, SELF TIMED WRITE CYCLE
Maximum clock frequency (fCLK)	100 MHz
I/O type	COMMON
JESD-30 code	S-PBGA-B256
JESD-609 code	e1
length	17 mm
memory density	589824 bit
Memory IC Type	MULTI-PORT SRAM
memory width	36
Humidity sensitivity level	3
Number of functions	1
Number of ports	2
Number of terminals	256
word count	16384 words
character code	16000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	16KX36
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Encapsulate equivalent code	BGA256,16X16,40
Package shape	SQUARE
Package form	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
power supply	2.5/3.3,3.3 V
Certification status	Not Qualified
Maximum seat height	1.7 mm
Maximum standby current	0.03 A
Minimum standby current	3.15 V
Maximum slew rate	0.415 mA
Maximum supply voltage (Vsup)	3.45 V
Minimum supply voltage (Vsup)	3.15 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
width	17 mm
Base Number Matches	1

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HIGH-SPEED 3.3V 16K x 36

SYNCHRONOUS PIPELINED

DUAL-PORT STATIC RAM

WITH 3.3V OR 2.5V INTERFACE

Features:

◆

IDT70V3569S

◆

True Dual-Port memory cells which allow simultaneous

access of the same memory location

High-speed clock to data access

– Commercial: 4.2/5/6ns (max.)

– Industrial: 5ns (max)

Pipelined output mode

Counter enable and reset features

Dual chip enables allow for depth expansion without

additional logic

Full synchronous operation on both ports

– 7.5ns cycle time, 133MHz operation (9.6 Gbps bandwidth)

– Fast 4.2ns clock to data out

– 1.8ns setup to clock and 0.7ns hold on all control, data, and

address inputs @ 133MHz

◆

– Data input, address, byte enable and control registers

– Self-timed write allows fast cycle time

Separate byte controls for multiplexed bus and bus

matching compatibility

LVTTL- compatible, single 3.3V (±150mV) power supply for

core

LVTTL- compatible, selectable 3.3V (±150mV)/2.5V (±125mV)

power supply for I/Os and control signals on each port

Industrial temperature range (-40°C to +85°C) is

available for selected speeds

Available in a 208-pin Plastic Quad Flatpack (PQFP),

208-ball fine-pitch Ball Grid Array, and 256-pin Ball

Grid Array

Green parts availble, see ordering instructions

Functional Block Diagram

R/W

B B

3 3

L R

2 1

R/W

Dout0-8_L

Dout9-17_L

Dout18-26_L

Dout27-35_L

Dout0-8_R

Dout9-17_R

Dout18-26_R

Dout27-35_R

16K x 36

MEMORY

ARRAY

I/O

- I/O

35L

Din_L

Din_R

I/O

- I/O

35R

CLK

13L

CNTRST

ADS

CNTEN

CLK

Counter/

Address

Reg.

13R

ADDR_L

ADDR_R

Counter/

Address

Reg.

CNTRST

ADS

CNTEN

4831 tbl 01

OCTOBER 2014

DSC 4831/13

70V3569S5BCGI8 Related Products

	70V3569S5BCGI8	70V3569S5DRG8	70V3569S4DRG8	70V3569S5BFGI8	70V3569S5DRGI8	70V3569S6DRG8	70V3569S5BCG8
Description	Multi-Port SRAM, 16KX36, 5ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM, 1 MM PITCH, GREEN, BGA-256	Dual-Port SRAM, 16KX36, 5ns, CMOS, PQFP208, 28 X 28 MM, 3.50 MM, GREEN, PLASTIC, QFP-208	Dual-Port SRAM, 16KX36, 4.2ns, CMOS, PQFP208, 28 X 28 MM, 3.50 MM, GREEN, PLASTIC, QFP-208	Multi-Port SRAM, 16KX36, 5ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM, 0.80 MM PITCH, GREEN, FPBGA-208	Dual-Port SRAM, 16KX36, 5ns, CMOS, PQFP208, 28 X 28 MM, 3.50 MM, GREEN, PLASTIC, QFP-208	Dual-Port SRAM, 16KX36, 6ns, CMOS, PQFP208, 28 X 28 MM, 3.50 MM, GREEN, PLASTIC, QFP-208	Multi-Port SRAM, 16KX36, 5ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM, 1 MM PITCH, GREEN, BGA-256
package instruction	LBGA, BGA256,16X16,40	FQFP,	FQFP,	LFBGA, BGA208,17X17,32	FQFP,	FQFP,	LBGA, BGA256,16X16,40
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant
Maximum access time	5 ns	5 ns	4.2 ns	5 ns	5 ns	6 ns	5 ns
Other features	PIPELINED OUTPUT MODE, SELF TIMED WRITE CYCLE	PIPELINED OUTPUT MODE, SELF TIMED WRITE CYCLE	PIPELINED OUTPUT MODE, SELF TIMED WRITE CYCLE	PIPELINED OUTPUT MODE, SELF TIMED WRITE CYCLE	PIPELINED OUTPUT MODE, SELF TIMED WRITE CYCLE	PIPELINED OUTPUT MODE, SELF TIMED WRITE CYCLE	PIPELINED OUTPUT MODE, SELF TIMED WRITE CYCLE
JESD-30 code	S-PBGA-B256	S-PQFP-G208	S-PQFP-G208	S-PBGA-B208	S-PQFP-G208	S-PQFP-G208	S-PBGA-B256
JESD-609 code	e1	e3	e3	e1	e3	e3	e1
length	17 mm	28 mm	28 mm	15 mm	28 mm	28 mm	17 mm
memory density	589824 bit	589824 bit	589824 bit	589824 bit	589824 bit	589824 bit	589824 bit
Memory IC Type	MULTI-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	MULTI-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	MULTI-PORT SRAM
memory width	36	36	36	36	36	36	36
Number of functions	1	1	1	1	1	1	1
Number of terminals	256	208	208	208	208	208	256
word count	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words
character code	16000	16000	16000	16000	16000	16000	16000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	70 °C	70 °C	85 °C	85 °C	70 °C	70 °C
organize	16KX36	16KX36	16KX36	16KX36	16KX36	16KX36	16KX36
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LBGA	FQFP	FQFP	LFBGA	FQFP	FQFP	LBGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY, LOW PROFILE	FLATPACK, FINE PITCH	FLATPACK, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	FLATPACK, FINE PITCH	FLATPACK, FINE PITCH	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Maximum seat height	1.7 mm	4.1 mm	4.1 mm	1.7 mm	4.1 mm	4.1 mm	1.7 mm
Maximum supply voltage (Vsup)	3.45 V	3.45 V	3.45 V	3.45 V	3.45 V	3.45 V	3.45 V
Minimum supply voltage (Vsup)	3.15 V	3.15 V	3.15 V	3.15 V	3.15 V	3.15 V	3.15 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)	MATTE TIN	MATTE TIN	Tin/Silver/Copper (Sn/Ag/Cu)	MATTE TIN	MATTE TIN	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL	GULL WING	GULL WING	BALL	GULL WING	GULL WING	BALL
Terminal pitch	1 mm	0.5 mm	0.5 mm	0.8 mm	0.5 mm	0.5 mm	1 mm
Terminal location	BOTTOM	QUAD	QUAD	BOTTOM	QUAD	QUAD	BOTTOM
width	17 mm	28 mm	28 mm	15 mm	28 mm	28 mm	17 mm
Maker	IDT (Integrated Device Technology)	-	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)

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