............................................................................................................................... -40°C to +85°C
Storage Temperature
..................................................................................................................................... -65°C to +125°C
Soldering Temperature (less than 10 seconds) ................................................................................................................... 300°C
Supply Voltage ............................................................................................................................................................. 0 to 6.5V
Voltage on Any Pin ....................................................................................................................................... -0.3V to V
CC
+0.3V
ESD Voltage (JEDEC method) .......................................................................................................................................... 2,000V
NOTE: These are STRESS ratings only. Appropriate conditions for operating these devices are given elsewhere in this specification. Stresses
beyond those listed here may permanently damage the part. Prolonged exposure to maximum ratings may affect device reliability.
I would like to ask, when doing FPGA design, the functions and timing simulations of each underlying submodule are correct, but the top-level module simulation is wrong (that is, the individual submod...
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